TW200400863A - Scribe device - Google Patents
Scribe device Download PDFInfo
- Publication number
- TW200400863A TW200400863A TW092114861A TW92114861A TW200400863A TW 200400863 A TW200400863 A TW 200400863A TW 092114861 A TW092114861 A TW 092114861A TW 92114861 A TW92114861 A TW 92114861A TW 200400863 A TW200400863 A TW 200400863A
- Authority
- TW
- Taiwan
- Prior art keywords
- scribing
- brittle material
- material substrate
- cooling
- substrate
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002202578A JP2004042423A (ja) | 2002-07-11 | 2002-07-11 | スクライブ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200400863A true TW200400863A (en) | 2004-01-16 |
TWI292352B TWI292352B (ko) | 2008-01-11 |
Family
ID=30437330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092114861A TW200400863A (en) | 2002-07-11 | 2003-06-02 | Scribe device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2004042423A (ko) |
KR (1) | KR20040007251A (ko) |
CN (1) | CN1328194C (ko) |
TW (1) | TW200400863A (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100573259B1 (ko) * | 2004-06-28 | 2006-04-24 | 주식회사에스엘디 | 열유발 크랙 전파를 이용한 레이저 절단 장치 |
TWI380868B (zh) * | 2005-02-02 | 2013-01-01 | Mitsuboshi Diamond Ind Co Ltdl | Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same |
CN102285009B (zh) * | 2005-07-06 | 2016-08-17 | 三星钻石工业股份有限公司 | 脆性材料用划线轮及脆性材料的划线方法及装置、工具 |
JP4675786B2 (ja) * | 2006-01-20 | 2011-04-27 | 株式会社東芝 | レーザー割断装置、割断方法 |
CN101108446A (zh) * | 2006-07-21 | 2008-01-23 | 富士迈半导体精密工业(上海)有限公司 | 激光切割装置及方法 |
KR100949152B1 (ko) * | 2007-11-23 | 2010-03-25 | 삼성코닝정밀유리 주식회사 | 유리 기판 레이저 절단 장치 |
JP2009242184A (ja) * | 2008-03-31 | 2009-10-22 | Nippon Electric Glass Co Ltd | 脆性板状物の切断方法及び切断装置 |
KR101229325B1 (ko) * | 2008-05-30 | 2013-02-04 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 레이저 가공 장치 및 레이저 가공 방법 |
JP5332344B2 (ja) * | 2008-06-30 | 2013-11-06 | 三星ダイヤモンド工業株式会社 | チップホルダ及びホルダユニット |
KR100958745B1 (ko) * | 2009-11-30 | 2010-05-19 | 방형배 | 레이저를 이용한 스크라이빙 장치, 방법 및 스크라이빙 헤드 |
JP6424652B2 (ja) * | 2015-02-02 | 2018-11-21 | 三星ダイヤモンド工業株式会社 | ホルダ、ホルダユニット及びスクライブ装置 |
TWI543834B (zh) * | 2015-04-24 | 2016-08-01 | 納諾股份有限公司 | 脆性物件切斷裝置及其切斷方法 |
CN107378908A (zh) * | 2017-09-08 | 2017-11-24 | 广州市盛吉成智能科技有限公司 | 一种高端的剪切线速成器 |
CN111055256A (zh) * | 2019-12-30 | 2020-04-24 | 湖南三一快而居住宅工业有限公司 | 双头划线装置和双头划线系统 |
CN114734153B (zh) * | 2022-03-31 | 2023-02-14 | 武汉华日精密激光股份有限公司 | 一种用于激光器加工脆性材料的裂片方法及系统 |
CN116352293B (zh) * | 2023-06-02 | 2023-08-25 | 沧州领创激光科技有限公司 | 一种激光切割机 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2024441C1 (ru) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
MY120533A (en) * | 1997-04-14 | 2005-11-30 | Schott Ag | Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass. |
DE19952331C1 (de) * | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen |
-
2002
- 2002-07-11 JP JP2002202578A patent/JP2004042423A/ja active Pending
-
2003
- 2003-06-02 TW TW092114861A patent/TW200400863A/zh not_active IP Right Cessation
- 2003-06-11 KR KR1020030037330A patent/KR20040007251A/ko not_active Application Discontinuation
- 2003-07-11 CN CNB031459129A patent/CN1328194C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI292352B (ko) | 2008-01-11 |
KR20040007251A (ko) | 2004-01-24 |
CN1328194C (zh) | 2007-07-25 |
JP2004042423A (ja) | 2004-02-12 |
CN1472032A (zh) | 2004-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |