JP4408607B2 - スクライブ方法及びスクライブ装置 - Google Patents

スクライブ方法及びスクライブ装置 Download PDF

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Publication number
JP4408607B2
JP4408607B2 JP2002170520A JP2002170520A JP4408607B2 JP 4408607 B2 JP4408607 B2 JP 4408607B2 JP 2002170520 A JP2002170520 A JP 2002170520A JP 2002170520 A JP2002170520 A JP 2002170520A JP 4408607 B2 JP4408607 B2 JP 4408607B2
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Japan
Prior art keywords
cooling
glass substrate
laser beam
material substrate
brittle material
Prior art date
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Expired - Fee Related
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JP2002170520A
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English (en)
Japanese (ja)
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JP2004010466A (ja
JP2004010466A5 (enExample
Inventor
修一 井上
真人 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2002170520A priority Critical patent/JP4408607B2/ja
Priority to TW092113548A priority patent/TW200307586A/zh
Priority to KR1020030034598A priority patent/KR100925287B1/ko
Priority to CNB031412890A priority patent/CN100431108C/zh
Publication of JP2004010466A publication Critical patent/JP2004010466A/ja
Publication of JP2004010466A5 publication Critical patent/JP2004010466A5/ja
Application granted granted Critical
Publication of JP4408607B2 publication Critical patent/JP4408607B2/ja
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Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2002170520A 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置 Expired - Fee Related JP4408607B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002170520A JP4408607B2 (ja) 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置
TW092113548A TW200307586A (en) 2002-06-11 2003-05-20 Scribing method and scribing device
KR1020030034598A KR100925287B1 (ko) 2002-06-11 2003-05-30 스크라이브 방법 및 스크라이브 장치
CNB031412890A CN100431108C (zh) 2002-06-11 2003-06-11 划线方法和划线装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002170520A JP4408607B2 (ja) 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置

Publications (3)

Publication Number Publication Date
JP2004010466A JP2004010466A (ja) 2004-01-15
JP2004010466A5 JP2004010466A5 (enExample) 2005-09-29
JP4408607B2 true JP4408607B2 (ja) 2010-02-03

Family

ID=29996454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002170520A Expired - Fee Related JP4408607B2 (ja) 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置

Country Status (4)

Country Link
JP (1) JP4408607B2 (enExample)
KR (1) KR100925287B1 (enExample)
CN (1) CN100431108C (enExample)
TW (1) TW200307586A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
KR100602623B1 (ko) * 2004-05-31 2006-07-19 윤종진 덩어리 고무의 절단장치
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
KR101096733B1 (ko) 2004-12-27 2011-12-21 엘지디스플레이 주식회사 기판의 절단장치 및 이를 이용한 기판의 절단방법
US7423818B2 (en) * 2005-07-15 2008-09-09 Electro Scientific Industries, Inc. Method of suppressing distortion of a working laser beam of a laser link processing system
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
JP5235987B2 (ja) * 2007-04-30 2013-07-10 コーニング インコーポレイテッド 移動中の帯状ガラスに切断線を設ける装置、システム及び方法
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US8051679B2 (en) * 2008-09-29 2011-11-08 Corning Incorporated Laser separation of glass sheets
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
JP5202595B2 (ja) 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
TW201231421A (en) * 2010-11-30 2012-08-01 Corning Inc Methods for separating a sheet of brittle material
US8978528B2 (en) 2011-08-05 2015-03-17 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for cutting panel substrate and substrate cutting apparatus
CN102390923A (zh) * 2011-08-05 2012-03-28 深圳市华星光电技术有限公司 面板基板切割方法及基板切割装置
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
JP5879106B2 (ja) * 2011-11-25 2016-03-08 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
JP6268805B2 (ja) * 2013-08-13 2018-01-31 日本電気硝子株式会社 ガラス板の製造方法
TW201628751A (zh) * 2014-11-20 2016-08-16 康寧公司 彈性玻璃基板之回饋控制的雷射切割
EP3463770B1 (en) * 2016-05-31 2021-04-14 Faurecia (China) Holding Co., Ltd. A cold knife system and a method for forming a cold knife weakening line
CN107336369B (zh) * 2017-06-20 2019-01-04 杭州师范大学钱江学院 玻璃瓶分割回收环保装置
CN108032354B (zh) * 2017-10-25 2020-03-17 苏州三鑫时代新材料股份有限公司 一种光扩散板的切边自动分离方法及自动分离装置
CN113751789B (zh) * 2021-09-29 2022-11-11 南通东海机床制造集团有限公司 一种剪板机剪切快速定位装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
AU1790001A (en) * 1999-11-24 2001-06-04 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치

Also Published As

Publication number Publication date
JP2004010466A (ja) 2004-01-15
KR20030095233A (ko) 2003-12-18
CN100431108C (zh) 2008-11-05
CN1468695A (zh) 2004-01-21
TW200307586A (en) 2003-12-16
TWI299293B (enExample) 2008-08-01
KR100925287B1 (ko) 2009-11-05

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