TWI289719B - Inspection system imager method for inspecting surfaces for defect and method for fabricating electrical circuit - Google Patents
Inspection system imager method for inspecting surfaces for defect and method for fabricating electrical circuit Download PDFInfo
- Publication number
- TWI289719B TWI289719B TW091137863A TW91137863A TWI289719B TW I289719 B TWI289719 B TW I289719B TW 091137863 A TW091137863 A TW 091137863A TW 91137863 A TW91137863 A TW 91137863A TW I289719 B TWI289719 B TW I289719B
- Authority
- TW
- Taiwan
- Prior art keywords
- flash
- illuminator
- flashes
- imager
- inspection system
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 45
- 230000007547 defect Effects 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 20
- 230000003287 optical effect Effects 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 32
- 238000005286 illumination Methods 0.000 claims description 18
- 238000001228 spectrum Methods 0.000 claims description 13
- 230000003595 spectral effect Effects 0.000 claims description 8
- 241000098700 Sarcocheilichthys parvus Species 0.000 claims description 6
- 241000695776 Thorichthys aureus Species 0.000 claims description 6
- 230000002950 deficient Effects 0.000 claims description 6
- 239000003086 colorant Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 241000565356 Fraxinus pennsylvanica Species 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 206010011469 Crying Diseases 0.000 description 1
- 235000009827 Prunus armeniaca Nutrition 0.000 description 1
- 244000018633 Prunus armeniaca Species 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011045 prefiltration Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Input (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/254,542 US6781687B2 (en) | 2002-09-26 | 2002-09-26 | Illumination and image acquisition system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200405110A TW200405110A (en) | 2004-04-01 |
| TWI289719B true TWI289719B (en) | 2007-11-11 |
Family
ID=32029037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091137863A TWI289719B (en) | 2002-09-26 | 2002-12-30 | Inspection system imager method for inspecting surfaces for defect and method for fabricating electrical circuit |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6781687B2 (enExample) |
| JP (1) | JP2004191355A (enExample) |
| TW (1) | TWI289719B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7077525B2 (en) * | 2001-02-06 | 2006-07-18 | Optics 1, Inc | Led-based flashlight |
| WO2006012551A1 (en) * | 2004-07-23 | 2006-02-02 | Nextech Solutions, Inc. | Large substrate flat panel inspection system |
| US8121392B2 (en) * | 2004-10-25 | 2012-02-21 | Parata Systems, Llc | Embedded imaging and control system |
| US8237138B2 (en) * | 2005-09-08 | 2012-08-07 | X-Rite, Inc. | Systems and method for optical scatter imaging of latent image plates |
| US7636466B2 (en) * | 2006-01-11 | 2009-12-22 | Orbotech Ltd | System and method for inspecting workpieces having microscopic features |
| US7567344B2 (en) * | 2006-05-12 | 2009-07-28 | Corning Incorporated | Apparatus and method for characterizing defects in a transparent substrate |
| JP2010512535A (ja) * | 2006-12-12 | 2010-04-22 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 細胞分析方法及び装置 |
| EP2095186A2 (en) | 2006-12-19 | 2009-09-02 | Philips Intellectual Property & Standards GmbH | Colour sequential flash for digital image acquisition |
| TWI345053B (en) * | 2007-03-16 | 2011-07-11 | Ind Tech Res Inst | Image-acquiring system with high-spectrum resolution and method for the same |
| US7745771B2 (en) * | 2007-04-03 | 2010-06-29 | Delphi Technologies, Inc. | Synchronous imaging using segmented illumination |
| JP2009065146A (ja) * | 2007-08-15 | 2009-03-26 | Sony Corp | 半導体薄膜の形成方法および半導体薄膜の検査装置 |
| US8223327B2 (en) * | 2009-01-26 | 2012-07-17 | Kla-Tencor Corp. | Systems and methods for detecting defects on a wafer |
| US8605275B2 (en) * | 2009-01-26 | 2013-12-10 | Kla-Tencor Corp. | Detecting defects on a wafer |
| US8144973B2 (en) * | 2009-03-24 | 2012-03-27 | Orbotech Ltd. | Multi-modal imaging |
| US9035673B2 (en) | 2010-01-25 | 2015-05-19 | Palo Alto Research Center Incorporated | Method of in-process intralayer yield detection, interlayer shunt detection and correction |
| CN103069436B (zh) * | 2010-08-05 | 2017-02-08 | 奥博泰克有限公司 | 照明系统 |
| WO2012139088A2 (en) * | 2011-04-08 | 2012-10-11 | Accusentry, Inc. | System and method for generating multiple, interlaced images using a single scanning camera with multiple, alternating light sources |
| JP5914075B2 (ja) * | 2012-03-21 | 2016-05-11 | ヤマハ発動機株式会社 | プリント配線板用撮像装置、表面実装機および実装システム |
| CN103076344A (zh) * | 2012-12-27 | 2013-05-01 | 深圳市华星光电技术有限公司 | 显示面板的缺陷检测方法及其检测装置 |
| US9008410B2 (en) | 2013-03-13 | 2015-04-14 | Kla-Tencor Corporation | Single die inspection on a dark field inspection tool |
| TWI647530B (zh) * | 2013-12-22 | 2019-01-11 | Applied Materials, Inc. | 用於沉積之監控系統及其操作方法 |
| DK3007430T3 (en) | 2014-10-10 | 2017-02-20 | Sick Ag | CAMERA SYSTEM AND INSPECTION AND / OR MEASUREMENT OF OBJECTS |
| US9870935B2 (en) | 2014-12-19 | 2018-01-16 | Applied Materials, Inc. | Monitoring system for deposition and method of operation thereof |
| JP6857079B2 (ja) * | 2017-05-09 | 2021-04-14 | 株式会社キーエンス | 画像検査装置 |
| TWI721385B (zh) * | 2018-07-08 | 2021-03-11 | 香港商康代影像技術方案香港有限公司 | 產生印刷電路板合成彩色影像之技術 |
| JP7311608B2 (ja) * | 2019-07-26 | 2023-07-19 | 株式会社Fuji | 対基板作業システム |
| TWI848757B (zh) * | 2023-06-29 | 2024-07-11 | 宏瀨光電有限公司 | 多色閃頻取像檢測系統及其方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5495337A (en) * | 1991-11-06 | 1996-02-27 | Machine Vision Products, Inc. | Method of visualizing minute particles |
| US5440385A (en) * | 1993-02-05 | 1995-08-08 | Pressco Technology, Inc. | Integrated isotropic illumination source for translucent item inspection |
| US6122048A (en) * | 1994-08-26 | 2000-09-19 | Pressco Technology Inc. | Integral field lens illumination for video inspection |
| US6603103B1 (en) * | 1998-07-08 | 2003-08-05 | Ppt Vision, Inc. | Circuit for machine-vision system |
| US6177682B1 (en) * | 1998-10-21 | 2001-01-23 | Novacam Tyechnologies Inc. | Inspection of ball grid arrays (BGA) by using shadow images of the solder balls |
| IL132817A (en) | 1999-11-08 | 2003-11-23 | Orbotech Schuh Gmbh & Co | Illumination and image acquisition system |
| TW468033B (en) | 2000-05-15 | 2001-12-11 | Orbotech Ltd | Microscope inspection system |
| US6552783B1 (en) * | 2000-06-28 | 2003-04-22 | Teradyne, Inc. | Optical system |
| US6621566B1 (en) * | 2000-10-02 | 2003-09-16 | Teradyne, Inc. | Optical inspection system having integrated component learning |
-
2002
- 2002-09-26 US US10/254,542 patent/US6781687B2/en not_active Expired - Fee Related
- 2002-12-30 TW TW091137863A patent/TWI289719B/zh not_active IP Right Cessation
-
2003
- 2003-09-26 JP JP2003335093A patent/JP2004191355A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US6781687B2 (en) | 2004-08-24 |
| TW200405110A (en) | 2004-04-01 |
| US20040061850A1 (en) | 2004-04-01 |
| JP2004191355A (ja) | 2004-07-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |