CN101089688B - Manufacturing method of superthin liquid crystal box - Google Patents
Manufacturing method of superthin liquid crystal box Download PDFInfo
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- CN101089688B CN101089688B CN2006100212176A CN200610021217A CN101089688B CN 101089688 B CN101089688 B CN 101089688B CN 2006100212176 A CN2006100212176 A CN 2006100212176A CN 200610021217 A CN200610021217 A CN 200610021217A CN 101089688 B CN101089688 B CN 101089688B
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- liquid crystal
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- transparency carrier
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- bearer bar
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Abstract
A method for preparing superthin liquid crystal box includes coating photoresist on transparent base plate and carrying out exposure and development as well as acid-etching in sequence, forming orientation layer, screen-printing glue line and conductive point as well as waterproof and anticorrosion protective line, fitting top and bottom said base plates to form liquid crystal box, curing screen-printed lines and points by high temperature and high pressure, using chemical corrosive agent to corrode liquid crystal box till required thickness of said base plate is realized in order to form superthin liquid crystal box.
Description
[technical field]
The present invention relates to a kind of method for making of liquid crystal cell.
[background technology]
For the more space that utilizes of reducing weight and saving circuit, need do liquid crystal display device thinner, these are mainly used on the ultra thin handset.
Make ultra-thin LCD spare, just need to make ultra-thin liquid crystal cell, mainly contain two kinds of methods at present.
First method is exactly directly to adopt ultra-thin transparency carrier to make liquid crystal cell, as adopting the transparency carrier (ito glass) of 0.35mm or 0.3mm, uses normal liquid crystal production technology to produce.The advantage of this kind method for making is exactly that production technology need not change, but this kind method has significant limitation, and the one, because for transparency carrier manufacturer, under present appointed condition, thickness is difficult to produce less than the 0.4mm transparency carrier; The 2nd, because for liquid crystal device manufacturing factory, under present appointed condition, thickness almost can not carry out PROCESS FOR TREATMENT less than the 0.4mm transparency carrier, because transparency carrier is too thin, physical strength significantly reduces, and all can directly cause the fragmentation of transparency carrier in the operations such as therefore cleaning in front, subsides box.
Second method is exactly that mechanical lapping, finishing method are made liquid crystal cell, passes through CeO
2(ceria) burnishing powder is with the reduced thickness of single liquid crystal display device.Though this kind method does not have the restriction of equipment and technology,, cause to show disorder because in grinding, polishing process, huge stress can directly have influence on PI (Plyimide) both alignment layers of liquid crystal display device inside.Go between owing in process of lapping, scratching simultaneously, so yields also is restricted.
[summary of the invention]
The present invention is exactly in order to solve technological requirement height in the prior art, problem that yields is low, to have proposed a kind of method of making superthin liquid crystal box.
For achieving the above object, the invention provides a kind of method for making of superthin liquid crystal box, comprise the steps:
A, transparency carrier is carried out pre-preparation;
B, silk-screen frame adhesive and conductiving point, silk-screen water-tight corrosion-proof bearer bar simultaneously;
C, general transparency carrier applying up and down form liquid crystal cell;
D, frame adhesive, conductiving point and water-tight corrosion-proof bearer bar are solidified by High Temperature High Pressure;
E, liquid crystal cell is carried out chemical corrosion, etch into needed transparency carrier thickness always, form superthin liquid crystal box with chemical mordant;
Wherein, the water-tight corrosion-proof bearer bar is the waterproof acid-proof bearer bar on the frame around the liquid crystal cell; the method of silk-screen waterproof acid-proof bearer bar is: utilize exposure technique to manufacture the needed silk screen of waterproof acid-proof bearer bar earlier; by silk screen waterproof acid-proof coating is printed onto on the transparency carrier then, described waterproof acid-proof coating is the used frame adhesive of liquid crystal production run.
Preferably, comprise step in pre-preparation described in the steps A:
A1, on transparency carrier resist coating, expose successively, develop;
A2, carry out harsh operation after will photoresist solidifying, carve dot pattern and the required pattern of lead-in wire;
A3, making both alignment layers.
Temperature range during chemical corrosion is 20 ℃-50 ℃.
A kind of method for making of superthin liquid crystal box, comprise the steps: silk-screen water-tight corrosion-proof bearer bar on transparency carrier, transparency carrier is fitted and is formed liquid crystal cell up and down, with chemical mordant liquid crystal cell is carried out chemical corrosion, etch into needed transparency carrier thickness always, form superthin liquid crystal box; Wherein, the water-tight corrosion-proof bearer bar is the waterproof acid-proof bearer bar on the frame around the liquid crystal cell; the method of silk-screen waterproof acid-proof bearer bar is: utilize exposure technique to manufacture the needed silk screen of waterproof acid-proof bearer bar earlier; by silk screen waterproof acid-proof coating is printed onto on the transparency carrier then, waterproof acid-proof coating is the used frame adhesive of liquid crystal production run.
Temperature range during chemical corrosion is 20 ℃-50 ℃.
The invention has the beneficial effects as follows:
Because in the method for making of superthin liquid crystal box provided by the present invention, before steps of chemical attack, transparency carrier thickness all is the thickness of normal transparency carrier, therefore can not cause breakable phenomenon in the ultra-thin transparency carrier operation in front, so the transparency carrier technological requirement is not high.
The method for making of superthin liquid crystal box provided by the present invention, because the steps of chemical attack that adopts is a chemical process, can be by the concentration of control chemical mordant and the severe degree that temperature is controlled reaction, therefore avoided the huge stress effect that produced in mechanical lapping, the finishing method, can not cause show disorderly.
The method for making of superthin liquid crystal box provided by the present invention; before steps of chemical attack; utilize the used frame adhesive of normal liquid crystal production run to make waterproof acid-proof bearer bar as raw material; the effect of waterproof acid-proof bearer bar is; impurity such as anti-sealing and acid enter the liquid crystal cell motherboard when chemical corrosion, thereby pollute liquid crystal cell, corrosion ITO lead-in wire and pattern etc.
The method for making of superthin liquid crystal box provided by the present invention, all compositions of the chemical mordant that is adopted all are the general chemistry reagent of using always, low price; Owing to the production equipment that adds is not had very high technological requirement, so technology is simple, convenient operation and control; Except chemical etching technology was different with normal liquid crystal production technology, other technology was basic identical, therefore need not increase too much production equipment, has saved production cost.
Feature of the present invention and advantage will be elaborated in conjunction with the accompanying drawings by embodiment.
[description of drawings]
Fig. 1 is the flow chart of steps of the embodiment of the invention;
Fig. 2 a is the structural drawing of the last transparency carrier of the embodiment of the invention;
Fig. 2 b is the structural drawing of the following transparency carrier of the embodiment of the invention;
Fig. 3 is the liquid crystal cell motherboard structure figure after the transparency carrier up and down of the embodiment of the invention is fitted;
Fig. 4 is the thickness synoptic diagram of the chemical corrosion front and back liquid crystal cell of the embodiment of the invention.
Among the figure: 1. upper strata transparency carrier, 2. lower floor's transparency carrier, 3. liquid crystal cell motherboard, 4. liquid crystal cell, 5. waterproof acid-proof bearer bar.
[embodiment]
Embodiment one, and as shown in Figure 1, the method for making of superthin liquid crystal box comprises the steps:
The first step is successively cleaned upper and lower layer transparency carrier 1 and 2 with acetone, ultrasound wave, alcohol, pure water, hairbrush etc., removes the various objectionable impurities or the greasy dirt that are adsorbed on the transparency carrier surface, prevents to pollute PI both alignment layers and liquid crystal starting material.
In second step, resist coating on transparency carrier exposes after the precuring, develops, and carries out harsh (utilizing the protective effect of photoresist, with the mixed liquor etching of hydrochloric acid, nitric acid and pure water formation) after the curing, carves required patterns such as dot pattern and lead-in wire;
And, utilize exposure technique to manufacture the needed silk screen of waterproof acid-proof bearer bar.
In the 3rd step, the transparency carrier surface roller coating PI alignment materials after etching is finished forms the PI both alignment layers by the rubbing machine friction then.
In the 4th step, shown in Fig. 2 a, 2b, upper strata transparency carrier 1 and lower floor's transparency carrier 2, good frame adhesive of silk-screen and conductiving point, the good waterproof acid-proof of silk-screen bearer bar 5 simultaneously, waterproof acid-proof bearer bar are positioned at around the liquid crystal cell motherboard on the frame.Wherein, during silk-screen waterproof acid-proof bearer bar 5 waterproof acid-proof bearer bar 5 needed silk screens of made in second step of adopting, waterproof acid-proof coating is printed onto on the transparency carrier.This waterproof acid-proof protective coating is the used frame adhesive of normal liquid crystal production run, as XN-665, the XN-5A etc. of Mitsui.
The 5th step, folded upper strata transparency carrier 1 and 2 pairs of lower floor's transparency carriers as shown in Figure 3, utilize seal, sealing materials to be bonded, making the gap is the liquid crystal cell motherboard 3 (liquid crystal cell motherboard 3 can cut into a plurality of single liquid crystal cells 4) of specific thicknesses.
The 6th the step, by High Temperature High Pressure with frame adhesive, conductiving point and waterproof acid-proof bearer bar 5 full solidification.
In the 7th step, as shown in Figure 4, (this liquid crystal cell comprises opposed facing first transparency carrier and second transparency carrier that is formed with transparency electrode with the liquid crystal cell motherboard through fitting, solidifying to form in the above-mentioned steps.) carry out chemical corrosion, etch into needed transparency carrier thickness always.Chemical mordant is the mixed liquor of hydrofluorite, hydrochloric acid, nitric acid and a spot of surfactant, the concentration range of chemical mordant Main Ingredients and Appearance is hydrofluorite 10-20%, hydrochloric acid 1-2%, nitric acid 5-10%, all the other are water and surfactant, preferably, its percentage is hydrofluorite 20%, hydrochloric acid 2%, nitric acid 10%, surfactant 0.5%, all the other are pure water.The thickness of superthin liquid crystal box was controlled by etching speed and time, and the long more thickness of etching period is more little, and etching speed is then controlled by concentration and two parameters of temperature of chemical mordant.The temperature range of chemical corrosion is 20 ℃-50 ℃, and preferred etch temperature is 22+/-2 degree.The etching speed scope is 4-15.4um/min, and preferred etching speed is about 10um/min.The thickness of liquid crystal cell is 1.02mm before the chemical etching, and after 20 minutes chemical etching, the thickness of liquid crystal cell motherboard is reduced to 0.81mm.Etching result is as shown in table 1, flatness (crest-trough) is 0.075-0.072mm before the etching, and flatness after the etching (crest-trough) is 0.061-0.059mm, so after the chemical etching, do not influence the high-flatness of transparency carrier, can reach+/-technical requirement of 30um.
The 8th step cleaned up chemical mordant and refuse that corrosion produced with cleaning fluid, and oven dry then is in order to avoid residue impacts later operation.
In the 9th step, large stretch of liquid crystal cell motherboard 3 that above step is produced cuts into required liquid crystal cell one by one 4.
After this, encapsulated liquid crystals between first transparency carrier and second transparency carrier, and after the outer panel face of transparency carrier adheres to polaroid, promptly form LCD.
Table 1
| Thickness of liquid crystal box before the etching | Thickness of liquid crystal box after the etching | Etching period | Flatness (crest-trough) before the etching | Flatness after the etching (crest-trough) |
| 1.02mm | 0.81mm | 20min | 0.075-0.072mm | 0.061-0.059mm |
| 1.03mm | 0.59mm | 40min | 0.080-0.075mm | 0.051-0.045mm |
Embodiment two, be with the difference of embodiment one, in step 7, with the thickness setting after the etching is 0.6mm, the thickness of liquid crystal cell motherboard is 1.03mm before the chemical etching, and the chemical mordant percentage is hydrofluorite 20%, hydrochloric acid 2%, nitric acid 10%, surfactant 0.5%, all the other be pure water, and etch temperature is that 22+/-2 are spent, through 40 minutes chemical etching, the thickness of liquid crystal cell motherboard was reduced to 0.59mm.Etching result is as shown in table 1, flatness (crest-trough) is 0.080-0.075mm before the etching, and flatness after the etching (crest-trough) is 0.051-0.045mm, so after the chemical etching, do not influence the high-flatness of transparency carrier, can reach+/-technical requirement of 30um.
This method is with respect to existing ultra-thin liquid crystal method for making, and it is low to have technological requirement, and cost is low, characteristics such as yields height.Utilize this method, can make the ultra-thin LCD of thickness, comprise liquid crystal cell and polaroid up and down less than 1.0mm.The ultra-thin LCD type that can make comprises various liquid crystal display devices such as TN, STN, FSTN, CSTN, TFT.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the present invention is determined by claims of being submitted to.
Claims (5)
1. the method for making of a superthin liquid crystal box is characterized in that comprising the steps:
A, transparency carrier is carried out pre-preparation;
B, silk-screen frame adhesive and conductiving point, silk-screen water-tight corrosion-proof bearer bar simultaneously;
C, general transparency carrier applying up and down form liquid crystal cell;
D, frame adhesive, conductiving point and water-tight corrosion-proof bearer bar are solidified by High Temperature High Pressure;
E, liquid crystal cell is carried out chemical corrosion, etch into needed transparency carrier thickness always, form superthin liquid crystal box with chemical mordant;
Wherein, described water-tight corrosion-proof bearer bar is the waterproof acid-proof bearer bar on the frame around the liquid crystal cell; the method of silk-screen waterproof acid-proof bearer bar is: utilize exposure technique to manufacture the needed silk screen of waterproof acid-proof bearer bar earlier; by silk screen waterproof acid-proof coating is printed onto on the transparency carrier then, described waterproof acid-proof coating is the used frame adhesive of liquid crystal production run.
2. the method for making of superthin liquid crystal box as claimed in claim 1 is characterized in that, comprises step in pre-preparation described in the steps A:
A1, on transparency carrier resist coating, expose successively, develop;
A2, carry out harsh operation after will photoresist solidifying, carve dot pattern and the required pattern of lead-in wire;
A3, making both alignment layers.
3. the method for making of superthin liquid crystal box as claimed in claim 1 is characterized in that, in the step e, the temperature range during chemical corrosion is 20 ℃-50 ℃.
4. the method for making of a superthin liquid crystal box, it is characterized in that comprising the steps: silk-screen water-tight corrosion-proof bearer bar on transparency carrier, transparency carrier is fitted and is formed liquid crystal cell up and down, with chemical mordant liquid crystal cell is carried out chemical corrosion, etch into needed transparency carrier thickness always, form superthin liquid crystal box; Wherein, described water-tight corrosion-proof bearer bar is the waterproof acid-proof bearer bar on the frame around the liquid crystal cell; the method of silk-screen waterproof acid-proof bearer bar is: utilize exposure technique to manufacture the needed silk screen of waterproof acid-proof bearer bar earlier; by silk screen waterproof acid-proof coating is printed onto on the transparency carrier then, described waterproof acid-proof coating is the used frame adhesive of liquid crystal production run.
5. the method for making of superthin liquid crystal box as claimed in claim 4 is characterized in that, wherein, the temperature range during chemical corrosion is 20 ℃-50 ℃.
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101261444B (en) * | 2008-04-23 | 2010-11-03 | 友达光电股份有限公司 | Manufacture method for display panel possessing different substrate thickness difference |
| CN102566126A (en) * | 2012-02-06 | 2012-07-11 | 深圳市瑞福达液晶显示技术股份有限公司 | Forming method for flexible liquid crystal cell for liquid crystal display |
| CN104297971A (en) * | 2013-07-15 | 2015-01-21 | 睿志达光电(深圳)有限公司 | Method for processing substrates of display panel |
| CN109188743A (en) * | 2018-11-14 | 2019-01-11 | 惠科股份有限公司 | The production method and display device of display panel |
| CN109346623B (en) * | 2018-11-14 | 2020-12-29 | 信利（惠州）智能显示有限公司 | AMOLED display product edge sealing method, edge sealing structure and display product |
| CN109407437A (en) * | 2018-11-19 | 2019-03-01 | 南京华日触控显示科技有限公司 | The ultra-thin glass structure cholesteric phase chromatic liquid crystal screen of glass Milling Technique In The Microstructure Study production |
| CN111256828A (en) * | 2020-01-17 | 2020-06-09 | 业成科技（成都）有限公司 | Mechanism for measuring polarized light 3D image and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1724432A (en) * | 2001-04-12 | 2006-01-25 | 西山不锈化学股份有限公司 | Chemical polishing method and glass base plate with the method and chemical polishing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1724432A (en) * | 2001-04-12 | 2006-01-25 | 西山不锈化学股份有限公司 | Chemical polishing method and glass base plate with the method and chemical polishing device |
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| JP特开2004-190076A 2004.07.08 |
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Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150909 |
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Effective date of registration: 20150909 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: Biyadi Co., Ltd. |
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Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |