CN100431108C - 划线方法和划线装置 - Google Patents

划线方法和划线装置 Download PDF

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Publication number
CN100431108C
CN100431108C CNB031412890A CN03141289A CN100431108C CN 100431108 C CN100431108 C CN 100431108C CN B031412890 A CNB031412890 A CN B031412890A CN 03141289 A CN03141289 A CN 03141289A CN 100431108 C CN100431108 C CN 100431108C
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CN
China
Prior art keywords
glass substrate
brittle substrate
cooling
laser beam
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031412890A
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English (en)
Chinese (zh)
Other versions
CN1468695A (zh
Inventor
井上修一
松本真人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN1468695A publication Critical patent/CN1468695A/zh
Application granted granted Critical
Publication of CN100431108C publication Critical patent/CN100431108C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CNB031412890A 2002-06-11 2003-06-11 划线方法和划线装置 Expired - Fee Related CN100431108C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP170520/02 2002-06-11
JP170520/2002 2002-06-11
JP2002170520A JP4408607B2 (ja) 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置

Publications (2)

Publication Number Publication Date
CN1468695A CN1468695A (zh) 2004-01-21
CN100431108C true CN100431108C (zh) 2008-11-05

Family

ID=29996454

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031412890A Expired - Fee Related CN100431108C (zh) 2002-06-11 2003-06-11 划线方法和划线装置

Country Status (4)

Country Link
JP (1) JP4408607B2 (enExample)
KR (1) KR100925287B1 (enExample)
CN (1) CN100431108C (enExample)
TW (1) TW200307586A (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
KR100602623B1 (ko) * 2004-05-31 2006-07-19 윤종진 덩어리 고무의 절단장치
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
KR101096733B1 (ko) 2004-12-27 2011-12-21 엘지디스플레이 주식회사 기판의 절단장치 및 이를 이용한 기판의 절단방법
US7423818B2 (en) * 2005-07-15 2008-09-09 Electro Scientific Industries, Inc. Method of suppressing distortion of a working laser beam of a laser link processing system
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
JP5235987B2 (ja) * 2007-04-30 2013-07-10 コーニング インコーポレイテッド 移動中の帯状ガラスに切断線を設ける装置、システム及び方法
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US8051679B2 (en) * 2008-09-29 2011-11-08 Corning Incorporated Laser separation of glass sheets
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (zh) 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
JP5202595B2 (ja) 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
TW201231421A (en) * 2010-11-30 2012-08-01 Corning Inc Methods for separating a sheet of brittle material
US8978528B2 (en) 2011-08-05 2015-03-17 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for cutting panel substrate and substrate cutting apparatus
CN102390923A (zh) * 2011-08-05 2012-03-28 深圳市华星光电技术有限公司 面板基板切割方法及基板切割装置
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
JP5879106B2 (ja) * 2011-11-25 2016-03-08 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
JP6268805B2 (ja) * 2013-08-13 2018-01-31 日本電気硝子株式会社 ガラス板の製造方法
TW201628751A (zh) * 2014-11-20 2016-08-16 康寧公司 彈性玻璃基板之回饋控制的雷射切割
US20200324429A1 (en) * 2016-05-31 2020-10-15 Faurecia (China) Holding Co., Ltd. Release agent supply device for cold knife weakening and a cold knife system comprising such a device
CN107336369B (zh) * 2017-06-20 2019-01-04 杭州师范大学钱江学院 玻璃瓶分割回收环保装置
CN108032354B (zh) * 2017-10-25 2020-03-17 苏州三鑫时代新材料股份有限公司 一种光扩散板的切边自动分离方法及自动分离装置
CN113751789B (zh) * 2021-09-29 2022-11-11 南通东海机床制造集团有限公司 一种剪板机剪切快速定位装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1203202A (zh) * 1997-04-14 1998-12-30 肖特玻璃制造厂 分割易碎的平面工件、特别是平面玻璃制品的方法和装置
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
CN1349875A (zh) * 2000-10-21 2002-05-22 三星电子株式会社 用激光束切割非金属衬底的方法和装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1790001A (en) * 1999-11-24 2001-06-04 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1203202A (zh) * 1997-04-14 1998-12-30 肖特玻璃制造厂 分割易碎的平面工件、特别是平面玻璃制品的方法和装置
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
CN1349875A (zh) * 2000-10-21 2002-05-22 三星电子株式会社 用激光束切割非金属衬底的方法和装置

Also Published As

Publication number Publication date
TWI299293B (enExample) 2008-08-01
KR20030095233A (ko) 2003-12-18
CN1468695A (zh) 2004-01-21
JP2004010466A (ja) 2004-01-15
JP4408607B2 (ja) 2010-02-03
KR100925287B1 (ko) 2009-11-05
TW200307586A (en) 2003-12-16

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Granted publication date: 20081105

Termination date: 20130611