玖、發明說明： 【發明所屬之技術領域】 發明所屬之技術領域 本备明係有關於液晶顯示裝置之基板貼合裝置。 ί:先前技術3 習知技術 液晶顯不裝置由一對基板及插入該等基板間之液晶所 構成。例如，一對基板之其中一基板為形成11^之117丁基 板，而另一基板為形成濾光片之濾光片基板。於其中一基 板形成由光硬化性密封劑所構成之環狀密封劑，在貼合一 對基板後，藉由照射紫外線使環狀密封劑硬化。液晶則插 入環狀密封劑所圍住的領域。 在過去的液晶顯示裝置之製造方法中，液晶係在貼合 一對基板後，在真空室内從設於環狀密封劑之注入孔注 入。然後，當環狀密封劑之注入孔堵塞時，則將由一對基 板所構成之液晶面板搬送至真空室外部，並對環狀密封劑 加壓’以形成適當的液晶盒間隙。 最近，出現稱作滴下注入法之液晶顯示裝置的製造方 法(例如，參照專利文獻丨）。滴下注入法係在其中一基板形 成環狀密封劑，且將液晶滴至該基板之環狀密封劑内。然 後，在真空室内貼合一對基板。然後，藉由照射紫外線或 併用照射紫外線與加熱使環狀密封劑硬化。利用滴下注入 法，可縮短製造步驟，並降低液晶顯示裝置之製造成本。 【專利文獻1】 曰本專利公開公報特開平i—侧规 發明欲解決之課題 為了在真空室内貼合一對基板，因此，分別藉由基板 送臂部將-對基板搬送至真空室内—對靜電真空吸盤的 位置其中_基板係载置於位於下方之靜電真空吸盤上， 另—基板則配置於位於上方之靜電真空吸盤下。由於在可 保持於位於上方之靜電真空吸盤之基板的基板下面側形成 有微小圖案’故必須保持基板之周邊部來搬送該基板，使 基她送臂部不要接觸到微小圖案，因此，基板之中央部 會沒有支撑物，如此一來，會有在基板之中央部因重力而 %曲之狀態下搬送該基板之傾向。 靜電真空吸盤包含用以產生靜電吸附力之電極及藉由 真空吸附力來保持基板之真空吸附孔。基板一開始藉由真 空吸附力來保持，後來則藉由靜電吸附力來保持。當藉由 靜電真空吸盤來真空吸附基板時，隨著基板之大型化:會 有基板在彎曲成某種程度之狀態下搬送至靜電真空吸盤: 位置並進行真空吸附的情況發生。此時，由於從最初與靜 電真空吸盤接觸的部分(周邊部)來_基板，因此，會從基 板之周邊部開始產生真空吸附，最後再吸附中央部。如此 /來，弯曲會集中在基板之中央部，而無法避免彎曲的情 況發生。因此，在為了貼合一對基板而進行定位時，貼合 標誌無法位於正確的位置，而發生定位不良的問題。 又，為了進行基板之定位，必須在真空中移動载置有 基板之靜電真空吸盤。靜電真空吸盤配置於真空室内，其 $構配置於真空室外。移動機構包含固定於靜電真空 吸盤之轴及用 _ A M覆盍該軸之蛇腹狀彈性體，用以使ΧΥ0機 口移動之驅動部係、透過蛇腹狀彈性體内之軸使靜電真空吸 盤移動。在 句Γ疋位而移動靜電真空吸盤時，蛇腹狀彈性 體會產生庫六 …刀’而有蛇腹狀彈性體之破損導致設備運轉率 降低之虞。 本發明之目的在於提供可使基板不彎曲地保持於靜電 真空吸盤之基板貼合裝置。 本發明之另一目的在於提供可使零件耐久性佳地運作 之基板貼合裝置。 【發明内容】 發明概要 根據本發明之基板貼合裝置包含··真空室；第丨靜電真 空吸盤，係配置於前述真空室，且具有用以保持第1基板之 真空吸附孔；第2靜電真空吸盤，係配置於前述真空室中且 與鈿述弟1靜電真空吸盤相向，且具有用以保持第2基板之 真空吸附孔；及吸盤，係至少設於前述第1及第2靜電真空 吸盤其中一者，且可吸附相關之基板的中央部。 根據該構造，當真空吸附基板時，可從中央部來吸附， 以避免基板之周邊部因吸附導致基板彎曲。 又’根據本發明之基板貼合裝置包含·真空室；第1 靜電真空吸盤，係配置於前述真空室，且具有用以保持第i 基板之真空吸附孔；第2靜電真空吸盤，係配置於前述真空 室中且與前述第1靜電真空吸盤相向，且具有用以保持第2 200424623 土板之真二及附孔；第1移動機構，可使前述第1靜電真空 吸孤升降’及第2移動機構，可使前述第2靜電真空吸盤至 v mY方向移動’又，前述第2移動機構包含··轴，係用 、、° a位於如述真空室内之前述第2靜電真空吸盤與位於 5岫述真二至外之驅動機構；剛性體，係用以覆蓋前述軸； 、。體&封劑，係配置於前述軸與前述剛性體之間。 根據該構造，第2移動機構包含：軸，係用以結合可朝 Y方向移動之第2靜電真空吸盤與位於真空室外之驅動機 構’剛f生體’係用以覆蓋前述軸·，及磁流體密封劑，係配 置於幻述軸與如述剛性體之間。如此一來，藉由以剛性體 及磁密封劑將軸之周圍保持成氣密狀態，可使用以覆蓋軸 之周圍的構造物不會產生應力。 圖式簡單說明 第1圖係顯示-實施例之液晶顯示裝置的其中一基板 15 之透視圖。 第2圖係顯示根據本發明之液晶顯示裝置的基板貼合 裝置。 =3圖係顯示上靜電真空吸盤的例子之概略平面圖。 20发明 Description of the invention: [Technical field to which the invention belongs] Technical field to which the invention belongs The present invention relates to a substrate bonding device for a liquid crystal display device. ί: Prior art 3 Conventional technology A liquid crystal display device is composed of a pair of substrates and a liquid crystal interposed between the substrates. For example, one of a pair of substrates is a 117-butyl plate forming 11 ^, and the other substrate is a filter substrate forming a filter. A ring-shaped sealant made of a photo-curable sealant was formed on one of the substrates. After a pair of substrates were bonded, the ring-shaped sealant was cured by irradiating ultraviolet rays. The liquid crystal is inserted into the area surrounded by the annular sealant. In a conventional method for manufacturing a liquid crystal display device, a pair of substrates are bonded to a liquid crystal, and then injected into a vacuum chamber from an injection hole provided in a ring-shaped sealant. Then, when the injection hole of the annular sealant is blocked, a liquid crystal panel composed of a pair of substrates is transported to the outside of the vacuum chamber, and the annular sealant is pressurized 'to form an appropriate liquid crystal cell gap. Recently, a method for manufacturing a liquid crystal display device called a drip injection method has appeared (for example, refer to Patent Documents 丨). The drip-injection method forms a ring-shaped sealant on one of the substrates, and drips liquid crystal into the ring-shaped sealant of the substrate. Then, a pair of substrates were bonded in a vacuum chamber. Then, the annular sealant is hardened by irradiating ultraviolet rays or using ultraviolet rays and heating together. The drip injection method can shorten the manufacturing steps and reduce the manufacturing cost of the liquid crystal display device. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei i-Side Regulation Invention The problem to be solved is to attach a pair of substrates in a vacuum chamber. Therefore, the substrate-conveying arm is used to transport the pair of substrates into the vacuum chamber. The position of the electrostatic vacuum chuck where the substrate is placed on the electrostatic vacuum chuck located below, and the substrate is arranged under the electrostatic vacuum chuck located above. Since a micro pattern is formed on the lower surface side of the substrate that can be held on the substrate of the electrostatic vacuum chuck located above, it is necessary to hold the peripheral portion of the substrate to transport the substrate so that the micro arm pattern does not touch the micro pattern. There may be no support in the central portion, so that the substrate tends to be transported in a state where the central portion of the substrate is bent by gravity. The electrostatic vacuum chuck includes an electrode for generating an electrostatic suction force and a vacuum suction hole for holding the substrate by the vacuum suction force. The substrate is initially held by the vacuum adsorption force, and later is held by the electrostatic adsorption force. When a substrate is vacuum-adsorbed by an electrostatic vacuum chuck, as the substrate becomes larger: the substrate may be transported to the electrostatic chuck: position and vacuum-adsorbed when the substrate is bent to a certain extent. At this time, the substrate comes from the portion (peripheral portion) that first comes into contact with the electrostatic vacuum chuck. Therefore, vacuum adsorption starts from the peripheral portion of the substrate and finally the central portion. In this way, the bending will be concentrated in the center of the substrate, and the bending cannot be avoided. Therefore, when positioning for bonding a pair of substrates, the bonding mark cannot be located at the correct position, and a problem of poor positioning occurs. In order to position the substrate, the electrostatic vacuum chuck on which the substrate is placed must be moved in a vacuum. The electrostatic vacuum chuck is arranged in the vacuum chamber, and its structure is arranged outside the vacuum chamber. The moving mechanism includes a shaft fixed to the electrostatic vacuum chuck and a bellows-shaped elastic body covering the shaft with _ A M, a drive unit for moving the XΥ0 port, and a static vacuum chuck through the shaft in the bellows-shaped elastic body. When the electrostatic vacuum chuck is moved at the Γ 疋 position, the snake-like belly-like elastic body may generate a library six ... knife ', and the damage of the belly-like elastic body may reduce the operating rate of the equipment. An object of the present invention is to provide a substrate bonding apparatus capable of holding a substrate on an electrostatic vacuum chuck without bending. Another object of the present invention is to provide a substrate bonding apparatus capable of operating parts with high durability. [Summary of the Invention] Summary of the Invention The substrate bonding apparatus according to the present invention includes a vacuum chamber; a first electrostatic vacuum chuck, which is arranged in the aforementioned vacuum chamber and has a vacuum suction hole for holding a first substrate; a second electrostatic vacuum The suction cup is arranged in the aforementioned vacuum chamber and is opposite to the static vacuum suction cup 1 of the description, and has a vacuum suction hole for holding the second substrate; and the suction cup is provided at least in the first and second electrostatic vacuum suction cups. One, and can adsorb the central part of the relevant substrate. According to this structure, when the substrate is vacuum-adsorbed, the substrate can be adsorbed from the central portion to avoid the substrate from being bent by the peripheral portion of the substrate due to the adsorption. The substrate bonding apparatus according to the present invention includes a vacuum chamber. The first electrostatic vacuum chuck is disposed in the vacuum chamber and has a vacuum suction hole for holding the i-th substrate. The second electrostatic vacuum chuck is disposed in The vacuum chamber is opposite to the first electrostatic vacuum chuck, and has a second and a second hole to hold the second 200424623 clay plate; a first moving mechanism can make the first electrostatic vacuum suction lifter and the second electrostatic vacuum suction The moving mechanism can move the second electrostatic vacuum chuck to the direction of v mY. Furthermore, the second moving mechanism includes a shaft, and is used for the second electrostatic vacuum chuck located in the vacuum chamber and the 5 Describe the driving mechanism of Shinji to the outside; a rigid body is used to cover the aforementioned shaft; The body & sealant is disposed between the shaft and the rigid body. According to this structure, the second moving mechanism includes a shaft for combining a second electrostatic vacuum chuck that can move in the Y direction with a driving mechanism 'rigid body' located outside the vacuum chamber to cover the aforementioned shaft, and magnetic The fluid sealant is arranged between the magic axis and the rigid body. In this way, by keeping the periphery of the shaft airtight with a rigid body and a magnetic sealant, the structure that can be used to cover the periphery of the shaft does not cause stress. Brief Description of the Drawings Fig. 1 is a perspective view of a substrate 15 of a liquid crystal display device of a display-embodiment. Fig. 2 shows a substrate bonding apparatus of a liquid crystal display device according to the present invention. = 3 is a schematic plan view showing an example of an electrostatic vacuum chuck. 20
第4圖係顯示基板藉由基板搬送臂部配置於上靜電真 空吸盤下之情形。 一 第5圖係顯示基板抵達上靜電真空吸盤下方時吸附塾 下降並吸附基板之中央部的情形。 第6圖係顯示基板吸附於上靜電真空吸盤之情形。 第7圖係顯示本發明之另一實施例。 8 第8圖為第7圖之部分放大圖。 I：實施方式3 發明之實施形態 以下’針對本發明之實施例參照圖式作說明。液晶顯 示裝置由一對基板10、12及插入一對基板間之液晶14所構 成。液晶顯示裝置藉由滴下注入法來製造。一對基板中之 其中一基板為形成TFT之TFT基板，而另一基板為形成濾光 片之濾、光片基板。 第1圖係顯示一實施例之液晶顯示裝置的其中一基板 之透視圖。其中一基板1〇包含環狀密封劑13。液晶14從移 動中之分配器16以液滴狀滴至基板10上由環狀密封劑13所 圍住的領域。形成環狀密封劑13之密封劑由UV硬化性接著 性樹脂或藉由併用uv與熱來硬化之接著性樹脂所構成。另 準備另一基板12(第2圖中未圖示）。將密封劑塗布於基板 10，且在基板1〇貼合於另一基板12後使其硬化。於另一基 板12塗上將接著劑塗布於間隔材之接著性間隔材。亦可設 置柱狀物來取代間隔材，以省去間隔材散佈步驟。 第2圖係顯示根據本發明之液晶顯示裝置的基板貼合 裝置。第2圖中，液晶顯示裝置之基板貼合裝置2〇包含真空 至22。真空室22由可動之上殼罩24及固定之下殼罩％所構 成。第2圖係顯示開放真空室η的狀態。由第2圖之狀態可 去一上〃又罩24朝下殼罩26下降，則會關閉真空室22。 真空室22為了排出真空室咖的氣體，故與真空泵相連接。 下靜電真空吸盤（或下靜電真空夾盤)28係直接或藉由 200424623 適當較倾於孩衫，«⑽3〇與ΧΥΘ_裝置32 相結合。下靜電真空吸盤28具有未圖示之公知電極，藉由 使》亥電極通電所產生之靜電力將基板保持於下靜電真空吸 盤28上，並將液晶14滴至載置於下靜電真空吸盤28上之基 5板。又’下靜電真空吸盤28具有真空吸附孔。真空吸附孔 朝下靜電真二吸盤28之表面開口，且藉由從真空源所供給 之真空力來保持配置於下靜電真空吸盤28上之基板。未圖 示之升降桿係可升降地配置於設於下靜電真空吸盤28之: 直的孔穴内。 1〇 i靜電真空吸盤(或上靜電真空爽盤)34係直接或藉由 適當的定盤設於上殼罩24，並藉由軸％與升降驅動裝置对 相結合。上靜電真空吸盤34具有未圖示之公知電極，藉由 使該電極通電所產生之靜電力將基板保持於上靜電直空吸 盤34下。又，上靜電真空吸盤34具有真空吸附孔4〇。 15第3圖係顯示上靜電真空吸盤34的例子之概略平面 圖。真空吸附孔40係整體地分布配置於上靜電真空吸心 表面。下靜電真空吸盤28之真空吸附孔亦相同。上靜電直 空吸盤34之真空吸附孔4〇及下靜電真空吸盤28之直空吸附 孔分別藉由未圖示之閥與真空源相連接。 2〇 讀42係設於上靜電真空吸盤34之中央部。吸盤42传 配置成其表面與上靜電真空吸盤34之表面成為同—面: 且，該吸盤42可移動，以從上靜電真空吸盤34表面朝下方 突出。吸盤42之轴部係貫通延伸於上靜電真空吸盤34中， 且與未圖示之驅動機構相結合。 10 200424623 第2圖中，上殼罩24與下殼罩26分開，真空室22呈開放 狀態。在該狀態下，苐1及第2基板1〇、12分別藉由基板搬 送臂部搬送至真空室22。如第1圖所示，其中一基板1〇為滴 有液晶之基板，且載置於下靜電真空吸盤28上。另一基板 5 U則配置於上靜電真空吸盤34下。 第4圖係顯示基板12藉由基板搬送臂部44配置於上靜 電真空吸盤34下之情形。由於在可保持於上靜電真空吸盤 34之基板12的基板下面側形成有微小圖案，故必須保持基 板12之周邊部來搬送該基板，使基板搬送臂部44不要接觸 10到微小圖案，因此，基板12之中央部會沒有支撐物，如此 一來，基板12之中央部會有因重力而彎曲的傾向。 第5圖係顯示基板12抵達上靜電真空吸盤34下方時吸 盤42下降並吸附基板12之中央部的情形。第6圖係顯示基板 12真空吸附於上靜電真空吸盤34之情形。吸盤42係將基板 15 12之中央部吸起，使基板12從下凸狀態成為上凸狀態。然 後，基板搬送臂部44與吸盤42同時上升，且上靜電真空吸 盤34真空吸附基板12。 如此一來，可使基板12之中央部最先吸附於上靜電真 空吸盤34，且基板12之吸附朝基板12之周邊部擴展，並如 20第6圖所示，基板12以平坦之姿勢真空吸附於上靜電真空吸 盤34。雖然於實施例中，在上靜電真空吸盤34之中央部設 置吸盤42，但，可將多數吸盤42設於多數位置，且控制吸 附，藉此一面修正彎曲，一面從任一位置進行吸附。另， 由於可保持於下靜電真空吸盤28之基板1〇呈下凸狀態， 11 200424623 又’藉由未圖示之升降桿下降至下靜電真空吸盤28上，故 不會特別藉由吸盤來調整基板1〇的姿勢。 板12 10首先藉由真空吸附力吸附於上下靜電真空 吸盤34、28。然後，使電流流向上下靜電真空吸盤料、28 5的電極，如此-來，基板12、1〇可藉由靜電吸附力吸附於 上下靜電真空吸盤34、28。因此，在藉由真空吸附將基板 12、緊密地配置於上下靜電真^吸盤34、28表面之狀態 下使靜電吸附力產生作用，藉此，可在吸附力上得到偏差 ;且穩定的靜電吸附力。然後，停止真空吸附。 1〇 然後’將可動之上殼罩24推壓至下殼罩26，以封閉真 王至22。然後，排出真空室22内部的氣體，使真空室u内 4成為真空狀悲。接著，使上靜電真空吸盤34朝下靜電真 空吸盤28移動，且將基板12朝基板1〇推壓，使基板以之表 面與基板10之環狀密封劑13接觸，並使基板12之間隔材與 15基板10之表面接觸。首先，在進行初步貼合後，藉由CCD 照相機等讀取基板12、1〇之調正標誌，且在該結果下，一 面微調下靜電真空吸盤28的位置，一面對準調正標誌。最 後 面使上靜電真空吸盤34相對於下靜電真空吸盤28繼 續下降，並進行加壓，一面進行貼合。 在藉由至此之一連串的動作結束基板12、10之貼合 後，使真空室22開放於大氣，以開放真空室22。接著，停 止通電至上下靜電真空吸盤34、28之電極，而解除基板12、 之保持。然後，使上靜電真空吸盤34上升，而所貼合之 基板12、10位於下靜電真空吸盤28上。接著，使設於下靜 12 200424623 電真空吸盤28之升降桿上升，以抬起貼合完畢之基板。所 才口起之貼合元畢的基板猎由設置於下游側之搬送機器人朝 下一步驟搬送，且照射紫外線使環狀密封劑13硬化。 第7圖係顯示本發明之另一實施例。第8圖為第7圖之部 5分放大圖。第7圖及第8圖中，與第2圖之構件相同的構件則 賦予同樣的參照符號，並省略重複的說明。第2圖中，下靜 電真二吸盤（或下靜電真空夾盤)28藉由軸30與χγ0驅動裝 置32相結合’且軸30的周圍藉由例如蛇腹狀彈性體（未圖示） 密封成氣密狀態。 1〇 第7圖及第8圖中，下靜電真空吸盤（或下靜電真空夾 盤)28藉由軸30與ΧΥ0驅動裝置32相結合，且由剛性管5〇 來覆蓋軸30，並將磁流體密封劑52配置於軸3〇與剛性管5〇 之間。軸30的周圍由磁流體密封劑52密封成氣密狀態。 即，用以使下靜電真空吸盤28移動之移動裝置由用以 15結合位於真空室22内之下靜電真空吸盤28與位於真空室22 外之ΧΥΘ驅動裝置（驅動機構)32之轴30、用以覆蓋轴3〇之 剛性管（剛性體）及配置於軸30與剛性管50之間的磁流體密 封劑52所構成。而且’永久磁石54配置於剛性管5〇之内面 側，且與永久磁石54接觸之磁極片56、58會將磁力傳達至 20磁流體密封劑52。磁流體密封劑52可藉由永久磁石54的磁 力保持於預定位置。 由於將下靜電真空吸盤28之移動裝置設置於真空室22 内會使真空室22的容積變大，而對製作真空時不利，故設 置於真空室22外之大氣中。移動裝置的運動係透過轴3〇傳 13 200424623 達至下靜電真空吸盤28。為了使軸30之周圍成為真空領域 60，且將該部分保持成真空，因此使用磁流體密封劑52。 藉由使用磁流體密封劑52，可提供剛性體50不會產生應 力，且零件可财久性佳地運作之基板貼合裝置。另，亦可 5 將第7圖及第8圖之實施例的特徵加入第2實施例。 發明之效果Fig. 4 shows a state in which the substrate is arranged under the upper electrostatic vacuum chuck by the substrate transfer arm. Figure 5 shows the situation where the substrate is lowered and the central part of the substrate is attracted when the substrate reaches below the upper electrostatic vacuum chuck. Fig. 6 shows a state in which the substrate is attracted to the upper electrostatic vacuum chuck. Fig. 7 shows another embodiment of the present invention. 8 Figure 8 is an enlarged view of part of Figure 7. I: Embodiment 3 Embodiment of the invention The following embodiment of the present invention will be described with reference to the drawings. The liquid crystal display device is composed of a pair of substrates 10, 12 and a liquid crystal 14 interposed between the pair of substrates. The liquid crystal display device is manufactured by a drip injection method. One of the pair of substrates is a TFT substrate forming a TFT, and the other substrate is a filter and optical substrate forming a filter. Fig. 1 is a perspective view showing a substrate of a liquid crystal display device of an embodiment. One of the substrates 10 includes a ring-shaped sealant 13. The liquid crystal 14 is dropped in droplet form from the moving distributor 16 to the area surrounded by the annular sealant 13 on the substrate 10. The sealant forming the annular sealant 13 is made of a UV-curable adhesive resin or an adhesive resin which is cured by using UV and heat together. Another substrate 12 is prepared (not shown in Fig. 2). A sealant is applied to the substrate 10, and after the substrate 10 is bonded to another substrate 12, it is cured. On another substrate 12, an adhesive spacer in which an adhesive is applied to the spacer is applied. Instead of spacers, pillars can also be provided to eliminate the need for spacer spreading steps. Fig. 2 shows a substrate bonding apparatus of a liquid crystal display device according to the present invention. In FIG. 2, the substrate bonding device 20 of the liquid crystal display device includes vacuum to 22 °. The vacuum chamber 22 is composed of a movable upper casing 24 and a fixed lower casing. FIG. 2 shows a state in which the vacuum chamber η is opened. From the state shown in Fig. 2, the upper cover and the lower cover 24 are lowered toward the lower cover 26, and the vacuum chamber 22 is closed. The vacuum chamber 22 is connected to a vacuum pump in order to exhaust gas from the vacuum chamber. The lower electrostatic vacuum chuck (or the lower electrostatic vacuum chuck) 28 is suitable for tilting the children's shirts directly or by 200424623, and «⑽30 and χΥΘ_device 32 are combined. The lower electrostatic vacuum chuck 28 has a well-known electrode (not shown). The substrate is held on the lower electrostatic vacuum chuck 28 by the electrostatic force generated by energizing the electrode, and the liquid crystal 14 is dropped on the lower electrostatic vacuum chuck 28 On the base 5 boards. The lower electrostatic vacuum chuck 28 has a vacuum suction hole. The vacuum suction hole is opened toward the surface of the lower electrostatic vacuum chuck 28, and the substrate disposed on the lower electrostatic vacuum chuck 28 is held by a vacuum force supplied from a vacuum source. The lifting rod (not shown) can be lifted and disposed in a straight hole provided in the lower electrostatic vacuum chuck 28. The 10i electrostatic vacuum chuck (or upper electrostatic vacuum refresher) 34 is directly or through an appropriate plate set on the upper casing 24, and is combined with a lift driving device pair by a shaft%. The upper electrostatic vacuum chuck 34 has a known electrode (not shown), and the substrate is held under the upper electrostatic vacuum chuck 34 by an electrostatic force generated by energizing the electrode. The upper electrostatic vacuum chuck 34 has a vacuum suction hole 40. Fig. 3 is a schematic plan view showing an example of the upper electrostatic vacuum chuck 34. The vacuum suction holes 40 are integrally distributed on the surface of the upper electrostatic vacuum core. The vacuum suction hole of the lower electrostatic vacuum chuck 28 is also the same. The vacuum suction holes 40 of the upper electrostatic vacuum chuck 34 and the vacuum suction holes of the lower electrostatic vacuum chuck 28 are connected to a vacuum source through a valve (not shown). 20 〇 42 is provided at the center of the upper electrostatic vacuum chuck 34. The suction cup 42 is arranged so that its surface becomes the same surface as the surface of the upper electrostatic vacuum chuck 34: and the suction cup 42 is movable so as to protrude downward from the surface of the upper electrostatic vacuum chuck 34. The shaft portion of the chuck 42 extends through the upper electrostatic vacuum chuck 34 and is combined with a driving mechanism (not shown). 10 200424623 In the second figure, the upper casing 24 and the lower casing 26 are separated, and the vacuum chamber 22 is opened. In this state, 苐 1 and the second substrates 10 and 12 are transferred to the vacuum chamber 22 by the substrate transfer arm. As shown in Fig. 1, one of the substrates 10 is a substrate on which liquid crystal is dropped, and is placed on the lower electrostatic vacuum chuck 28. The other substrate 5 U is disposed under the upper electrostatic vacuum chuck 34. Fig. 4 shows a state in which the substrate 12 is disposed under the upper electrostatic vacuum chuck 34 by the substrate transfer arm portion 44. Since a micro pattern is formed on the lower surface side of the substrate 12 of the substrate 12 that can be held on the upper electrostatic vacuum chuck 34, the peripheral portion of the substrate 12 must be held to transport the substrate so that the substrate transfer arm portion 44 does not touch 10 to the micro pattern. There is no support in the center portion of the substrate 12, so that the center portion of the substrate 12 tends to bend due to gravity. Fig. 5 shows a state where the chuck 42 is lowered and the center portion of the substrate 12 is attracted when the substrate 12 reaches below the upper electrostatic vacuum chuck 34. Fig. 6 shows a state in which the substrate 12 is vacuum-adsorbed on the upper electrostatic vacuum chuck 34. The chuck 42 sucks up the central portion of the substrates 15 and 12 to change the substrate 12 from a downwardly convex state to an upwardly convex state. Then, the substrate transfer arm 44 and the chuck 42 are simultaneously raised, and the upper electrostatic vacuum chuck 34 vacuum-adsorbs the substrate 12. In this way, the central portion of the substrate 12 can be first attracted to the upper electrostatic vacuum chuck 34, and the adsorption of the substrate 12 can be extended toward the peripheral portion of the substrate 12, and as shown in FIG. 20 of FIG. 6, the substrate 12 is vacuumed in a flat posture. Adsorbed to the upper electrostatic vacuum chuck 34. Although the suction cup 42 is provided in the center of the upper electrostatic vacuum chuck 34 in the embodiment, the majority of the suction cups 42 can be set at a plurality of positions and the suction can be controlled, thereby correcting the bending while sucking from any position. In addition, since the substrate 10 that can be held on the lower electrostatic vacuum chuck 28 is in a convex state, 11 200424623 is lowered to the lower electrostatic vacuum chuck 28 by a lifting rod (not shown), so it will not be adjusted by the suction cup. The posture of the substrate 10. The plates 12 to 10 are first attracted to the upper and lower electrostatic vacuum chucks 34 and 28 by a vacuum suction force. Then, the current is caused to flow up and down the electrodes of the electrostatic vacuum chuck material, 28, so that the substrates 12, 10 can be adsorbed on the upper and lower electrostatic vacuum chucks 34, 28 by the electrostatic adsorption force. Therefore, in a state in which the substrate 12 is closely arranged on the surfaces of the upper and lower electrostatic chucks 34 and 28 by vacuum adsorption, the electrostatic adsorption force is exerted, whereby deviations in the adsorption force can be obtained; and stable electrostatic adsorption force. Then, the vacuum adsorption was stopped. 10 Then, 'the movable upper casing 24 is pushed to the lower casing 26 to close the true king 22. Then, the gas inside the vacuum chamber 22 is exhausted, and the inside of the vacuum chamber u becomes vacuum-like. Next, the upper electrostatic vacuum chuck 34 is moved toward the lower electrostatic vacuum chuck 28, and the substrate 12 is pressed toward the substrate 10, so that the surface of the substrate is in contact with the annular sealant 13 of the substrate 10, and the spacer of the substrate 12 is made. It is in contact with the surface of the 15 substrate 10. First, after preliminary bonding is performed, the alignment marks of the substrates 12 and 10 are read by a CCD camera or the like, and based on this result, the position of the electrostatic vacuum chuck 28 is finely adjusted while the alignment marks are aligned. Finally, the upper electrostatic vacuum chuck 34 is lowered relative to the lower electrostatic vacuum chuck 28, and the pressure is applied to the lower electrostatic vacuum chuck 28 for bonding. After the bonding of the substrates 12 and 10 is completed by one of the series of operations, the vacuum chamber 22 is opened to the atmosphere, and the vacuum chamber 22 is opened. Then, the energization to the electrodes of the upper and lower electrostatic vacuum chucks 34 and 28 is stopped, and the holding of the substrate 12 is released. Then, the upper electrostatic vacuum chuck 34 is raised, and the bonded substrates 12 and 10 are located on the lower electrostatic vacuum chuck 28. Next, the lifting rod set on the lower static 12 200424623 electric vacuum chuck 28 is raised to lift the bonded substrate. All of the substrates that have been bonded to each other are transferred to the next step by a transfer robot installed on the downstream side, and the annular sealant 13 is hardened by irradiating ultraviolet rays. Fig. 7 shows another embodiment of the present invention. Figure 8 is a 5-point enlarged view of the part in Figure 7. In FIGS. 7 and 8, the same components as those in FIG. 2 are given the same reference numerals, and redundant descriptions are omitted. In FIG. 2, the lower electrostatic two-chuck (or lower electrostatic vacuum chuck) 28 is combined with the χγ0 driving device 32 through a shaft 30 and the periphery of the shaft 30 is sealed with, for example, a bellows-shaped elastic body (not shown) Airtight. 10 In FIGS. 7 and 8, the lower electrostatic vacuum chuck (or lower electrostatic vacuum chuck) 28 is combined with the XY0 driving device 32 through a shaft 30, and the shaft 30 is covered by a rigid tube 50, and the magnetic The fluid sealant 52 is disposed between the shaft 30 and the rigid tube 50. The periphery of the shaft 30 is hermetically sealed with a magnetic fluid sealant 52. That is, the moving device for moving the lower electrostatic vacuum chuck 28 is composed of a shaft 30 for combining the lower electrostatic vacuum chuck 28 located inside the vacuum chamber 22 and the XY driving device (drive mechanism) 32 located outside the vacuum chamber 22, and A rigid tube (rigid body) covering the shaft 30 and a magnetic fluid sealant 52 disposed between the shaft 30 and the rigid tube 50 are configured. Furthermore, the 'permanent magnet 54' is disposed on the inner side of the rigid tube 50, and the magnetic pole pieces 56, 58 which are in contact with the permanent magnet 54 will transmit magnetic force to the 20 magnetic fluid sealant 52. The magnetic fluid sealant 52 can be held in a predetermined position by the magnetic force of the permanent magnet 54. Since the moving device of the lower electrostatic vacuum chuck 28 is arranged in the vacuum chamber 22, the volume of the vacuum chamber 22 becomes large, which is disadvantageous when making a vacuum. Therefore, it is placed in the atmosphere outside the vacuum chamber 22. The movement of the mobile device is transmitted through the shaft 30 13 200424623 to the lower electrostatic vacuum chuck 28. In order to make the area around the shaft 30 a vacuum area 60, and to maintain this portion in a vacuum, a magnetic fluid sealant 52 is used. By using the magnetic fluid sealant 52, it is possible to provide a substrate bonding apparatus in which the rigid body 50 does not generate a stress and the parts can operate with good financial performance. In addition, the features of the embodiments of Figs. 7 and 8 may be added to the second embodiment. Effect of the invention
如上所述，根據本發明，可得到基板不彎曲、零件之 耐久性佳、產率、運轉率高之基板貼合裝置。 【圖式簡單說明】 10 第1圖係顯示一實施例之液晶顯示裝置的其中一基板 之透視圖。 第2圖係顯示根據本發明之液晶顯示裝置的基板貼合 裝置。 第3圖係顯示上靜電真空吸盤的例子之概略平面圖。 15 第4圖係顯示基板藉由基板搬送臂部配置於上靜電真As described above, according to the present invention, it is possible to obtain a substrate bonding apparatus which does not warp a substrate, has excellent durability of parts, and has a high productivity and a high operation rate. [Brief Description of the Drawings] 10 FIG. 1 is a perspective view showing a substrate of a liquid crystal display device according to an embodiment. Fig. 2 shows a substrate bonding apparatus of a liquid crystal display device according to the present invention. Fig. 3 is a schematic plan view showing an example of an electrostatic vacuum chuck. 15 Figure 4 shows that the substrate is placed on the upper surface through the substrate transfer arm.
空吸盤下之情形。 第5圖係顯示基板抵達上靜電真空吸盤下方時吸附墊 下降並吸附基板之中央部的情形。 第6圖係顯示基板吸附於上靜電真空吸盤之情形。 20 第7圖係顯示本發明之另一實施例。 第8圖為第7圖之部分放大圖。 【圖式之主要元件代表符號表】 10、12…基板 14…液晶 13…環狀密封劑 16...分配器 14 200424623 20…基板貼合裝置 38···升降驅動裝置 22...真空室 40…真空吸附孔 24...上殼罩 42…吸盤 26...下殼罩 44···基板搬送臂部 28...下靜電真空吸盤 50…剛性管 30、36···軸 52...磁流體密封劑 32...XY0驅動裝置 54…永久磁石 34···上靜電真空吸盤 56、58·.·磁極片The situation under the empty suction cup. Fig. 5 shows a state in which the adsorption pad is lowered and the central portion of the substrate is adsorbed when the substrate reaches below the upper electrostatic vacuum chuck. Fig. 6 shows a state in which the substrate is attracted to the upper electrostatic vacuum chuck. 20 FIG. 7 shows another embodiment of the present invention. FIG. 8 is an enlarged view of a part of FIG. 7. [Representative symbols for main components of the drawing] 10, 12 ... Substrate 14 ... Liquid crystal 13 ... Ring sealant 16 ... Dispenser 14 200424623 20 ... Substrate bonding device 38 ... Lifting drive device 22 ... Vacuum Chamber 40 ... Vacuum suction hole 24 ... Upper casing 42 ... Sucker 26 ... Lower casing 44 ... Board transfer arm 28 ... Lower electrostatic vacuum chuck 50 ... Rigid tube 30, 36 ... Shaft 52 ... Magnetic fluid sealant 32 ... XY0 drive device 54 ... Permanent magnet 34 ... Upper electrostatic vacuum chuck 56, 58 ... pole pole piece
1515