TWI292352B - - Google Patents

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Publication number
TWI292352B
TWI292352B TW092114861A TW92114861A TWI292352B TW I292352 B TWI292352 B TW I292352B TW 092114861 A TW092114861 A TW 092114861A TW 92114861 A TW92114861 A TW 92114861A TW I292352 B TWI292352 B TW I292352B
Authority
TW
Taiwan
Prior art keywords
brittle material
material substrate
cooling
scribing
scribe line
Prior art date
Application number
TW092114861A
Other languages
English (en)
Chinese (zh)
Other versions
TW200400863A (en
Original Assignee
Mitsuboshi Diamond Ind Co Ltdl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltdl filed Critical Mitsuboshi Diamond Ind Co Ltdl
Publication of TW200400863A publication Critical patent/TW200400863A/zh
Application granted granted Critical
Publication of TWI292352B publication Critical patent/TWI292352B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
TW092114861A 2002-07-11 2003-06-02 Scribe device TW200400863A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002202578A JP2004042423A (ja) 2002-07-11 2002-07-11 スクライブ装置

Publications (2)

Publication Number Publication Date
TW200400863A TW200400863A (en) 2004-01-16
TWI292352B true TWI292352B (ko) 2008-01-11

Family

ID=30437330

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092114861A TW200400863A (en) 2002-07-11 2003-06-02 Scribe device

Country Status (4)

Country Link
JP (1) JP2004042423A (ko)
KR (1) KR20040007251A (ko)
CN (1) CN1328194C (ko)
TW (1) TW200400863A (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100573259B1 (ko) * 2004-06-28 2006-04-24 주식회사에스엘디 열유발 크랙 전파를 이용한 레이저 절단 장치
TWI380868B (zh) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
CN102284797B (zh) * 2005-07-06 2015-01-07 三星钻石工业股份有限公司 脆性材料用划线轮的制造方法
JP4675786B2 (ja) * 2006-01-20 2011-04-27 株式会社東芝 レーザー割断装置、割断方法
CN101108446A (zh) * 2006-07-21 2008-01-23 富士迈半导体精密工业（上海）有限公司 激光切割装置及方法
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
JP2009242184A (ja) * 2008-03-31 2009-10-22 Nippon Electric Glass Co Ltd 脆性板状物の切断方法及び切断装置
JP5193294B2 (ja) * 2008-05-30 2013-05-08 三星ダイヤモンド工業株式会社 レーザ加工装置およびレーザ加工方法
JP5332344B2 (ja) * 2008-06-30 2013-11-06 三星ダイヤモンド工業株式会社 チップホルダ及びホルダユニット
KR100958745B1 (ko) * 2009-11-30 2010-05-19 방형배 레이저를 이용한 스크라이빙 장치, 방법 및 스크라이빙 헤드
JP6424652B2 (ja) * 2015-02-02 2018-11-21 三星ダイヤモンド工業株式会社 ホルダ、ホルダユニット及びスクライブ装置
TWI543834B (zh) * 2015-04-24 2016-08-01 納諾股份有限公司 脆性物件切斷裝置及其切斷方法
CN107378908A (zh) * 2017-09-08 2017-11-24 广州市盛吉成智能科技有限公司 一种高端的剪切线速成器
CN111055256A (zh) * 2019-12-30 2020-04-24 湖南三一快而居住宅工业有限公司 双头划线装置和双头划线系统
CN114734153B (zh) * 2022-03-31 2023-02-14 武汉华日精密激光股份有限公司 一种用于激光器加工脆性材料的裂片方法及系统
CN116352293B (zh) * 2023-06-02 2023-08-25 沧州领创激光科技有限公司 一种激光切割机

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen

Also Published As

Publication number Publication date
JP2004042423A (ja) 2004-02-12
CN1472032A (zh) 2004-02-04
CN1328194C (zh) 2007-07-25
TW200400863A (en) 2004-01-16
KR20040007251A (ko) 2004-01-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees