TWI293362B - A sensor - Google Patents

A sensor Download PDF

Info

Publication number
TWI293362B
TWI293362B TW095102059A TW95102059A TWI293362B TW I293362 B TWI293362 B TW I293362B TW 095102059 A TW095102059 A TW 095102059A TW 95102059 A TW95102059 A TW 95102059A TW I293362 B TWI293362 B TW I293362B
Authority
TW
Taiwan
Prior art keywords
top cover
substrate
sensor
inductor
optical
Prior art date
Application number
TW095102059A
Other languages
English (en)
Chinese (zh)
Other versions
TW200639378A (en
Inventor
Eamon Hynes
Edward John Coyne
William A Lane
Original Assignee
Analog Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Analog Devices Inc filed Critical Analog Devices Inc
Publication of TW200639378A publication Critical patent/TW200639378A/zh
Application granted granted Critical
Publication of TWI293362B publication Critical patent/TWI293362B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0411—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/05—Means for preventing contamination of the components of the optical system; Means for preventing obstruction of the radiation path
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0801—Means for wavelength selection or discrimination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0846—Optical arrangements having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0879—Optical elements not provided otherwise, e.g. optical manifolds, holograms, cubic beamsplitters, non-dispersive prisms or particular coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Measurement Of Radiation (AREA)
TW095102059A 2005-01-26 2006-01-19 A sensor TWI293362B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/045,910 US7326932B2 (en) 2005-01-26 2005-01-26 Sensor and cap arrangement

Publications (2)

Publication Number Publication Date
TW200639378A TW200639378A (en) 2006-11-16
TWI293362B true TWI293362B (en) 2008-02-11

Family

ID=36092860

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102059A TWI293362B (en) 2005-01-26 2006-01-19 A sensor

Country Status (6)

Country Link
US (1) US7326932B2 (enExample)
EP (1) EP1842040B1 (enExample)
JP (2) JP2008528987A (enExample)
CN (1) CN101107500B (enExample)
TW (1) TWI293362B (enExample)
WO (1) WO2006079588A1 (enExample)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112005002762T5 (de) 2004-11-12 2007-08-30 Analog Devices Inc., Norwood Beabstandete, mit Kontakthöckern versehene Komponenten-Struktur
US8487260B2 (en) 2005-01-26 2013-07-16 Analog Devices, Inc. Sensor
US7326932B2 (en) * 2005-01-26 2008-02-05 Analog Devices, Inc. Sensor and cap arrangement
US7807972B2 (en) * 2005-01-26 2010-10-05 Analog Devices, Inc. Radiation sensor with cap and optical elements
US7435964B2 (en) * 2005-01-26 2008-10-14 Analog Devices, Inc. Thermal sensor with increased sensitivity
US7692148B2 (en) * 2005-01-26 2010-04-06 Analog Devices, Inc. Thermal sensor with thermal barrier
US7718967B2 (en) * 2005-01-26 2010-05-18 Analog Devices, Inc. Die temperature sensors
US8476591B2 (en) * 2005-09-21 2013-07-02 Analog Devices, Inc. Radiation sensor device and method
US7897920B2 (en) * 2005-09-21 2011-03-01 Analog Devices, Inc. Radiation sensor device and method
US7986027B2 (en) * 2006-10-20 2011-07-26 Analog Devices, Inc. Encapsulated metal resistor
WO2008085437A2 (en) * 2006-12-27 2008-07-17 Analog Devices, Inc. Control aperture for an ir sensor
US8523427B2 (en) * 2008-02-27 2013-09-03 Analog Devices, Inc. Sensor device with improved sensitivity to temperature variation in a semiconductor substrate
TWI398934B (zh) * 2008-04-15 2013-06-11 亞德諾公司 晶圓級csp感測器
FR2936868B1 (fr) * 2008-10-07 2011-02-18 Ulis Detecteur thermique a micro-encapsulation.
US8390083B2 (en) * 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
WO2012051340A1 (en) 2010-10-12 2012-04-19 Analog Devices, Inc. Microphone package with embedded asic
FR2985576B1 (fr) * 2012-01-05 2014-10-17 Ulis Detecteur infrarouge comportant un boitier integrant au moins un reseau de diffraction
NL2010343A (en) * 2012-03-20 2013-09-23 Asml Netherlands Bv Lithographic apparatus, sensor and method.
US9823115B2 (en) 2012-07-12 2017-11-21 Pixart Imaging Inc. Packaged optical device having a specular reflection configuration
WO2015042700A1 (en) 2013-09-24 2015-04-02 Motion Engine Inc. Mems components and method of wafer-level manufacturing thereof
WO2015003264A1 (en) 2013-07-08 2015-01-15 Motion Engine Inc. Mems device and method of manufacturing
WO2015013827A1 (en) 2013-08-02 2015-02-05 Motion Engine Inc. Mems motion sensor for sub-resonance angular rate sensing
CN105190264A (zh) * 2013-09-18 2015-12-23 上海巨哥电子科技有限公司 一种封装非制冷焦平面阵列的方法与焦平面阵列装置
CN104576883B (zh) 2013-10-29 2018-11-16 普因特工程有限公司 芯片安装用阵列基板及其制造方法
JP6590812B2 (ja) 2014-01-09 2019-10-16 モーション・エンジン・インコーポレーテッド 集積memsシステム
JP6167926B2 (ja) * 2014-02-11 2017-07-26 株式会社デンソー 赤外線検出装置
WO2015154173A1 (en) 2014-04-10 2015-10-15 Motion Engine Inc. Mems pressure sensor
US11674803B2 (en) 2014-06-02 2023-06-13 Motion Engine, Inc. Multi-mass MEMS motion sensor
US10231629B1 (en) * 2014-08-25 2019-03-19 Maxim Integrated Products, Inc. Mobile integrated electrode multifunction sensor and method
CA3004760A1 (en) 2014-12-09 2016-06-16 Motion Engine Inc. 3d mems magnetometer and associated methods
WO2016112463A1 (en) 2015-01-15 2016-07-21 Motion Engine Inc. 3d mems device with hermetic cavity
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
DE102015217290A1 (de) * 2015-09-10 2017-03-16 Robert Bosch Gmbh Mikroelektronische Anordnung und entsprechendes Herstellungsverfahren für eine mikroelektronische Anordnung
DE102016209798A1 (de) * 2016-06-03 2017-12-07 Robert Bosch Gmbh Mikroelektronische Sensorvorrichtung und Verfahren zum Herstellen einer mikroelektronischen Sensorvorrichtung
WO2018166738A1 (en) * 2017-03-15 2018-09-20 Asml Netherlands B.V. A sensor mark and a method of manufacturing a sensor mark
DE102017206385A1 (de) * 2017-04-13 2018-10-18 Robert Bosch Gmbh Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit
EP3511697B1 (de) 2018-01-12 2023-07-12 Drägerwerk AG & Co. KGaA Anordnung und verfahren zur analyse eines fluids
JP7292077B2 (ja) * 2018-07-11 2023-06-16 三菱電機株式会社 パッケージ素子の製造方法およびパッケージ素子
DE102019119502A1 (de) * 2019-07-18 2021-01-21 Hamilton Medical Ag Nichtdispersive Mehrkanal-Sensorbaugruppe mit refraktivem oder/und diffraktivem Strahlenteiler

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58131525A (ja) * 1982-01-31 1983-08-05 Matsushita Electric Works Ltd 赤外線検出装置
US7415126B2 (en) * 1992-05-05 2008-08-19 Automotive Technologies International Inc. Occupant sensing system
US4994664A (en) * 1989-03-27 1991-02-19 Massachusetts Institute Of Technology Optically coupled focal plane arrays using lenslets and multiplexers
JPH0821703B2 (ja) * 1990-07-17 1996-03-04 株式会社東芝 固体撮像素子
US5528038A (en) * 1991-05-07 1996-06-18 Matsushita Electric Industrial Co., Ltd. Temperature distribution measurement apparatus and its application to a human body detecting system
KR970010976B1 (ko) * 1993-12-31 1997-07-05 엘지전자 주식회사 적외선 어레이센서 장치
US5550373A (en) * 1994-12-30 1996-08-27 Honeywell Inc. Fabry-Perot micro filter-detector
US5650624A (en) * 1995-04-13 1997-07-22 Engelhard Sensor Technologies, Inc. Passive infrared analysis gas sensor
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
GB2310952B (en) * 1996-03-05 1998-08-19 Mitsubishi Electric Corp Infrared detector
US5701008A (en) * 1996-11-29 1997-12-23 He Holdings, Inc. Integrated infrared microlens and gas molecule getter grating in a vacuum package
JP3366590B2 (ja) * 1998-02-04 2003-01-14 科学技術振興事業団 温度測定装置、熱型赤外線イメージセンサ及び温度測定方法
JP3580126B2 (ja) * 1998-03-12 2004-10-20 オムロン株式会社 赤外線センサ
JP2000019015A (ja) * 1998-06-30 2000-01-21 Toshiba Corp 赤外線検出装置
US6252229B1 (en) * 1998-07-10 2001-06-26 Boeing North American, Inc. Sealed-cavity microstructure and microbolometer and associated fabrication methods
WO2000052511A1 (fr) * 1999-03-03 2000-09-08 Mitsubishi Denki Kabushiki Kaisha Systeme optique a infrarouges pour camera a infrarouges
CA2300400A1 (en) * 1999-03-22 2000-09-22 Michael George Taranowski Electronic optical target ranging and imaging
JP3573040B2 (ja) * 1999-05-07 2004-10-06 三菱電機株式会社 赤外線カメラ及び赤外線カメラシステム
US6222454B1 (en) 1999-07-01 2001-04-24 Goal Electronics Inc. Non-contacting temperature sensing device
JP2001326367A (ja) * 2000-05-12 2001-11-22 Denso Corp センサおよびその製造方法
JP2001349787A (ja) * 2000-06-06 2001-12-21 Seiko Epson Corp 赤外線検出素子および測温計
US7079669B2 (en) * 2000-12-27 2006-07-18 Mitsubishi Denki Kabushiki Kaisha Image processing device and elevator mounting it thereon
JP2002243908A (ja) * 2001-02-13 2002-08-28 Minolta Co Ltd 赤外線用光学素子および赤外線カメラ
FR2822541B1 (fr) * 2001-03-21 2003-10-03 Commissariat Energie Atomique Procedes et dispositifs de fabrication de detecteurs de rayonnement
US6890834B2 (en) * 2001-06-11 2005-05-10 Matsushita Electric Industrial Co., Ltd. Electronic device and method for manufacturing the same
JP3519720B2 (ja) * 2001-06-11 2004-04-19 松下電器産業株式会社 電子デバイス
US6893574B2 (en) 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
JP2005019966A (ja) * 2003-06-06 2005-01-20 Sanyo Electric Co Ltd 半導体装置及びその製造方法
DE102004034066B4 (de) 2004-07-15 2012-10-31 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung zur Steuerung der Kühlung einer Brennkraftmaschine für Kraftfahrzeuge
US7326932B2 (en) * 2005-01-26 2008-02-05 Analog Devices, Inc. Sensor and cap arrangement

Also Published As

Publication number Publication date
TW200639378A (en) 2006-11-16
US7326932B2 (en) 2008-02-05
US20060163453A1 (en) 2006-07-27
CN101107500A (zh) 2008-01-16
JP2013083669A (ja) 2013-05-09
CN101107500B (zh) 2013-07-24
EP1842040A1 (en) 2007-10-10
EP1842040B1 (en) 2016-09-14
WO2006079588A1 (en) 2006-08-03
JP2008528987A (ja) 2008-07-31

Similar Documents

Publication Publication Date Title
US7326932B2 (en) Sensor and cap arrangement
US10036835B2 (en) Gradient index lens for infrared imaging
US6627892B2 (en) Infrared detector packaged with improved antireflection element
CN101568813B (zh) 芯片温度传感器
CN101563591B (zh) 包括参考传感器元件的传感器
CN101563592B (zh) 具有热阻挡体的热传感器
US20130043552A1 (en) Integrated infrared sensors with optical elements and methods
EP2802009A1 (en) Integrated imaging device for infrared radiation and method of production
US20170168199A1 (en) Method of Producing a Focal Plane Array for a Multi-Aperture Camera Core
US9761740B2 (en) Electromagnetic radiation micro device, wafer element and method for manufacturing such a micro device
KR20170087417A (ko) 마이크로 캡슐화에 의한 전자기 방사선 검출기의 제조 방법
JP2009128362A (ja) 分光式または光学式測定のためのセンサエレメントおよびその作製方法
US8608894B2 (en) Wafer level packaged focal plane array
US12379534B2 (en) Cover for an infrared detector and a method of fabricating a cover for an infrared detector
TWI904207B (zh) 紅外線偵測器形成方法及相關紅外線偵測器
JP5740997B2 (ja) 遠赤外線検出素子及び遠赤外線検出装置
US8593733B2 (en) Diffractive optical elements and applications thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees