JP2004191355A5 - - Google Patents

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Publication number
JP2004191355A5
JP2004191355A5 JP2003335093A JP2003335093A JP2004191355A5 JP 2004191355 A5 JP2004191355 A5 JP 2004191355A5 JP 2003335093 A JP2003335093 A JP 2003335093A JP 2003335093 A JP2003335093 A JP 2003335093A JP 2004191355 A5 JP2004191355 A5 JP 2004191355A5
Authority
JP
Japan
Prior art keywords
light
imager
flash
inspection system
flashlight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003335093A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004191355A (ja
Filing date
Publication date
Priority claimed from US10/254,542 external-priority patent/US6781687B2/en
Application filed filed Critical
Publication of JP2004191355A publication Critical patent/JP2004191355A/ja
Publication of JP2004191355A5 publication Critical patent/JP2004191355A5/ja
Pending legal-status Critical Current

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JP2003335093A 2002-09-26 2003-09-26 照明及び画像取得システム Pending JP2004191355A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/254,542 US6781687B2 (en) 2002-09-26 2002-09-26 Illumination and image acquisition system

Publications (2)

Publication Number Publication Date
JP2004191355A JP2004191355A (ja) 2004-07-08
JP2004191355A5 true JP2004191355A5 (enExample) 2006-11-02

Family

ID=32029037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003335093A Pending JP2004191355A (ja) 2002-09-26 2003-09-26 照明及び画像取得システム

Country Status (3)

Country Link
US (1) US6781687B2 (enExample)
JP (1) JP2004191355A (enExample)
TW (1) TWI289719B (enExample)

Families Citing this family (27)

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Publication number Priority date Publication date Assignee Title
US7077525B2 (en) * 2001-02-06 2006-07-18 Optics 1, Inc Led-based flashlight
WO2006012551A1 (en) * 2004-07-23 2006-02-02 Nextech Solutions, Inc. Large substrate flat panel inspection system
US8121392B2 (en) * 2004-10-25 2012-02-21 Parata Systems, Llc Embedded imaging and control system
US8237138B2 (en) * 2005-09-08 2012-08-07 X-Rite, Inc. Systems and method for optical scatter imaging of latent image plates
US7636466B2 (en) * 2006-01-11 2009-12-22 Orbotech Ltd System and method for inspecting workpieces having microscopic features
US7567344B2 (en) * 2006-05-12 2009-07-28 Corning Incorporated Apparatus and method for characterizing defects in a transparent substrate
WO2008072166A1 (en) * 2006-12-12 2008-06-19 Koninklijke Philips Electronics N.V. Method and apparatus for cell analysis
WO2008075266A2 (en) 2006-12-19 2008-06-26 Philips Intellectual Property & Standards Gmbh Colour sequential flash for digital image acquisition
TWI345053B (en) * 2007-03-16 2011-07-11 Ind Tech Res Inst Image-acquiring system with high-spectrum resolution and method for the same
US7745771B2 (en) * 2007-04-03 2010-06-29 Delphi Technologies, Inc. Synchronous imaging using segmented illumination
JP2009065146A (ja) * 2007-08-15 2009-03-26 Sony Corp 半導体薄膜の形成方法および半導体薄膜の検査装置
US8605275B2 (en) * 2009-01-26 2013-12-10 Kla-Tencor Corp. Detecting defects on a wafer
US8223327B2 (en) * 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
US8144973B2 (en) * 2009-03-24 2012-03-27 Orbotech Ltd. Multi-modal imaging
US9035673B2 (en) 2010-01-25 2015-05-19 Palo Alto Research Center Incorporated Method of in-process intralayer yield detection, interlayer shunt detection and correction
JP5911865B2 (ja) * 2010-08-05 2016-04-27 オーボテック リミテッド 照明システム
WO2012139088A2 (en) * 2011-04-08 2012-10-11 Accusentry, Inc. System and method for generating multiple, interlaced images using a single scanning camera with multiple, alternating light sources
JP5914075B2 (ja) * 2012-03-21 2016-05-11 ヤマハ発動機株式会社 プリント配線板用撮像装置、表面実装機および実装システム
CN103076344A (zh) * 2012-12-27 2013-05-01 深圳市华星光电技术有限公司 显示面板的缺陷检测方法及其检测装置
US9008410B2 (en) 2013-03-13 2015-04-14 Kla-Tencor Corporation Single die inspection on a dark field inspection tool
WO2015095799A1 (en) * 2013-12-22 2015-06-25 Applied Materials, Inc. Monitoring system for deposition and method of operation thereof
EP3007430B1 (de) * 2014-10-10 2017-01-11 Sick Ag Kamerasystem und Verfahren zur Inspektion und/oder Vermessung von Objekten
US9870935B2 (en) 2014-12-19 2018-01-16 Applied Materials, Inc. Monitoring system for deposition and method of operation thereof
JP6857079B2 (ja) * 2017-05-09 2021-04-14 株式会社キーエンス 画像検査装置
TWI721385B (zh) * 2018-07-08 2021-03-11 香港商康代影像技術方案香港有限公司 產生印刷電路板合成彩色影像之技術
EP4007481B1 (en) 2019-07-26 2024-10-30 Fuji Corporation Substrate work system
TWI848757B (zh) * 2023-06-29 2024-07-11 宏瀨光電有限公司 多色閃頻取像檢測系統及其方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495337A (en) * 1991-11-06 1996-02-27 Machine Vision Products, Inc. Method of visualizing minute particles
US5440385A (en) * 1993-02-05 1995-08-08 Pressco Technology, Inc. Integrated isotropic illumination source for translucent item inspection
US6122048A (en) * 1994-08-26 2000-09-19 Pressco Technology Inc. Integral field lens illumination for video inspection
AU4975499A (en) * 1998-07-08 2000-02-01 Bryan Maret Identifying and handling device tilt in a three-dimensional machine-vision image
US6177682B1 (en) * 1998-10-21 2001-01-23 Novacam Tyechnologies Inc. Inspection of ball grid arrays (BGA) by using shadow images of the solder balls
IL132817A (en) 1999-11-08 2003-11-23 Orbotech Schuh Gmbh & Co Illumination and image acquisition system
TW468033B (en) 2000-05-15 2001-12-11 Orbotech Ltd Microscope inspection system
US6552783B1 (en) * 2000-06-28 2003-04-22 Teradyne, Inc. Optical system
US6621566B1 (en) * 2000-10-02 2003-09-16 Teradyne, Inc. Optical inspection system having integrated component learning

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