TWI281694B - Control process, temperature control process, temperature regulator, heat treatment and recordable medium - Google Patents
Control process, temperature control process, temperature regulator, heat treatment and recordable medium Download PDFInfo
- Publication number
- TWI281694B TWI281694B TW094135439A TW94135439A TWI281694B TW I281694 B TWI281694 B TW I281694B TW 094135439 A TW094135439 A TW 094135439A TW 94135439 A TW94135439 A TW 94135439A TW I281694 B TWI281694 B TW I281694B
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature
- correction
- target
- interference
- detection
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims description 30
- 238000012937 correction Methods 0.000 claims abstract description 103
- 239000011159 matrix material Substances 0.000 claims abstract description 31
- 238000005259 measurement Methods 0.000 claims description 76
- 238000012545 processing Methods 0.000 claims description 64
- 238000001514 detection method Methods 0.000 claims description 51
- 238000004364 calculation method Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 51
- 238000012360 testing method Methods 0.000 description 21
- 230000007704 transition Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000001052 transient effect Effects 0.000 description 6
- 238000004422 calculation algorithm Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
- G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
- G05D23/1935—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces using sequential control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Remote Sensing (AREA)
- Automation & Control Theory (AREA)
- Control Of Temperature (AREA)
- Feedback Control In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004298803A JP2006113724A (ja) | 2004-10-13 | 2004-10-13 | 制御方法、温度制御方法、温度調節器、熱処理装置、プログラムおよび記録媒体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200627513A TW200627513A (en) | 2006-08-01 |
| TWI281694B true TWI281694B (en) | 2007-05-21 |
Family
ID=35671138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094135439A TWI281694B (en) | 2004-10-13 | 2005-10-12 | Control process, temperature control process, temperature regulator, heat treatment and recordable medium |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7324877B2 (de) |
| EP (1) | EP1647868B1 (de) |
| JP (1) | JP2006113724A (de) |
| KR (1) | KR100707097B1 (de) |
| CN (1) | CN100454184C (de) |
| TW (1) | TWI281694B (de) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090175771A1 (en) * | 2006-03-16 | 2009-07-09 | Applied Materials, Inc. | Abatement of effluent gas |
| JP5224656B2 (ja) * | 2006-05-31 | 2013-07-03 | 東京エレクトロン株式会社 | 情報処理装置、半導体製造システム、情報処理方法、プログラム、及び記録媒体 |
| US7925389B2 (en) * | 2006-06-15 | 2011-04-12 | International Business Machines Corporation | Method of detecting recirculation of heated air within a rack enclosure |
| JP4553266B2 (ja) * | 2007-04-13 | 2010-09-29 | 東京エレクトロン株式会社 | 熱処理装置、制御定数の自動調整方法及び記憶媒体 |
| JP4858333B2 (ja) * | 2007-07-05 | 2012-01-18 | オムロン株式会社 | 干渉情報の表示方法および表示装置 |
| KR100893366B1 (ko) * | 2007-08-08 | 2009-04-17 | 세메스 주식회사 | 반도체 제조 설비의 온도 제어 장치 및 그의 온도 제어방법 |
| FI20096021A0 (fi) | 2009-10-06 | 2009-10-06 | Wallac Oy | Optinen mittausinstrumentti |
| JP5037669B2 (ja) * | 2010-10-21 | 2012-10-03 | 日野自動車株式会社 | 出力制限制御装置、ハイブリッド自動車および出力制限制御方法、並びにプログラム |
| CN102738027B (zh) * | 2011-04-13 | 2015-04-01 | 中芯国际集成电路制造(上海)有限公司 | 热处理设备及其温度校准方法和装置 |
| JP5973173B2 (ja) * | 2012-01-23 | 2016-08-23 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理装置の制御方法 |
| DE102012101717A1 (de) * | 2012-03-01 | 2013-09-05 | Aixtron Se | Verfahren und Vorrichtung zur Regelung der Oberflächentemperatur eines Suszeptors einer Substratbeschichtungseinrichtung |
| DE102012217787B3 (de) * | 2012-09-28 | 2014-02-13 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Diagnose einer Einrichtung zur Bestimmung der Temperatur einer Komponente eines elektrischen Aggregates |
| CN104131268B (zh) * | 2013-05-03 | 2017-02-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 分区域加热方法、装置和半导体设备 |
| DE102013109155A1 (de) | 2013-08-23 | 2015-02-26 | Aixtron Se | Substratbehandlungsvorrichtung |
| CN103760753B (zh) * | 2013-12-31 | 2017-04-12 | 深圳市华星光电技术有限公司 | 基板烘烤装置及其温度调节方法 |
| US9435692B2 (en) * | 2014-02-05 | 2016-09-06 | Lam Research Corporation | Calculating power input to an array of thermal control elements to achieve a two-dimensional temperature output |
| CN104090604B (zh) * | 2014-06-30 | 2017-04-05 | 北京七星华创电子股份有限公司 | 热处理设备的温度补偿方法、温度控制方法及系统 |
| CN104102247B (zh) * | 2014-06-30 | 2016-07-20 | 北京七星华创电子股份有限公司 | 热处理设备的温度补偿方法、温度控制方法及系统 |
| CN105239058B (zh) * | 2015-09-25 | 2017-10-20 | 圆融光电科技股份有限公司 | 校准mocvd设备设定温度的方法 |
| US10908195B2 (en) * | 2016-06-15 | 2021-02-02 | Watlow Electric Manufacturing Company | System and method for controlling power to a heater |
| CN108873979B (zh) * | 2017-05-12 | 2020-08-07 | 台达电子工业股份有限公司 | 热控装置及其热控方法 |
| JP6858077B2 (ja) * | 2017-05-25 | 2021-04-14 | アズビル株式会社 | コントローラ調整システムおよび調整方法 |
| WO2018220690A1 (ja) * | 2017-05-29 | 2018-12-06 | 理化工業株式会社 | 制御系設計装置及び制御システム |
| US10998205B2 (en) * | 2018-09-14 | 2021-05-04 | Kokusai Electric Corporation | Substrate processing apparatus and manufacturing method of semiconductor device |
| CN110053798B (zh) * | 2019-05-29 | 2021-08-17 | 福建中烟工业有限责任公司 | 小盒烟包热封方法 |
| CN110181391A (zh) * | 2019-06-03 | 2019-08-30 | 西安奕斯伟硅片技术有限公司 | 研磨液供给装置、研磨设备和研磨液的温度控制方法 |
| CN110309610A (zh) * | 2019-07-08 | 2019-10-08 | 重庆科技学院 | 一种基于改进遗传算法的粮食库温度场重构方法 |
| CN111256857A (zh) * | 2020-02-25 | 2020-06-09 | 上海华力集成电路制造有限公司 | 通过测试bjt发射结电压来监控探针台卡盘温度的方法 |
| CN114200976A (zh) * | 2020-09-17 | 2022-03-18 | 欧姆龙株式会社 | 控制方法、控制装置以及记录介质 |
| US20210223805A1 (en) * | 2020-12-23 | 2021-07-22 | Intel Corporation | Methods and apparatus to reduce thermal fluctuations in semiconductor processors |
| CN114808143B (zh) * | 2022-06-28 | 2022-09-02 | 江苏邑文微电子科技有限公司 | 晶圆加热设备的参数确定模型训练方法、加热方法和装置 |
| CN117873202B (zh) * | 2023-12-20 | 2024-07-12 | 苏州然玓光电科技有限公司 | 基于性能稳定性的光学仪器温度控制方法及系统 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61145606A (ja) * | 1984-12-19 | 1986-07-03 | Ohkura Electric Co Ltd | 干渉対応形パタ−ン切換式温度制御装置 |
| US5895596A (en) * | 1997-01-27 | 1999-04-20 | Semitool Thermal | Model based temperature controller for semiconductor thermal processors |
| US5900177A (en) * | 1997-06-11 | 1999-05-04 | Eaton Corporation | Furnace sidewall temperature control system |
| DE19755980A1 (de) * | 1997-12-17 | 1999-06-24 | Mannesmann Vdo Ag | Pedal |
| JP4551515B2 (ja) * | 1998-10-07 | 2010-09-29 | 株式会社日立国際電気 | 半導体製造装置およびその温度制御方法 |
| US6349270B1 (en) * | 1999-05-27 | 2002-02-19 | Emcore Corporation | Method and apparatus for measuring the temperature of objects on a fast moving holder |
| JP3870002B2 (ja) * | 2000-04-07 | 2007-01-17 | キヤノン株式会社 | 露光装置 |
| US6951998B2 (en) * | 2000-04-14 | 2005-10-04 | Omron Corporation | Controller, temperature regulator and heat treatment apparatus |
| JP4493192B2 (ja) * | 2000-09-13 | 2010-06-30 | 東京エレクトロン株式会社 | バッチ式熱処理装置及びその制御方法 |
| JP3834216B2 (ja) * | 2000-09-29 | 2006-10-18 | 株式会社日立国際電気 | 温度制御方法 |
-
2004
- 2004-10-13 JP JP2004298803A patent/JP2006113724A/ja active Pending
-
2005
- 2005-09-27 KR KR1020050089623A patent/KR100707097B1/ko not_active IP Right Cessation
- 2005-09-28 EP EP05021191A patent/EP1647868B1/de not_active Not-in-force
- 2005-10-06 US US11/245,727 patent/US7324877B2/en not_active Expired - Fee Related
- 2005-10-12 TW TW094135439A patent/TWI281694B/zh not_active IP Right Cessation
- 2005-10-13 CN CNB2005101140151A patent/CN100454184C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20060161365A1 (en) | 2006-07-20 |
| US7324877B2 (en) | 2008-01-29 |
| KR100707097B1 (ko) | 2007-04-13 |
| CN100454184C (zh) | 2009-01-21 |
| KR20060051656A (ko) | 2006-05-19 |
| EP1647868B1 (de) | 2011-08-03 |
| JP2006113724A (ja) | 2006-04-27 |
| EP1647868A1 (de) | 2006-04-19 |
| TW200627513A (en) | 2006-08-01 |
| CN1760774A (zh) | 2006-04-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |