JP2004042423A - スクライブ装置 - Google Patents

スクライブ装置 Download PDF

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Publication number
JP2004042423A
JP2004042423A JP2002202578A JP2002202578A JP2004042423A JP 2004042423 A JP2004042423 A JP 2004042423A JP 2002202578 A JP2002202578 A JP 2002202578A JP 2002202578 A JP2002202578 A JP 2002202578A JP 2004042423 A JP2004042423 A JP 2004042423A
Authority
JP
Japan
Prior art keywords
brittle material
material substrate
cooling
scribe line
scribing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002202578A
Other languages
English (en)
Japanese (ja)
Inventor
Masato Matsumoto
松本　真人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2002202578A priority Critical patent/JP2004042423A/ja
Priority to TW092114861A priority patent/TW200400863A/zh
Priority to KR1020030037330A priority patent/KR20040007251A/ko
Priority to CNB031459129A priority patent/CN1328194C/zh
Publication of JP2004042423A publication Critical patent/JP2004042423A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Liquid Crystal (AREA)
JP2002202578A 2002-07-11 2002-07-11 スクライブ装置 Pending JP2004042423A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002202578A JP2004042423A (ja) 2002-07-11 2002-07-11 スクライブ装置
TW092114861A TW200400863A (en) 2002-07-11 2003-06-02 Scribe device
KR1020030037330A KR20040007251A (ko) 2002-07-11 2003-06-11 스크라이브 장치
CNB031459129A CN1328194C (zh) 2002-07-11 2003-07-11 切割装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002202578A JP2004042423A (ja) 2002-07-11 2002-07-11 スクライブ装置

Publications (1)

Publication Number Publication Date
JP2004042423A true JP2004042423A (ja) 2004-02-12

Family

ID=30437330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002202578A Pending JP2004042423A (ja) 2002-07-11 2002-07-11 スクライブ装置

Country Status (4)

Country Link
JP (1) JP2004042423A (ko)
KR (1) KR20040007251A (ko)
CN (1) CN1328194C (ko)
TW (1) TW200400863A (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009242184A (ja) * 2008-03-31 2009-10-22 Nippon Electric Glass Co Ltd 脆性板状物の切断方法及び切断装置
KR100932347B1 (ko) * 2006-07-21 2009-12-16 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드 레이저 절단장치 및 레이저 절단방법
KR100958745B1 (ko) * 2009-11-30 2010-05-19 방형배 레이저를 이용한 스크라이빙 장치, 방법 및 스크라이빙 헤드
KR101031235B1 (ko) * 2005-02-02 2011-04-29 미쓰보시 다이야몬도 고교 가부시키가이샤 소결 다이아몬드의 가공방법
CN102344245A (zh) * 2005-07-06 2012-02-08 三星钻石工业股份有限公司 脆性材料用划线轮和采用该划线轮的划线方法及装置、工具
JP6027654B1 (ja) * 2015-04-24 2016-11-16 エイゾクケイマングントウショウナノコウフンユウゲンコウシ 脆性物の切断装置及びその切断方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100573259B1 (ko) * 2004-06-28 2006-04-24 주식회사에스엘디 열유발 크랙 전파를 이용한 레이저 절단 장치
JP4675786B2 (ja) * 2006-01-20 2011-04-27 株式会社東芝 レーザー割断装置、割断方法
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
KR101229325B1 (ko) * 2008-05-30 2013-02-04 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저 가공 장치 및 레이저 가공 방법
JP5332344B2 (ja) * 2008-06-30 2013-11-06 三星ダイヤモンド工業株式会社 チップホルダ及びホルダユニット
JP6424652B2 (ja) * 2015-02-02 2018-11-21 三星ダイヤモンド工業株式会社 ホルダ、ホルダユニット及びスクライブ装置
CN107378908A (zh) * 2017-09-08 2017-11-24 广州市盛吉成智能科技有限公司 一种高端的剪切线速成器
CN111055256A (zh) * 2019-12-30 2020-04-24 湖南三一快而居住宅工业有限公司 双头划线装置和双头划线系统
CN114734153B (zh) * 2022-03-31 2023-02-14 武汉华日精密激光股份有限公司 一种用于激光器加工脆性材料的裂片方法及系统
CN116352293B (zh) * 2023-06-02 2023-08-25 沧州领创激光科技有限公司 一种激光切割机

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101031235B1 (ko) * 2005-02-02 2011-04-29 미쓰보시 다이야몬도 고교 가부시키가이샤 소결 다이아몬드의 가공방법
CN102344245A (zh) * 2005-07-06 2012-02-08 三星钻石工业股份有限公司 脆性材料用划线轮和采用该划线轮的划线方法及装置、工具
CN102344245B (zh) * 2005-07-06 2015-10-28 三星钻石工业股份有限公司 脆性材料用划线轮和采用该划线轮的划线方法及装置、工具
KR100932347B1 (ko) * 2006-07-21 2009-12-16 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드 레이저 절단장치 및 레이저 절단방법
JP2009242184A (ja) * 2008-03-31 2009-10-22 Nippon Electric Glass Co Ltd 脆性板状物の切断方法及び切断装置
KR100958745B1 (ko) * 2009-11-30 2010-05-19 방형배 레이저를 이용한 스크라이빙 장치, 방법 및 스크라이빙 헤드
JP6027654B1 (ja) * 2015-04-24 2016-11-16 エイゾクケイマングントウショウナノコウフンユウゲンコウシ 脆性物の切断装置及びその切断方法

Also Published As

Publication number Publication date
TWI292352B (ko) 2008-01-11
TW200400863A (en) 2004-01-16
KR20040007251A (ko) 2004-01-24
CN1328194C (zh) 2007-07-25
CN1472032A (zh) 2004-02-04

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