TWI286627B - Substrate bonding apparatus - Google Patents

Substrate bonding apparatus Download PDF

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Publication number
TWI286627B
TWI286627B TW093106694A TW93106694A TWI286627B TW I286627 B TWI286627 B TW I286627B TW 093106694 A TW093106694 A TW 093106694A TW 93106694 A TW93106694 A TW 93106694A TW I286627 B TWI286627 B TW I286627B
Authority
TW
Taiwan
Prior art keywords
substrate
vacuum
electrostatic
vacuum chuck
chuck
Prior art date
Application number
TW093106694A
Other languages
English (en)
Chinese (zh)
Other versions
TW200424623A (en
Inventor
Hiromu Nishijima
Satoshi Murata
Satoru Imai
Satoru Kawai
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200424623A publication Critical patent/TW200424623A/zh
Application granted granted Critical
Publication of TWI286627B publication Critical patent/TWI286627B/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/54—Arrangements for reducing warping-twist

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093106694A 2003-03-14 2004-03-12 Substrate bonding apparatus TWI286627B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003070335A JP4286562B2 (ja) 2003-03-14 2003-03-14 基板貼り合わせ装置

Publications (2)

Publication Number Publication Date
TW200424623A TW200424623A (en) 2004-11-16
TWI286627B true TWI286627B (en) 2007-09-11

Family

ID=33287113

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093106694A TWI286627B (en) 2003-03-14 2004-03-12 Substrate bonding apparatus

Country Status (3)

Country Link
JP (1) JP4286562B2 (ja)
KR (2) KR20040081069A (ja)
TW (1) TWI286627B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491100B (ja) * 2010-12-17 2015-07-01

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI478271B (zh) * 2007-08-10 2015-03-21 尼康股份有限公司 Substrate bonding device and substrate bonding method
KR100950746B1 (ko) * 2007-12-26 2010-04-05 주식회사 에이디피엔지니어링 임프린트 장치 및 임프린트 방법
KR101085116B1 (ko) * 2009-06-29 2011-11-18 에이피시스템 주식회사 기판 지지 모듈 및 기판 접합 장치
JP2014066917A (ja) * 2012-09-26 2014-04-17 Hitachi High-Technologies Corp 板状体保持機構、基板貼り合わせ装置及び基板貼り合わせ方法
CN108724748A (zh) * 2018-05-24 2018-11-02 江苏金花朵电子科技有限公司 一种用于手机触摸屏的泡棉贴合装置
CN111314838B (zh) * 2020-02-25 2021-08-27 绍兴中芯集成电路制造股份有限公司 Mems麦克风器件的检测方法
KR102416236B1 (ko) * 2020-10-29 2022-07-05 (주)에스티아이 패널 고정용 다단 척 및 이를 이용한 디스플레이 라미네이션 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4041267B2 (ja) * 2000-06-29 2008-01-30 芝浦メカトロニクス株式会社 基板搬送装置および基板搬送方法
JP3577546B2 (ja) * 2001-02-08 2004-10-13 株式会社 日立インダストリイズ 基板の組立方法及び組立装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491100B (ja) * 2010-12-17 2015-07-01

Also Published As

Publication number Publication date
JP4286562B2 (ja) 2009-07-01
TW200424623A (en) 2004-11-16
JP2004279679A (ja) 2004-10-07
KR100908960B1 (ko) 2009-07-22
KR20040081069A (ko) 2004-09-20
KR20080041173A (ko) 2008-05-09

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MM4A Annulment or lapse of patent due to non-payment of fees