JP4920965B2 - 研磨パッド及びこれを採用した化学的機械的研磨装置 - Google Patents

研磨パッド及びこれを採用した化学的機械的研磨装置 Download PDF

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Publication number
JP4920965B2
JP4920965B2 JP2005366162A JP2005366162A JP4920965B2 JP 4920965 B2 JP4920965 B2 JP 4920965B2 JP 2005366162 A JP2005366162 A JP 2005366162A JP 2005366162 A JP2005366162 A JP 2005366162A JP 4920965 B2 JP4920965 B2 JP 4920965B2
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Japan
Prior art keywords
polishing pad
polishing
groove pattern
chemical mechanical
slurry
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Expired - Fee Related
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JP2005366162A
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English (en)
Japanese (ja)
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JP2006332585A5 (https=
JP2006332585A (ja
Inventor
スー チェ ヨン
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SK Hynix Inc
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Hynix Semiconductor Inc
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Publication of JP2006332585A publication Critical patent/JP2006332585A/ja
Publication of JP2006332585A5 publication Critical patent/JP2006332585A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2005366162A 2005-05-24 2005-12-20 研磨パッド及びこれを採用した化学的機械的研磨装置 Expired - Fee Related JP4920965B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2005-0043716 2005-05-24
KR1020050043716A KR100721196B1 (ko) 2005-05-24 2005-05-24 연마패드 및 이를 이용한 화학적기계적연마장치

Publications (3)

Publication Number Publication Date
JP2006332585A JP2006332585A (ja) 2006-12-07
JP2006332585A5 JP2006332585A5 (https=) 2008-12-04
JP4920965B2 true JP4920965B2 (ja) 2012-04-18

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Family Applications (1)

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JP2005366162A Expired - Fee Related JP4920965B2 (ja) 2005-05-24 2005-12-20 研磨パッド及びこれを採用した化学的機械的研磨装置

Country Status (4)

Country Link
US (1) US7357698B2 (https=)
JP (1) JP4920965B2 (https=)
KR (1) KR100721196B1 (https=)
TW (1) TWI291911B (https=)

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CN108381371B (zh) * 2018-03-16 2020-05-08 阜阳市战千里知识产权运营有限公司 一种用于加工圆柱形工件的双层研磨机
CN108500757A (zh) * 2018-03-16 2018-09-07 蚌埠市鸿鹄精工机械有限公司 一种圆盘式研磨机
CN108481153B (zh) * 2018-03-16 2020-05-08 阜阳市战千里知识产权运营有限公司 一种双层研磨机
CN108621025B (zh) * 2018-05-14 2020-05-08 阜阳市战千里知识产权运营有限公司 一种研磨机
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
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CN113910101B (zh) * 2021-09-03 2023-01-31 广东粤港澳大湾区黄埔材料研究院 一种抛光垫
CN115106931B (zh) * 2022-06-23 2024-08-20 万华化学集团电子材料有限公司 具有迷宫形凹槽的化学机械抛光垫及其应用
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Also Published As

Publication number Publication date
KR20060121497A (ko) 2006-11-29
TW200640616A (en) 2006-12-01
JP2006332585A (ja) 2006-12-07
US7357698B2 (en) 2008-04-15
US20060270325A1 (en) 2006-11-30
TWI291911B (en) 2008-01-01
KR100721196B1 (ko) 2007-05-23

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