TW200632124A - Heated substrate support and method of fabricating same - Google Patents

Heated substrate support and method of fabricating same

Info

Publication number
TW200632124A
TW200632124A TW094128097A TW94128097A TW200632124A TW 200632124 A TW200632124 A TW 200632124A TW 094128097 A TW094128097 A TW 094128097A TW 94128097 A TW94128097 A TW 94128097A TW 200632124 A TW200632124 A TW 200632124A
Authority
TW
Taiwan
Prior art keywords
substrate support
heated substrate
fabricating same
heat sink
groove
Prior art date
Application number
TW094128097A
Other languages
Chinese (zh)
Other versions
TWI289610B (en
Inventor
Rolf A Guenther
Curtis B Hammill
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/965,601 external-priority patent/US20060075970A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200632124A publication Critical patent/TW200632124A/en
Application granted granted Critical
Publication of TWI289610B publication Critical patent/TWI289610B/en

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)

Abstract

A method and apparatus for forming a substrate support is provided herein. In one embodiment, the substrate support includes a body having a support surface and at least one groove. A heater element surrounded with a malleable heat sink is disposed in the groove. The heat sink may be comprised of one or more parts. A cap is disposed in the groove above the heat sink and has an upper surface disposed substantially flush with the support surface.
TW94128097A 2004-10-13 2005-08-17 Heated substrate support and method of fabricating same TWI289610B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/965,601 US20060075970A1 (en) 2004-10-13 2004-10-13 Heated substrate support and method of fabricating same
US11/115,575 US7674338B2 (en) 2004-10-13 2005-04-26 Heated substrate support and method of fabricating same

Publications (2)

Publication Number Publication Date
TW200632124A true TW200632124A (en) 2006-09-16
TWI289610B TWI289610B (en) 2007-11-11

Family

ID=36380726

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94128097A TWI289610B (en) 2004-10-13 2005-08-17 Heated substrate support and method of fabricating same

Country Status (3)

Country Link
JP (1) JP4817791B2 (en)
KR (1) KR20060052233A (en)
TW (1) TWI289610B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009535801A (en) * 2006-04-28 2009-10-01 ダンスン エレクトロン カンパニー リミテッド Manufacturing method of susceptor and susceptor manufactured by this method
KR20210090279A (en) * 2018-12-07 2021-07-19 어플라이드 머티어리얼스, 인코포레이티드 Components, methods of manufacturing components, and methods of cleaning components
JP2023166746A (en) * 2022-05-10 2023-11-22 東京エレクトロン株式会社 Heating device and substrate processing apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2222192A (en) * 1938-10-12 1940-11-19 Westinghouse Electric & Mfg Co Flatiron
US2389588A (en) * 1942-10-29 1945-11-27 Westinghouse Electric Corp Heating apparatus
US2541118A (en) * 1945-04-11 1951-02-13 Birtman Electric Co Resistance element for electric irons
US5104459A (en) * 1989-11-28 1992-04-14 Atlantic Richfield Company Method of forming aluminum alloy sheet
US5844205A (en) * 1996-04-19 1998-12-01 Applied Komatsu Technology, Inc. Heated substrate support structure
JP3345852B2 (en) * 1998-06-18 2002-11-18 古河電気工業株式会社 Base holder for semiconductor manufacturing apparatus and method of manufacturing the same
US6376815B1 (en) * 1998-01-12 2002-04-23 Furukawa Electric Co., Ltd. Highly gas tight substrate holder and method of manufacturing the same
JP2000243542A (en) * 1999-02-24 2000-09-08 Nhk Spring Co Ltd Heater unit and manufacture thereof
US6897411B2 (en) * 2002-02-11 2005-05-24 Applied Materials, Inc. Heated substrate support
US7154070B2 (en) * 2004-10-08 2006-12-26 Furukawa-Sky Aluminum Corp. Heater plate and a method for manufacturing the heater plate

Also Published As

Publication number Publication date
JP4817791B2 (en) 2011-11-16
KR20060052233A (en) 2006-05-19
TWI289610B (en) 2007-11-11
JP2006111973A (en) 2006-04-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees