TWI291911B - Polishing pad and chemical mechanical polishing apparatus using the same - Google Patents

Polishing pad and chemical mechanical polishing apparatus using the same Download PDF

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Publication number
TWI291911B
TWI291911B TW094141816A TW94141816A TWI291911B TW I291911 B TWI291911 B TW I291911B TW 094141816 A TW094141816 A TW 094141816A TW 94141816 A TW94141816 A TW 94141816A TW I291911 B TWI291911 B TW I291911B
Authority
TW
Taiwan
Prior art keywords
honing
pad
honing pad
groove pattern
groove
Prior art date
Application number
TW094141816A
Other languages
English (en)
Chinese (zh)
Other versions
TW200640616A (en
Inventor
Yang Soo Choi
Original Assignee
Hynix Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of TW200640616A publication Critical patent/TW200640616A/zh
Application granted granted Critical
Publication of TWI291911B publication Critical patent/TWI291911B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW094141816A 2005-05-24 2005-11-29 Polishing pad and chemical mechanical polishing apparatus using the same TWI291911B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050043716A KR100721196B1 (ko) 2005-05-24 2005-05-24 연마패드 및 이를 이용한 화학적기계적연마장치

Publications (2)

Publication Number Publication Date
TW200640616A TW200640616A (en) 2006-12-01
TWI291911B true TWI291911B (en) 2008-01-01

Family

ID=37464076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141816A TWI291911B (en) 2005-05-24 2005-11-29 Polishing pad and chemical mechanical polishing apparatus using the same

Country Status (4)

Country Link
US (1) US7357698B2 (https=)
JP (1) JP4920965B2 (https=)
KR (1) KR100721196B1 (https=)
TW (1) TWI291911B (https=)

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CN108381371B (zh) * 2018-03-16 2020-05-08 阜阳市战千里知识产权运营有限公司 一种用于加工圆柱形工件的双层研磨机
CN108500757A (zh) * 2018-03-16 2018-09-07 蚌埠市鸿鹄精工机械有限公司 一种圆盘式研磨机
CN108481153B (zh) * 2018-03-16 2020-05-08 阜阳市战千里知识产权运营有限公司 一种双层研磨机
CN108621025B (zh) * 2018-05-14 2020-05-08 阜阳市战千里知识产权运营有限公司 一种研磨机
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11685015B2 (en) * 2019-01-28 2023-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for performing chemical mechanical polishing
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN113910101B (zh) * 2021-09-03 2023-01-31 广东粤港澳大湾区黄埔材料研究院 一种抛光垫
CN115106931B (zh) * 2022-06-23 2024-08-20 万华化学集团电子材料有限公司 具有迷宫形凹槽的化学机械抛光垫及其应用
CN119282915A (zh) * 2024-12-12 2025-01-10 荣芯半导体(宁波)有限公司 一种研磨垫、研磨设备及研磨方法

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Also Published As

Publication number Publication date
KR20060121497A (ko) 2006-11-29
TW200640616A (en) 2006-12-01
JP4920965B2 (ja) 2012-04-18
JP2006332585A (ja) 2006-12-07
US7357698B2 (en) 2008-04-15
US20060270325A1 (en) 2006-11-30
KR100721196B1 (ko) 2007-05-23

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