CN107814491A - A kind of flat glass substrate etching solution - Google Patents
A kind of flat glass substrate etching solution Download PDFInfo
- Publication number
- CN107814491A CN107814491A CN201711339105.XA CN201711339105A CN107814491A CN 107814491 A CN107814491 A CN 107814491A CN 201711339105 A CN201711339105 A CN 201711339105A CN 107814491 A CN107814491 A CN 107814491A
- Authority
- CN
- China
- Prior art keywords
- acid
- etching solution
- glass substrate
- pvp
- flat glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
Abstract
The invention provides a kind of flat glass substrate etching solution, the etching solution is prepared by the raw material including following percentage by weight：HF:1 5%, NH4F：10 25%, strong acid:1 10%, carboxylic acid:1 5%, sulfonic acid：1 5%, aminotriacetic acid (NTA):1 8%, surfactant:1 5%, PVP K90 (PVP K90):1 2%, ethyl acetate：1 2%, tetrahydrofuran：1 2%, and the water of surplus.The flat glass substrate etching solution reduces HF content by optimization of C/C composites, and by adding NH4F introduces F‑, avoid inconvenience caused by HF.
Description
Technical field
The present invention relates to thinning glass substrate production technical field, more particularly, to a kind of flat glass substrate etching solution.
Background technology
In flat display field, including in the preparation process such as plasma is shown, touch-screen, liquid crystal display, in order to
Further mitigate the weight of display device, manufacturer more and more uses and glass substrate is carried out to thinned method.Glass
The method of substrate attenuation generally has two kinds, and one kind is physics polishing grinding, and another kind is that chemical etching is thinned, wherein, chemistry erosion
It is most widely used to carve thinned.At present, what used attenuation etching liquid substrate used be all using hydrofluoric acid as mainly into
Point, but the toxicity of hydrofluoric acid is big, volatile, especially need to use higher temperature and concentration in configuration, not only production process
It is middle dangerous high, and huge pollution can be caused to environment.
The content of the invention
In view of this, the present invention is directed to propose a kind of flat glass substrate etching solution, by optimization of C/C composites, reduces HF's
Content, and by adding NH4F introduces F-, avoid inconvenience caused by HF.
To reach above-mentioned purpose, the technical proposal of the invention is realized in this way：
A kind of flat glass substrate etching solution, the etching solution are prepared by the raw material including following percentage by weight：HF:
1-5%, NH4F：10-25%, strong acid:1-10%, carboxylic acid:1-5%, sulfonic acid：1-5%, aminotriacetic acid (NTA):1-8%, table
Face activating agent:1-5%, PVP K90 (PVP K90):1-2%, ethyl acetate：1-2%, tetrahydrofuran：1-
2%, and the water of surplus.
Further, the etching solution is prepared by the raw material including following percentage by weight：HF:1-5%, NH4F：15-
25%, strong acid:5-10%, carboxylic acid:1-5%, sulfonic acid：1-5%, aminotriacetic acid (NTA):1-8%, surfactant:1-
5%, PVP K90 (PVP K90):1-2%, ethyl acetate：1-2%, tetrahydrofuran：1-2%, and surplus
Water.
Further, the strong acid is the mixing of one or both of hydrochloric acid or nitric acid.
Further, the surfactant is carboxylate surface active agent, sodium abietate, sodium naphthenate, odium stearate, oil
One or more of mixing in sour sodium, alkyl benzene sulfonate surfactant, sulfate salt surfactant.
Further, the etching solution is prepared by the preparation method comprised the following steps：
(1) by NH4F, aminotriacetic acid (NTA) is added to the water, and stirring is completely dissolved it；
(2) add in the aqueous solution that step (1) obtains and dilute after mixing HF, strong acid, carboxylic acid and sulfonic acid；
(3) and then by surfactant, PVP K90 (PVP K90), ethyl acetate, tetrahydrofuran add
In the solution that step (2) obtains, stir.
Relative to prior art, flat glass substrate etching solution of the present invention has the advantage that：
Flat glass substrate etching solution of the present invention devises brand-new etching formula of liquid, reduces HF use
Amount, and add NH4F is to supplement F-, and NH4F in F-It is incomplete ionization, constantly ionizes, serve with the progress of reaction
The effect of buffering, etch-rate temperature is ensure that, greatly reduce the toxicity of etching solution, more safety can for Manufacturing Worker's operation
Lean on；Carboxylic acid and sulfonic acid belong to weak acid, also can slowed down reaction speed, both meeting etching requirement, to turn avoid etching speed too fast
The problem of influenceing substrate surface structure；Aminotriacetic acid (NTA) is metal-chelator, can be with metal ion caused by etching
Form chelate, it is easier to be dissolved in water, so as to solve the problems, such as accessory substance indissoluble in etching process, avoid product from being attached to
Glass baseplate surface, improve etch-rate and etch effect；Surfactant can also play the work of cleaning to glass surface
With.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention is described in detail below in conjunction with embodiment.
Embodiment 1
A kind of flat glass substrate etching solution, the etching solution are prepared by the raw material including percentage by weight as shown in table 1
Obtain：
The formula of the etching solution of the embodiment 1 of table 1
Embodiment 2
A kind of flat glass substrate etching solution, the etching solution are prepared by the raw material including percentage by weight as shown in table 2
Obtain：
The formula of the etching solution of the embodiment 2 of table 2
A kind of flat glass substrate etching solution, the etching solution are prepared by the raw material including percentage by weight as shown in table 3
Obtain：
The formula of the etching solution of the embodiment 3 of table 3
Embodiment 4
A kind of flat glass substrate etching solution, the etching solution are prepared by the raw material including percentage by weight as shown in table 4
Obtain：
The formula of the etching solution of the embodiment 4 of table 4
Flat glass substrate etching solution described in embodiment 1-4 is prepared by the preparation method comprised the following steps：
(1) by NH4F, aminotriacetic acid (NTA) is added to the water, and stirring is completely dissolved it；
(2) add in the aqueous solution that step (1) obtains and dilute after mixing HF, strong acid, carboxylic acid and sulfonic acid；
(3) and then by surfactant, PVP K90 (PVP K90), ethyl acetate, tetrahydrofuran add
In the solution that step (2) obtains, stir.
Processing method：
1) according to embodiment 1-4 recipe configuration each 1000L of flat glass substrate etching solution, and enchashment has etching solution
1000L；
2) glass substrate of the identical producer's same batch of 5 pieces of plate nitre AN100, thickness 1.000mm are used, size is
730mm × 920mm, numbering is I~V, after cleaning up, is respectively put into containing embodiment 1-4 etching solutions and existing etching solution
In etching groove, etch 10 minutes, etch temperature is controlled at 25-30 DEG C, then glass substrate is put into etching basket vertically, completely
It is immersed in etching groove, bubbling is carried out to etching acid solution in etching process, bubbling amount is 100L/min.
3) after etching 30 minutes, glass substrate is taken out, with deionized water rinsing and is dried, and measure the thickness of glass substrate
Degree, such as table 5.
The thickness data of the glass substrate of table 5
| I | II | III | IV | V | |
| Thickness/mm | 0.96 | 0.95 | 0.94 | 0.93 | 0.92 |
| Thickness non-uniformities | Less than 1% | Less than 1% | Less than 1% | Less than 1% | More than 1% |
As can be seen from Table 5, in the identical time, the glass etching in the etching solution that embodiment 1-4 is configured
The thickness etched in the existing etching solution of thickness ratio afterwards is thick, NH used by explanation4F serves corrosion inhibition, and etches
Thickness non-uniformities afterwards are but better than existing etching solution effect.
The embodiment 1-4 experimental results of table 6
| Numbering | With glass reaction speed | Actual effect |
| I | 2.4μm/min | Glass surface has no that raised, scuffing breach has no obvious amplification |
| II | 2.5μm/min | Glass surface has no that raised, scuffing breach has no obvious amplification |
| III | 2.5μm/min | Glass surface has no that raised, scuffing breach has no obvious amplification |
| IV | 2.6μm/min | Glass surface has no that raised, scuffing breach has no obvious amplification |
| V | 3.0μm/min | Glass surface has minute protrusions, scuffing breach to have no obvious amplification |
As can be seen from Table 6, reaction of the reaction rate for the etching solution that embodiment 1-4 is configured than existing etching solution
Speed is slow, has corrosion mitigating effect, and etch effect is also better than existing etching solution, has both met etching requirement and turn avoid
Etching speed it is too fast influence substrate surface structure the problem of.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.
Claims (5)
- A kind of 1. flat glass substrate etching solution, it is characterised in that：The etching solution is by including the raw material system of following percentage by weight It is standby to obtain：HF:1-5%, NH4F：10-25%, strong acid:1-10%, carboxylic acid:1-5%, sulfonic acid：1-5%, aminotriacetic acid (NTA):1-8%, surfactant:1-5%, PVP K90 (PVP K90):1-2%, ethyl acetate：1-2%, Tetrahydrofuran：1-2%, and the water of surplus.
- 2. flat glass substrate etching solution according to claim 1, it is characterised in that：The etching solution is by including following weight The raw material of percentage is prepared：HF:1-5%, NH4F：15-25%, strong acid:5-10%, carboxylic acid:1-5%, sulfonic acid：1-5%, Aminotriacetic acid (NTA):1-8%, surfactant:1-5%, PVP K90 (PVP K90):1-2%, acetic acid Ethyl ester：1-2%, tetrahydrofuran：1-2%, and the water of surplus.
- 3. flat glass substrate etching solution according to claim 1 or 2, it is characterised in that：The strong acid is hydrochloric acid or nitre The mixing of one or both of acid.
- 4. flat glass substrate etching solution according to claim 1 or 2, it is characterised in that：The surfactant is carboxylic Acid salt surfactant, sodium abietate, sodium naphthenate, odium stearate, enuatrol, alkyl benzene sulfonate surfactant, sulfuric acid One or more of mixing in ester salt surfactant.
- 5. flat glass substrate etching solution according to claim 1 or 2, it is characterised in that：The etching solution is by including as follows The preparation method of step is prepared：(1) by NH4F, aminotriacetic acid (NTA) is added to the water, and stirring is completely dissolved it；(2) add in the aqueous solution that step (1) obtains and dilute after mixing HF, strong acid, carboxylic acid and sulfonic acid；(3) and then by surfactant, PVP K90 (PVP K90), ethyl acetate, tetrahydrofuran step is added (2) in the solution obtained, stir.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711339105.XA CN107814491A (en) | 2017-12-14 | 2017-12-14 | A kind of flat glass substrate etching solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711339105.XA CN107814491A (en) | 2017-12-14 | 2017-12-14 | A kind of flat glass substrate etching solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107814491A true CN107814491A (en) | 2018-03-20 |
Family
ID=61605839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711339105.XA Pending CN107814491A (en) | 2017-12-14 | 2017-12-14 | A kind of flat glass substrate etching solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107814491A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109777670A (en) * | 2019-03-14 | 2019-05-21 | 惠州市清洋实业有限公司 | A kind of cleaning solution and preparation method thereof |
| CN114075041A (en) * | 2020-08-12 | 2022-02-22 | Oppo广东移动通信有限公司 | Frosting liquid and preparation method thereof, frosted glass and processing method thereof |
| CN115724592A (en) * | 2022-10-11 | 2023-03-03 | 广东山之风环保科技有限公司 | Household touch panel glass AG effect frosting liquid and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1380572A (en) * | 2001-04-12 | 2002-11-20 | 西山不锈化学股份有限公司 | Chemical polishing method and device for liquid crystal glass base plate |
| CN1678714A (en) * | 2002-08-26 | 2005-10-05 | 默克专利有限公司 | Etching pastes for titanium oxide surfaces |
| CN104944790A (en) * | 2014-03-31 | 2015-09-30 | 东友精细化工有限公司 | Glass-reinforcing composition and method of manufacturing touchscreen glass using the same |
| CN106186714A (en) * | 2016-07-15 | 2016-12-07 | 天津美泰真空技术有限公司 | A kind of etching solution suppressing the thinning rear concave point of TFT LCDs |
| CN107235641A (en) * | 2017-08-14 | 2017-10-10 | 湖北工程学院 | A kind of glass thinning etching solution and preparation method thereof |
-
2017
- 2017-12-14 CN CN201711339105.XA patent/CN107814491A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1380572A (en) * | 2001-04-12 | 2002-11-20 | 西山不锈化学股份有限公司 | Chemical polishing method and device for liquid crystal glass base plate |
| CN1678714A (en) * | 2002-08-26 | 2005-10-05 | 默克专利有限公司 | Etching pastes for titanium oxide surfaces |
| CN104944790A (en) * | 2014-03-31 | 2015-09-30 | 东友精细化工有限公司 | Glass-reinforcing composition and method of manufacturing touchscreen glass using the same |
| CN106186714A (en) * | 2016-07-15 | 2016-12-07 | 天津美泰真空技术有限公司 | A kind of etching solution suppressing the thinning rear concave point of TFT LCDs |
| CN107235641A (en) * | 2017-08-14 | 2017-10-10 | 湖北工程学院 | A kind of glass thinning etching solution and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109777670A (en) * | 2019-03-14 | 2019-05-21 | 惠州市清洋实业有限公司 | A kind of cleaning solution and preparation method thereof |
| CN114075041A (en) * | 2020-08-12 | 2022-02-22 | Oppo广东移动通信有限公司 | Frosting liquid and preparation method thereof, frosted glass and processing method thereof |
| CN115724592A (en) * | 2022-10-11 | 2023-03-03 | 广东山之风环保科技有限公司 | Household touch panel glass AG effect frosting liquid and preparation method thereof |
| CN115724592B (en) * | 2022-10-11 | 2024-04-12 | 广东山之风环保科技有限公司 | Glass AG effect frosting liquid for household touch panel and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107954608A (en) | A kind of glass substrate etching solution | |
| CN108033686A (en) | A kind of etching liquid for thinning glass substrate | |
| KR100248113B1 (en) | Cleaning and etching compositions for electrical display device and substrate | |
| CN104498951B (en) | Oxydol etching solution for copper-molybdenum alloy films | |
| US6284721B1 (en) | Cleaning and etching compositions | |
| CN107814491A (en) | A kind of flat glass substrate etching solution | |
| TWI479012B (en) | Etching and cleaning solution for glass in liquid crystal display device and etching method using the same | |
| CN104388090B (en) | Oxalic acid-series ITO (Indium Tin Oxide) etching liquid, as well as preparation method and application thereof | |
| CN107235641A (en) | A kind of glass thinning etching solution and preparation method thereof | |
| CN103666478B (en) | A kind of acid ammonium fluoride etching solution of non-ionic type low surface tension | |
| CN107902914A (en) | A kind of glass substrate thinning technique etching solution | |
| CN103880293A (en) | Etching liquid for secondary reinforcement of glass as well as preparation method and application thereof | |
| SG178308A1 (en) | Microprocessing treatment agent and microprocessing treatment method using same | |
| CN107226624A (en) | It is a kind of for etching solution of electro-conductive glass and preparation method thereof | |
| CN103194755B (en) | Selective iron etching solution and etching method | |
| KR102006323B1 (en) | Etching solution composition and method of wet etching with the same | |
| CN108513679A (en) | For with SiN layer and Si layers of substrate wet etch composition and use its wet etch process | |
| KR20110046992A (en) | An etching solution composition | |
| KR20080098772A (en) | Cleaning and etching composition for silicon substrate of pdp, lcd and oled | |
| CN113801660A (en) | Indium tin oxide etching solution with long etching life | |
| KR20130025612A (en) | An etching solution composition for oxide layer containing gallium | |
| KR20110019604A (en) | Etching solution composition for formation of metal line | |
| KR101728542B1 (en) | An etching solution composition for molybdenum | |
| CN107793037A (en) | One kind is used for AMOLED base plate glass attenuation etching liquid additives | |
| KR20080111268A (en) | Cleaning solution composition and cleaning method using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180320 |
|
| RJ01 | Rejection of invention patent application after publication |