TWI289610B - Heated substrate support and method of fabricating same - Google Patents

Heated substrate support and method of fabricating same Download PDF

Info

Publication number
TWI289610B
TWI289610B TW094128097A TW94128097A TWI289610B TW I289610 B TWI289610 B TW I289610B TW 094128097 A TW094128097 A TW 094128097A TW 94128097 A TW94128097 A TW 94128097A TW I289610 B TWI289610 B TW I289610B
Authority
TW
Taiwan
Prior art keywords
trench
heat sink
substrate support
groove
aluminum
Prior art date
Application number
TW094128097A
Other languages
English (en)
Chinese (zh)
Other versions
TW200632124A (en
Inventor
Rolf A Guenther
Curtis B Hammill
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/965,601 external-priority patent/US20060075970A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200632124A publication Critical patent/TW200632124A/zh
Application granted granted Critical
Publication of TWI289610B publication Critical patent/TWI289610B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
TW094128097A 2004-10-13 2005-08-17 Heated substrate support and method of fabricating same TWI289610B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/965,601 US20060075970A1 (en) 2004-10-13 2004-10-13 Heated substrate support and method of fabricating same
US11/115,575 US7674338B2 (en) 2004-10-13 2005-04-26 Heated substrate support and method of fabricating same

Publications (2)

Publication Number Publication Date
TW200632124A TW200632124A (en) 2006-09-16
TWI289610B true TWI289610B (en) 2007-11-11

Family

ID=36380726

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128097A TWI289610B (en) 2004-10-13 2005-08-17 Heated substrate support and method of fabricating same

Country Status (3)

Country Link
JP (1) JP4817791B2 (https=)
KR (1) KR20060052233A (https=)
TW (1) TWI289610B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200185202A1 (en) * 2018-12-07 2020-06-11 Applied Materials, Inc. Component, Method Of Manufacturing The Component, And Method Of Cleaning The Component

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009535801A (ja) * 2006-04-28 2009-10-01 ダンスン エレクトロン カンパニー リミテッド サセプタの製造方法、及び、この方法によって製造されたサセプタ
JP2023166746A (ja) 2022-05-10 2023-11-22 東京エレクトロン株式会社 加熱装置及び基板処理装置
CN118147613B (zh) * 2024-02-05 2026-02-27 深圳市原速科技有限公司 治具以及镀膜设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2222192A (en) * 1938-10-12 1940-11-19 Westinghouse Electric & Mfg Co Flatiron
US2389588A (en) * 1942-10-29 1945-11-27 Westinghouse Electric Corp Heating apparatus
US2541118A (en) * 1945-04-11 1951-02-13 Birtman Electric Co Resistance element for electric irons
US5104459A (en) * 1989-11-28 1992-04-14 Atlantic Richfield Company Method of forming aluminum alloy sheet
US5844205A (en) * 1996-04-19 1998-12-01 Applied Komatsu Technology, Inc. Heated substrate support structure
JP3345852B2 (ja) * 1998-06-18 2002-11-18 古河電気工業株式会社 半導体製造装置の基盤ホルダー及びその製造方法
US6376815B1 (en) * 1998-01-12 2002-04-23 Furukawa Electric Co., Ltd. Highly gas tight substrate holder and method of manufacturing the same
JP2000243542A (ja) * 1999-02-24 2000-09-08 Nhk Spring Co Ltd ヒータユニット及びその製造方法
US6897411B2 (en) * 2002-02-11 2005-05-24 Applied Materials, Inc. Heated substrate support
US7154070B2 (en) * 2004-10-08 2006-12-26 Furukawa-Sky Aluminum Corp. Heater plate and a method for manufacturing the heater plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200185202A1 (en) * 2018-12-07 2020-06-11 Applied Materials, Inc. Component, Method Of Manufacturing The Component, And Method Of Cleaning The Component
US11694879B2 (en) * 2018-12-07 2023-07-04 Applied Materials, Inc. Component, method of manufacturing the component, and method of cleaning the component

Also Published As

Publication number Publication date
JP2006111973A (ja) 2006-04-27
JP4817791B2 (ja) 2011-11-16
TW200632124A (en) 2006-09-16
KR20060052233A (ko) 2006-05-19

Similar Documents

Publication Publication Date Title
US7998296B2 (en) Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
TWI484576B (zh) 半導體真空處理設備用之薄膜黏接劑
JP2007169777A (ja) 加熱型基板支持体及びその製造方法
US8065789B2 (en) Method of fabricating a heated substrate support
US20060005771A1 (en) Apparatus and method of shaping profiles of large-area PECVD electrodes
US20090266808A1 (en) Planar heater and semiconductor heat treatment apparatus provided with the heater
JP5019726B2 (ja) 化学気相成長用の加熱基板支持
US6878625B2 (en) Method for manufacturing semiconductor device
US8263908B2 (en) Heater plate and a method for manufacturing the heater plate
TWI289610B (en) Heated substrate support and method of fabricating same
US20030024680A1 (en) Substrate support and method of fabricating the same
US7154070B2 (en) Heater plate and a method for manufacturing the heater plate
JP2006108011A (ja) ヒータプレート及びヒータプレートの製造方法
JP4392724B2 (ja) サセプタ
JP4285612B2 (ja) サセプタ
JPH1167424A (ja) ヒータ支持装置
EP4071429A1 (en) Stage for heating and cooling object
US20170263422A1 (en) Heated substrate support
JP2010114280A (ja) 基板加熱プレートヒータ
US12553564B2 (en) Metal-based thermal insulation structures
JP7647783B2 (ja) 静電チャック及びその製造方法
JPWO2020067129A1 (ja) ウェハ用部材、ウェハ用システム及びウェハ用部材の製造方法
KR101397132B1 (ko) 정전척의 제조방법
US7531896B1 (en) Semiconductor device having a minimal via resistance created by applying a nitrogen plasma to a titanium via liner
KR100863465B1 (ko) 써셉터 제조방법 및 이를 이용한 써셉터

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees