KR100925287B1 - 스크라이브 방법 및 스크라이브 장치 - Google Patents

스크라이브 방법 및 스크라이브 장치 Download PDF

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Publication number
KR100925287B1
KR100925287B1 KR1020030034598A KR20030034598A KR100925287B1 KR 100925287 B1 KR100925287 B1 KR 100925287B1 KR 1020030034598 A KR1020030034598 A KR 1020030034598A KR 20030034598 A KR20030034598 A KR 20030034598A KR 100925287 B1 KR100925287 B1 KR 100925287B1
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South Korea
Prior art keywords
glass substrate
cooling
scribe
laser spot
glass
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Expired - Fee Related
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KR1020030034598A
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English (en)
Korean (ko)
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KR20030095233A (ko
Inventor
이노우에슈이치
마쓰모토마사토
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020030034598A 2002-06-11 2003-05-30 스크라이브 방법 및 스크라이브 장치 Expired - Fee Related KR100925287B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00170520 2002-06-11
JP2002170520A JP4408607B2 (ja) 2002-06-11 2002-06-11 スクライブ方法及びスクライブ装置

Publications (2)

Publication Number Publication Date
KR20030095233A KR20030095233A (ko) 2003-12-18
KR100925287B1 true KR100925287B1 (ko) 2009-11-05

Family

ID=29996454

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030034598A Expired - Fee Related KR100925287B1 (ko) 2002-06-11 2003-05-30 스크라이브 방법 및 스크라이브 장치

Country Status (4)

Country Link
JP (1) JP4408607B2 (enExample)
KR (1) KR100925287B1 (enExample)
CN (1) CN100431108C (enExample)
TW (1) TW200307586A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101197109B1 (ko) 2010-09-10 2012-11-07 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저 할단 장치

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JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
US20080286943A1 (en) * 2004-05-20 2008-11-20 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard Cutting Method, Motherboard Scribing Apparatus, Program and Recording Medium
KR100602623B1 (ko) * 2004-05-31 2006-07-19 윤종진 덩어리 고무의 절단장치
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
KR101096733B1 (ko) 2004-12-27 2011-12-21 엘지디스플레이 주식회사 기판의 절단장치 및 이를 이용한 기판의 절단방법
US7423818B2 (en) * 2005-07-15 2008-09-09 Electro Scientific Industries, Inc. Method of suppressing distortion of a working laser beam of a laser link processing system
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置
JP4251203B2 (ja) * 2006-08-29 2009-04-08 セイコーエプソン株式会社 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法
JP5235987B2 (ja) * 2007-04-30 2013-07-10 コーニング インコーポレイテッド 移動中の帯状ガラスに切断線を設ける装置、システム及び方法
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US8051679B2 (en) * 2008-09-29 2011-11-08 Corning Incorporated Laser separation of glass sheets
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (zh) 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
TW201231421A (en) * 2010-11-30 2012-08-01 Corning Inc Methods for separating a sheet of brittle material
US8978528B2 (en) 2011-08-05 2015-03-17 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for cutting panel substrate and substrate cutting apparatus
CN102390923A (zh) * 2011-08-05 2012-03-28 深圳市华星光电技术有限公司 面板基板切割方法及基板切割装置
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
JP5879106B2 (ja) * 2011-11-25 2016-03-08 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
JP6268805B2 (ja) * 2013-08-13 2018-01-31 日本電気硝子株式会社 ガラス板の製造方法
TW201628751A (zh) * 2014-11-20 2016-08-16 康寧公司 彈性玻璃基板之回饋控制的雷射切割
US20200324429A1 (en) * 2016-05-31 2020-10-15 Faurecia (China) Holding Co., Ltd. Release agent supply device for cold knife weakening and a cold knife system comprising such a device
CN107336369B (zh) * 2017-06-20 2019-01-04 杭州师范大学钱江学院 玻璃瓶分割回收环保装置
CN108032354B (zh) * 2017-10-25 2020-03-17 苏州三鑫时代新材料股份有限公司 一种光扩散板的切边自动分离方法及自动分离装置
CN113751789B (zh) * 2021-09-29 2022-11-11 南通东海机床制造集团有限公司 一种剪板机剪切快速定位装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001038039A1 (en) * 1999-11-24 2001-05-31 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials

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Publication number Priority date Publication date Assignee Title
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
KR100673073B1 (ko) * 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001038039A1 (en) * 1999-11-24 2001-05-31 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101197109B1 (ko) 2010-09-10 2012-11-07 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저 할단 장치

Also Published As

Publication number Publication date
CN100431108C (zh) 2008-11-05
TWI299293B (enExample) 2008-08-01
KR20030095233A (ko) 2003-12-18
CN1468695A (zh) 2004-01-21
JP2004010466A (ja) 2004-01-15
JP4408607B2 (ja) 2010-02-03
TW200307586A (en) 2003-12-16

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