CN101107500B - 传感器 - Google Patents

传感器 Download PDF

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Publication number
CN101107500B
CN101107500B CN2006800032167A CN200680003216A CN101107500B CN 101107500 B CN101107500 B CN 101107500B CN 2006800032167 A CN2006800032167 A CN 2006800032167A CN 200680003216 A CN200680003216 A CN 200680003216A CN 101107500 B CN101107500 B CN 101107500B
Authority
CN
China
Prior art keywords
sensor
cap
substrate
optical element
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800032167A
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English (en)
Chinese (zh)
Other versions
CN101107500A (zh
Inventor
埃蒙·海因斯
爱德华·约翰·科因
威廉·A·莱恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Analog Devices Inc
Original Assignee
Analog Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Analog Devices Inc filed Critical Analog Devices Inc
Publication of CN101107500A publication Critical patent/CN101107500A/zh
Application granted granted Critical
Publication of CN101107500B publication Critical patent/CN101107500B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0411—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/05—Means for preventing contamination of the components of the optical system; Means for preventing obstruction of the radiation path
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0801—Means for wavelength selection or discrimination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0846—Optical arrangements having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0879—Optical elements not provided otherwise, e.g. optical manifolds, holograms, cubic beamsplitters, non-dispersive prisms or particular coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Measurement Of Radiation (AREA)
CN2006800032167A 2005-01-26 2006-01-12 传感器 Expired - Fee Related CN101107500B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/045,910 US7326932B2 (en) 2005-01-26 2005-01-26 Sensor and cap arrangement
US11/045,910 2005-01-26
PCT/EP2006/050174 WO2006079588A1 (en) 2005-01-26 2006-01-12 A sensor

Publications (2)

Publication Number Publication Date
CN101107500A CN101107500A (zh) 2008-01-16
CN101107500B true CN101107500B (zh) 2013-07-24

Family

ID=36092860

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800032167A Expired - Fee Related CN101107500B (zh) 2005-01-26 2006-01-12 传感器

Country Status (6)

Country Link
US (1) US7326932B2 (enExample)
EP (1) EP1842040B1 (enExample)
JP (2) JP2008528987A (enExample)
CN (1) CN101107500B (enExample)
TW (1) TWI293362B (enExample)
WO (1) WO2006079588A1 (enExample)

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US7807972B2 (en) * 2005-01-26 2010-10-05 Analog Devices, Inc. Radiation sensor with cap and optical elements
US7435964B2 (en) * 2005-01-26 2008-10-14 Analog Devices, Inc. Thermal sensor with increased sensitivity
US7692148B2 (en) 2005-01-26 2010-04-06 Analog Devices, Inc. Thermal sensor with thermal barrier
US8476591B2 (en) * 2005-09-21 2013-07-02 Analog Devices, Inc. Radiation sensor device and method
US7897920B2 (en) * 2005-09-21 2011-03-01 Analog Devices, Inc. Radiation sensor device and method
US7986027B2 (en) * 2006-10-20 2011-07-26 Analog Devices, Inc. Encapsulated metal resistor
WO2008085437A2 (en) * 2006-12-27 2008-07-17 Analog Devices, Inc. Control aperture for an ir sensor
US8523427B2 (en) * 2008-02-27 2013-09-03 Analog Devices, Inc. Sensor device with improved sensitivity to temperature variation in a semiconductor substrate
TWI398934B (zh) * 2008-04-15 2013-06-11 亞德諾公司 晶圓級ｃｓｐ感測器
FR2936868B1 (fr) * 2008-10-07 2011-02-18 Ulis Detecteur thermique a micro-encapsulation.
US8390083B2 (en) * 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
US9407997B2 (en) 2010-10-12 2016-08-02 Invensense, Inc. Microphone package with embedded ASIC
FR2985576B1 (fr) * 2012-01-05 2014-10-17 Ulis Detecteur infrarouge comportant un boitier integrant au moins un reseau de diffraction
WO2013139553A2 (en) * 2012-03-20 2013-09-26 Asml Netherlands B.V. Lithographic apparatus, sensor and method
US9823115B2 (en) 2012-07-12 2017-11-21 Pixart Imaging Inc. Packaged optical device having a specular reflection configuration
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EP3028007A4 (en) 2013-08-02 2017-07-12 Motion Engine Inc. Mems motion sensor and method of manufacturing
WO2015039303A1 (zh) * 2013-09-18 2015-03-26 上海巨哥电子科技有限公司 一种封装非制冷焦平面阵列的方法与焦平面阵列装置
US9847462B2 (en) 2013-10-29 2017-12-19 Point Engineering Co., Ltd. Array substrate for mounting chip and method for manufacturing the same
JP6590812B2 (ja) 2014-01-09 2019-10-16 モーション・エンジン・インコーポレーテッド 集積ｍｅｍｓシステム
JP6167926B2 (ja) * 2014-02-11 2017-07-26 株式会社デンソー 赤外線検出装置
US20170030788A1 (en) 2014-04-10 2017-02-02 Motion Engine Inc. Mems pressure sensor
WO2015184531A1 (en) 2014-06-02 2015-12-10 Motion Engine Inc. Multi-mass mems motion sensor
US10231629B1 (en) * 2014-08-25 2019-03-19 Maxim Integrated Products, Inc. Mobile integrated electrode multifunction sensor and method
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US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
DE102015217290A1 (de) * 2015-09-10 2017-03-16 Robert Bosch Gmbh Mikroelektronische Anordnung und entsprechendes Herstellungsverfahren für eine mikroelektronische Anordnung
DE102016209798A1 (de) * 2016-06-03 2017-12-07 Robert Bosch Gmbh Mikroelektronische Sensorvorrichtung und Verfahren zum Herstellen einer mikroelektronischen Sensorvorrichtung
JP6852183B2 (ja) * 2017-03-15 2021-03-31 エーエスエムエル ネザーランズ ビー．ブイ． センサマークおよびセンサマークの製造方法
DE102017206385A1 (de) * 2017-04-13 2018-10-18 Robert Bosch Gmbh Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit
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Also Published As

Publication number Publication date
US20060163453A1 (en) 2006-07-27
EP1842040B1 (en) 2016-09-14
US7326932B2 (en) 2008-02-05
TWI293362B (en) 2008-02-11
WO2006079588A1 (en) 2006-08-03
TW200639378A (en) 2006-11-16
CN101107500A (zh) 2008-01-16
JP2013083669A (ja) 2013-05-09
EP1842040A1 (en) 2007-10-10
JP2008528987A (ja) 2008-07-31

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