TWI294408B - - Google Patents

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Publication number
TWI294408B
TWI294408B TW089110341A TW89110341A TWI294408B TW I294408 B TWI294408 B TW I294408B TW 089110341 A TW089110341 A TW 089110341A TW 89110341 A TW89110341 A TW 89110341A TW I294408 B TWI294408 B TW I294408B
Authority
TW
Taiwan
Prior art keywords
abrasive
cerium oxide
particles
oxide particles
polishing
Prior art date
Application number
TW089110341A
Other languages
English (en)
Chinese (zh)
Inventor
Atsushi Sugimoto
Masato Yoshida
Keizo Hirai
Toranosuke Ashizawa
Yuuto Ootuki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of TWI294408B publication Critical patent/TWI294408B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/60—Compounds characterised by their crystallite size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/14—Pore volume

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW089110341A 1999-05-28 2000-05-29 TWI294408B (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15004999 1999-05-28
JP24339899 1999-08-30

Publications (1)

Publication Number Publication Date
TWI294408B true TWI294408B (https=) 2008-03-11

Family

ID=26479767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089110341A TWI294408B (https=) 1999-05-28 2000-05-29

Country Status (6)

Country Link
US (1) US6615499B1 (https=)
EP (4) EP2394961A3 (https=)
JP (2) JP4221903B2 (https=)
KR (2) KR100515782B1 (https=)
TW (1) TWI294408B (https=)
WO (1) WO2000073211A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558802B (zh) * 2013-08-09 2016-11-21 Konica Minolta Inc Abrasive and abrasive slurry
CN111117566A (zh) * 2018-10-31 2020-05-08 信越化学工业株式会社 合成石英玻璃基板的研磨用研磨粒子及其制造方法，与合成石英玻璃基板的研磨方法
CN118061073A (zh) * 2020-06-19 2024-05-24 Sk恩普士有限公司 研磨片、其制造方法以及利用其的半导体器件的制造方法

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US20040198191A1 (en) * 2001-11-16 2004-10-07 Naoki Bessho Cerium-based polish and cerium-based polish slurry
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US7198550B2 (en) * 2002-02-08 2007-04-03 3M Innovative Properties Company Process for finish-abrading optical-fiber-connector end-surface
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TWI332981B (en) * 2003-07-17 2010-11-11 Showa Denko Kk Method for producing cerium oxide abrasives and cerium oxide abrasives obtained by the method
EP1646857B1 (en) * 2003-07-23 2018-04-11 Engis Corporation Apparatus for measuring the crushing strength of micron superabrasives
CN1667026B (zh) 2004-03-12 2011-11-30 K.C.科技股份有限公司 抛光浆料及其制备方法和基板的抛光方法
TWI283008B (en) * 2004-05-11 2007-06-21 K C Tech Co Ltd Slurry for CMP and method of producing the same
KR100630691B1 (ko) * 2004-07-15 2006-10-02 삼성전자주식회사 산화세륨 연마 입자 및 그 제조 방법과 ｃｍｐ용 슬러리조성물 및 그 제조 방법과 이들을 이용한 기판 연마 방법
JP4951218B2 (ja) * 2004-07-15 2012-06-13 三星電子株式会社 酸化セリウム研磨粒子及び該研磨粒子を含む組成物
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KR100574984B1 (ko) * 2004-08-16 2006-05-02 삼성전자주식회사 산화세륨 연마 입자 및 그 제조 방법과 ｃｍｐ용 슬러리조성물 및 그 제조 방법과 이들을 이용한 기판 연마 방법
US20070254562A1 (en) * 2004-08-30 2007-11-01 Showa Denko K.K. Magnetic Disk Substrate and Production Method of Magnetic Disk
JPWO2006030595A1 (ja) * 2004-09-14 2008-05-08 日立化成工業株式会社 Ｃｍｐ用研磨スラリー
TWI323741B (en) * 2004-12-16 2010-04-21 K C Tech Co Ltd Abrasive particles, polishing slurry, and producing method thereof
KR100641348B1 (ko) * 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
KR100743457B1 (ko) 2005-08-23 2007-07-30 한화석유화학 주식회사 반도체 얕은 트렌치소자 연마용 산화세륨 초미립자 및 이의슬러리 제조방법
KR100725699B1 (ko) * 2005-09-02 2007-06-07 주식회사 엘지화학 일액형 ｃｍｐ 슬러리용 산화 세륨 분말, 그 제조방법,이를 포함하는 일액형 ｃｍｐ 슬러리 조성물, 및 상기슬러리를 사용하는 얕은 트랜치 소자 분리방법
CN101039876B (zh) * 2005-10-14 2011-07-27 Lg化学株式会社 用于化学机械抛光的二氧化铈粉末的制备方法及使用该粉末制备化学机械抛光浆料的方法
JP2009113993A (ja) * 2006-03-03 2009-05-28 Hitachi Chem Co Ltd 金属酸化物粒子、これを含む研磨材、この研磨材を用いた基板の研磨方法及び研磨して得られる半導体装置の製造方法
JPWO2007126030A1 (ja) * 2006-04-27 2009-09-10 旭硝子株式会社 酸化物結晶微粒子及び該微粒子を含む研磨用スラリー
KR100819741B1 (ko) * 2006-06-16 2008-04-07 주식회사 엘 앤 에프 리튬 이차 전지용 양극 활물질, 이의 제조방법 및 이를포함하는 리튬 이차 전지
WO2008023858A1 (en) * 2006-08-25 2008-02-28 Hanwha Chemical Corporation Manufacturing methods of fine cerium oxide particles and its slurry for shallow trench isolation process of semiconductor
US8066874B2 (en) 2006-12-28 2011-11-29 Molycorp Minerals, Llc Apparatus for treating a flow of an aqueous solution containing arsenic
US8349764B2 (en) 2007-10-31 2013-01-08 Molycorp Minerals, Llc Composition for treating a fluid
US8252087B2 (en) 2007-10-31 2012-08-28 Molycorp Minerals, Llc Process and apparatus for treating a gas containing a contaminant
US8491682B2 (en) * 2007-12-31 2013-07-23 K.C. Tech Co., Ltd. Abrasive particles, method of manufacturing the abrasive particles, and method of manufacturing chemical mechanical polishing slurry
KR20100124988A (ko) * 2009-05-20 2010-11-30 주식회사 동진쎄미켐 산화세륨 제조 방법 및 이를 이용한 슬러리 조성물
JP5619515B2 (ja) * 2010-08-03 2014-11-05 昭和電工株式会社 酸化セリウム系研磨剤及びガラス製ハードディスク基板の製造方法
US9233863B2 (en) 2011-04-13 2016-01-12 Molycorp Minerals, Llc Rare earth removal of hydrated and hydroxyl species
EP3083501B1 (en) 2013-12-16 2020-02-12 Rhodia Operations Liquid suspension of cerium oxide particles
US9975787B2 (en) 2014-03-07 2018-05-22 Secure Natural Resources Llc Removal of arsenic from aqueous streams with cerium (IV) oxide compositions
KR101701005B1 (ko) * 2014-10-24 2017-01-31 (주) 엠에스머트리얼즈 산화세륨계 연마재와 이를 포함하는 슬러리 및 그 제조 방법
US9920562B2 (en) 2015-11-20 2018-03-20 Hampton Products International Corporation Door closing mechanism having hands-free hold-open feature
JP6932726B2 (ja) * 2016-05-18 2021-09-08 ローディア オペレーションズ 酸化セリウム粒子およびそれらの製造方法
JP7123799B2 (ja) * 2016-09-16 2022-08-23 ニッタ・デュポン株式会社 研磨パッド
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WO2021111256A1 (en) * 2019-12-04 2021-06-10 3M Innovative Properties Company Particulate slurries and methods of making the same
JP7697473B2 (ja) * 2020-09-30 2025-06-24 Ａｇｃ株式会社 酸化セリウム及び研磨剤
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558802B (zh) * 2013-08-09 2016-11-21 Konica Minolta Inc Abrasive and abrasive slurry
CN111117566A (zh) * 2018-10-31 2020-05-08 信越化学工业株式会社 合成石英玻璃基板的研磨用研磨粒子及其制造方法，与合成石英玻璃基板的研磨方法
CN118061073A (zh) * 2020-06-19 2024-05-24 Sk恩普士有限公司 研磨片、其制造方法以及利用其的半导体器件的制造方法

Also Published As

Publication number Publication date
EP1201607B1 (en) 2014-07-30
JP2009051726A (ja) 2009-03-12
EP1201607A4 (en) 2004-04-14
EP2394960A2 (en) 2011-12-14
EP2394961A3 (en) 2012-10-24
KR20020009619A (ko) 2002-02-01
EP2394960A3 (en) 2013-03-13
KR100515782B1 (ko) 2005-09-23
WO2000073211A1 (en) 2000-12-07
EP1201607A1 (en) 2002-05-02
EP2246301A1 (en) 2010-11-03
US6615499B1 (en) 2003-09-09
KR100754349B1 (ko) 2007-08-31
KR20050039789A (ko) 2005-04-29
JP4221903B2 (ja) 2009-02-12
EP2394961A2 (en) 2011-12-14

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