TWI263079B - Chemical polishing method for liquid crystal glass substrate and chemical polishing apparatus - Google Patents

Chemical polishing method for liquid crystal glass substrate and chemical polishing apparatus

Info

Publication number
TWI263079B
TWI263079B TW090110411A TW90110411A TWI263079B TW I263079 B TWI263079 B TW I263079B TW 090110411 A TW090110411 A TW 090110411A TW 90110411 A TW90110411 A TW 90110411A TW I263079 B TWI263079 B TW I263079B
Authority
TW
Taiwan
Prior art keywords
glass substrate
acid
chemical polishing
liquid crystal
crystal glass
Prior art date
Application number
TW090110411A
Other languages
Chinese (zh)
Inventor
Tomohiro Nishiyama
Mikio Deguchi
Katsuhiro Itokawa
Makoto Odani
Koichi Mizoguchi
Original Assignee
Nishiyama Stainless Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nishiyama Stainless Chemical Co Ltd filed Critical Nishiyama Stainless Chemical Co Ltd
Application granted granted Critical
Publication of TWI263079B publication Critical patent/TWI263079B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1313—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells specially adapted for a particular application
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02019—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/52—Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/60—Glass recycling

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Liquid Crystal (AREA)

Abstract

To provide a chemical polishing method for a liquid crystal glass substrate and chemical polishing apparatus, which produce a thin substrate regardless of the size of the liquid crystal glass substrate and flatten the surface of the glass substrate, and reuse the glass. In a storage vessel, a chemical polishing liquid has a fluoride mixture at least one selected from the group consisting of fluoric acid, ammonium fluoride, potassium fluoride, and sodium fluoride, and inorganic acid at least one selected from the group consisting of hydrochloric acid, sulfuric acid, phosphoric acid and nitric acid, and organic acid at least one selected from the group consisting of acetic acid and succinic acid, and anion-based surfactant of sulfonate-based surfactant, and amine-based ampho-surfactant. The liquid crystal glass substrate is placed in the chemical processing fluid storage vessel, and bubbles are generated form a bubble generating device, and the outer surface of the liquid crystal glass substrate is polished at 0.5-10 micrometer/min.
TW090110411A 2001-04-12 2001-05-01 Chemical polishing method for liquid crystal glass substrate and chemical polishing apparatus TWI263079B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001114498 2001-04-12

Publications (1)

Publication Number Publication Date
TWI263079B true TWI263079B (en) 2006-10-01

Family

ID=18965559

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090110411A TWI263079B (en) 2001-04-12 2001-05-01 Chemical polishing method for liquid crystal glass substrate and chemical polishing apparatus

Country Status (4)

Country Link
KR (1) KR100380844B1 (en)
CN (2) CN100462319C (en)
SG (1) SG94843A1 (en)
TW (1) TWI263079B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI699339B (en) * 2016-09-30 2020-07-21 日商松下知識產權經營股份有限公司 Polishing liquid for glass and polishing method

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SG121817A1 (en) * 2002-11-22 2006-05-26 Nishiyama Stainless Chemical Co Ltd Glass substrate for flat planel display, and process for producing the same
CN100343420C (en) * 2004-07-21 2007-10-17 常耀辉 Fast chemical grinding polishing bath liquid for stainless steel surface and its method
JP2007197236A (en) * 2006-01-25 2007-08-09 Nishiyama Stainless Chem Kk Method for manufacturing glass substrate for display and glass substrate
CN101089688B (en) * 2006-06-14 2010-09-29 比亚迪股份有限公司 Manufacturing method of superthin liquid crystal box
CN100392477C (en) * 2006-07-07 2008-06-04 南京大学 Liquid crystal display panel resource processing method
KR101233687B1 (en) * 2010-10-28 2013-02-15 삼성디스플레이 주식회사 Apparatus of etching a glass substrate
JP5829458B2 (en) * 2011-08-25 2015-12-09 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment
CN103033403B (en) * 2011-09-29 2015-09-02 鞍钢股份有限公司 A kind of preparation method of thin-sheet metal film test sample
CN102643028A (en) * 2012-05-14 2012-08-22 深圳市拓捷科技发展有限公司 Glass thinning equipment and method
CN102701598B (en) * 2012-06-26 2015-09-30 广东拓捷科技有限公司 A kind of glass thinning apparatus of improvement
CN102701597B (en) * 2012-06-26 2014-10-08 汕头市拓捷科技有限公司 Rapid glass thinning equipment
CN103046053B (en) * 2012-09-21 2015-04-01 中国兵器工业第二一三研究所 Chemical polishing method of stainless steel by high-temperature oxidation
CN103508676A (en) * 2013-07-24 2014-01-15 芜湖长信科技股份有限公司 Method for avoiding defect in LCD glass substrate thinning process and acid solution configuration method
TW201519308A (en) * 2013-11-13 2015-05-16 Grand Plastic Technology Corp Circulation type uniformly etching device
CN105541120A (en) * 2015-12-28 2016-05-04 常熟市金亿复合材料有限公司 Coating process for hollow glass plate
CN107286853A (en) * 2017-07-12 2017-10-24 天津津航技术物理研究所 A kind of devitrified glass high brightness chemical polishing solution and preparation method
CN107235641A (en) * 2017-08-14 2017-10-10 湖北工程学院 A kind of glass thinning etching solution and preparation method thereof
CN107902914A (en) * 2017-12-14 2018-04-13 天津美泰真空技术有限公司 A kind of glass substrate thinning technique etching solution
CN107814491A (en) * 2017-12-14 2018-03-20 天津美泰真空技术有限公司 A kind of flat glass substrate etching solution
CN109439329A (en) * 2018-10-29 2019-03-08 苏州博洋化学股份有限公司 FPD array process novel I GZO etching solution
CN109111859A (en) * 2018-10-30 2019-01-01 秦皇岛市大龙建材有限公司 Glass polishing solution
CN111029230B (en) * 2019-12-13 2022-04-05 山西长城微光器材股份有限公司 Micro-channel plate in-channel polishing method
CN111925126A (en) * 2020-08-12 2020-11-13 郑州恒昊光学科技有限公司 Paste for repairing slight scratch of optical glass
CN116042098A (en) * 2023-02-08 2023-05-02 广东粤港澳大湾区黄埔材料研究院 Nano alumina polishing solution and application thereof in polishing of infrared chalcogenide glass

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JPS5854974A (en) * 1981-09-28 1983-04-01 三菱電機株式会社 Golf exerciser
JPH0641770A (en) * 1992-07-27 1994-02-15 Daikin Ind Ltd Treatment for surface of silicon wafer
MY109592A (en) * 1992-11-16 1997-03-31 Tokyo Electron Ltd Method and apparatus for manufacturing a liquid crystal display substrate, and apparatus and method for evaluating semiconductor crystals.
JP3531961B2 (en) * 1994-02-01 2004-05-31 横浜ゴム株式会社 Endless processing method of steel cord belt and cooling / refrigeration apparatus for implementing the endless processing method
JPH10109012A (en) * 1996-10-04 1998-04-28 Stec Kk Deodorizing method and deodorizing device for garbage disposal
JPH11111658A (en) * 1997-10-06 1999-04-23 Dainippon Screen Mfg Co Ltd Method and device for processing substrate
US6174371B1 (en) * 1997-10-06 2001-01-16 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI699339B (en) * 2016-09-30 2020-07-21 日商松下知識產權經營股份有限公司 Polishing liquid for glass and polishing method

Also Published As

Publication number Publication date
CN1724432A (en) 2006-01-25
CN1277142C (en) 2006-09-27
KR100380844B1 (en) 2003-04-18
CN1380572A (en) 2002-11-20
CN100462319C (en) 2009-02-18
KR20020080215A (en) 2002-10-23
SG94843A1 (en) 2003-03-18

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