JP2008093577A - Substrate treatment device and substrate treatment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment device and a substrate treatment method capable of preferably applying a washing treatment to a substrate. <P>SOLUTION: A chemical liquid unit 10 performs chemical liquid treatment of a substrate W. A washing unit 60 washes the substrate W fed with the chemical liquid from the chemical liquid unit 10 by micro-bubble water by feeding micro-bubble water to the substrate W. The washing unit 60 is mainly provided with multiple upper nozzles 61, multiple lower nozzles 62, a liquid knife 66, a storage tank 20, and a micro-bubble generating part 21. This configuration enables to feed micro-bubble water to the substrate W after the chemical liquid treatment. Thus, the chemical liquid attached to the substrate in the chemical liquid treatment can be quickly substituted with the micro-bubble water, to reduce the amount of the treatment liquid used for washing. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for processing a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, etc. (hereinafter simply referred to as “substrate”). In particular, the present invention relates to a substrate cleaning process.

  2. Description of the Related Art Conventionally, a technique for cleaning a substrate by supplying a treatment liquid in which pure water and gas are mixed to the substrate on which a chemical solution is attached is known (for example, Patent Document 1). Here, in Patent Document 1, carbon dioxide (CO2) is used as the gas.

JP 2004-273984 A

  Here, in patent document 1, in order to remove the chemical | medical solution adhering to a board | substrate, a lot of pure water is required. That is, in the cleaning process, a large amount of drainage liquid containing a chemical solution is discharged from the substrate processing apparatus. As a result, a drainage processing facility capable of processing a large amount of drainage is required, and there has been a problem that the facility cost related to the drainage treatment increases.

  Accordingly, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can satisfactorily perform a cleaning process on a substrate.

  In order to solve the above-mentioned problems, the invention of claim 1 is characterized in that the chemical solution supply unit that supplies the chemical solution to the substrate and enables chemical treatment, the microbubble generation unit that generates microbubbles, and the chemical solution supply unit A treatment liquid supply unit that supplies a treatment liquid containing microbubbles generated by the microbubble generation unit to the substrate to which a chemical solution is supplied, and enables a cleaning process using the treatment liquid; To do.

  In the substrate processing apparatus according to claim 1, the processing liquid supplied from the processing liquid supply unit mixes pure water and an inert gas in the microbubble generation unit. It is characterized by including the microbubble generated by this.

  The invention of claim 3 is the substrate processing apparatus according to claim 1, wherein the chemical solution supply unit supplies a chemical solution containing an organic amine, and the treatment solution supplied from the treatment solution supply unit is pure. Microbubbles generated by mixing water and carbon dioxide in the microbubble generator are included.

  According to a fourth aspect of the present invention, in the substrate processing apparatus according to the first aspect, the chemical solution supplied from the chemical solution supply unit is formed on the substrate and peels off the resist film that has undergone the etching process. The stripping liquid, and the processing liquid supplied from the processing liquid supply unit includes microbubbles generated by mixing pure water and a gas having an oxidizing power in the microbubble generation unit. .

  Further, the invention of claim 5 is the substrate processing apparatus according to claim 1, wherein the chemical solution supplied from the chemical solution supply unit is formed on the substrate and develops the resist film that has undergone exposure processing. The processing liquid supplied from the processing liquid supply unit, which is a developer, includes microbubbles generated by mixing pure water and a gas having an oxidizing power in the microbubble generation unit. .

  According to a sixth aspect of the present invention, in the substrate processing apparatus of the fourth or fifth aspect, the gas having an oxidizing power is a gas containing oxygen.

  The invention according to claim 7 is the substrate processing apparatus according to any one of claims 1 to 6, wherein the gas having oxidizing power is ozone gas.

  The invention according to claim 8 is the substrate processing apparatus according to any one of claims 1 to 7, wherein the processing liquid supply unit discharges the processing liquid in a curtain shape toward the substrate. The treatment liquid is allowed to adhere to the substrate along a first direction substantially perpendicular to the conveyance direction of the substrate by the conveyance unit.

  The invention according to claim 9 is the substrate processing apparatus according to any one of claims 1 to 7, wherein the processing liquid supply unit is arranged in a first direction substantially perpendicular to a transport direction of the substrate by the transport unit. It has a plurality of nozzles arranged along, and each nozzle has a discharge mouth extended in the 1st direction.

  The invention of claim 10 is the substrate processing apparatus according to any one of claims 1 to 9, wherein the processing liquid supply unit supplies microbubbles generated in a storage tank to the substrate. Features.

  The invention according to claim 11 is the substrate processing apparatus according to any one of claims 1 to 9, wherein the substrate processing apparatus is connected in communication with the processing liquid supply unit, and the processing liquid is supplied to the processing liquid supply unit side. A first supply pipe is further provided, and the microbubble generator is provided in the first supply pipe.

  The invention according to claim 12 is the substrate processing apparatus according to claim 11, wherein the microbubble generator has the first supply pipe so that the microbubble diameter is in a range required in a cleaning process with a good microbubble diameter. It is attached to the predetermined position of this.

  The invention of claim 13 includes (a) a step of supplying a chemical solution to the substrate, and (b) a treatment solution containing microbubbles generated by the microbubble generator, wherein the chemical solution is converted into the step (a). And a step of supplying to the supplied substrate.

  According to the first to thirteenth aspects of the present invention, a processing liquid containing microbubbles can be supplied to a substrate that has been subjected to a chemical processing. Thereby, in the chemical solution processing, the chemical solution adhering to the substrate can be quickly replaced with a processing solution containing microbubbles. Therefore, the amount of processing liquid used for the cleaning process can be reduced.

  In addition, contaminants (for example, particles and organic substances) adhering to the substrate after the chemical treatment can be favorably removed from the substrate. Therefore, the cleanliness of the substrate after the cleaning process can be improved.

  In particular, in the invention according to claim 2, the microbubble is a microbubble of an inert gas, and even if the microbubble is dissolved in the processing liquid containing the microbubble and pure water, the chemical stability of the processing liquid is increased. The nature is high. Thereby, even if it is a case where a process liquid mixes with the chemical | medical solution from a chemical | medical solution supply part, a chemical | medical solution is not deteriorated. Therefore, the amount of the processing liquid used for the cleaning process can be reduced and the cleanliness of the substrate after the cleaning process can be improved without adversely affecting the chemical process.

  In particular, in the invention described in claim 3, a chemical solution containing an organic amine adheres to the substrate that has been subjected to the chemical treatment, and when this organic amine comes into contact with pure water, a strong alkali is generated. On the other hand, carbon dioxide gas is dissolved in the treatment liquid, and the treatment liquid has acidity.

  Thus, when the processing liquid is supplied to the substrate after the chemical processing, the chemical is neutralized by the acidic processing liquid. Therefore, it is possible to satisfactorily execute the cleaning process with the processing liquid while preventing the substrate from being corroded by the strong alkali based on the organic amine.

  In particular, in the inventions according to claims 4 to 7, organic substances such as a resist residue are attached to the substrate after the chemical treatment (peeling treatment or development treatment). In this case, the treatment liquid decomposes and removes organic substances attached to the substrate by the oxidizing power of microbubbles formed by a gas having oxidizing power (for example, a gas containing oxygen, oxygen gas, or ozone gas). be able to. Therefore, the cleanliness of the substrate after the cleaning process can be further improved.

  In particular, according to the inventions described in claims 8 and 9, the processing liquid containing microbubbles can be satisfactorily supplied to the entire substrate transported in the transport direction. Therefore, it is possible to execute the cleaning process with the processing liquid more satisfactorily.

  In particular, according to the invention described in claim 10, it is possible to generate a sufficient amount of microbubbles in the storage tank, and then supply the processing liquid containing the microbubbles to the processing liquid supply unit. Thereby, an amount of microbubbles sufficient for organic substance removal can be supplied to the substrate. Therefore, it is possible to execute the cleaning process with the processing liquid more satisfactorily.

  In particular, according to the eleventh aspect of the present invention, it is possible to supply the processing liquid containing the microbubbles to the substrate without using a special apparatus other than the microbubble generator provided in the first supply pipe. Therefore, the manufacturing cost of the apparatus and the footprint of the apparatus can be reduced.

  In particular, according to the twelfth aspect of the present invention, by adjusting the mounting position of the microbubble generating portion, it is possible to supply the substrate with a processing liquid containing microbubbles having an appropriate diameter size. Therefore, it is possible to execute the cleaning process with the processing liquid more satisfactorily.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<1. Configuration of substrate processing apparatus>
FIG. 1 is a diagram showing an example of the overall configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. Here, the substrate processing apparatus 1 supplies (1) a chemical solution to the substrate W (for example, a developing solution that develops a resist film that has undergone exposure processing, a stripping solution that strips a resist film that has undergone etching processing, etc.) And (2) supplying pure water containing microbubbles (hereinafter also simply referred to as “microbubble water”) to the substrate W to which the chemical solution is supplied, and executing a cleaning process. It is a viable device. As shown in FIG. 1, the substrate processing apparatus 1 mainly includes a plurality of transport rollers 5, a chemical unit 10, and a cleaning unit 60.

  1 and the subsequent drawings have an XYZ orthogonal coordinate system in which the Z-axis direction is a vertical direction and the XY plane is a horizontal plane, as necessary, in order to clarify the directional relationship. . In the present embodiment, the processing solution includes not only a chemical solution such as a developing solution, a stripping solution, and hydrofluoric acid but also pure water.

  The plurality of transport rollers 5 are transport units that transport the substrate W to be processed from the chemical liquid unit 10 side to the cleaning unit 60 side, and a transport path 6 is formed by the transport rollers 5. Each transport roller 5 is connected to a drive motor (not shown) and is rotated about a rotation axis substantially parallel to the Y axis. Therefore, the substrate W on the transport roller 5 is transported in the transport direction AR1 (substantially parallel to the X axis).

  The chemical liquid unit 10 is a unit that enables chemical processing of the substrate W. For example, the chemical unit 10 performs a development process after exposure by supplying a developer to the substrate W, or performs a stripping process after etching by supplying a stripping liquid to the substrate W. As shown in FIG. 1, the chemical liquid unit 10 mainly includes a plurality of discharge nozzles 11 and a chemical liquid supply pipe 32.

  The plurality of discharge nozzles 11 are provided in the processing chamber 10 a and above the transport path 6, and supply the chemical solution 11 a to the upper surface (the surface on the Z axis plus side) of the substrate W. Further, as shown in FIG. 1, each discharge nozzle 11 is connected to a chemical solution supply source 31 through a chemical solution supply pipe 32 provided with a valve 35. Therefore, when the valve 35 is opened, each discharge nozzle 11 discharges the chemical solution 11 a toward the substrate W in the transport path 6. Thus, the plurality of discharge nozzles 11 are used as a chemical solution supply unit that supplies the chemical solution to the substrate W.

  A discharge port 13 is provided near the lower portion of the processing chamber 10a. The discharge port 13 is connected to a drainage drain 91 through a discharge pipe 14 provided with a valve 15 and a common discharge pipe 92. Therefore, when the valve 15 is opened, the chemical liquid used for the chemical liquid treatment is discharged from the chemical liquid unit 10 to the drainage drain 91 side as drainage.

  The cleaning unit 60 is a unit that supplies microbubble water to the substrate W to which the chemical solution 11a is supplied, and enables cleaning processing with the microbubble water. The configuration of the cleaning unit 60 will be described later.

<2. Configuration of cleaning unit>
2 and 3 are diagrams for explaining the discharge state of the microbubble water 61a discharged from the upper nozzle 61. FIG. Here, the configuration of the cleaning unit 60 will be described. As shown in FIG. 1, the cleaning unit 60 mainly includes a plurality of upper nozzles 61, a plurality of lower nozzles 62, a liquid knife 66, a storage tank 20, and a microbubble generator 21. .

  As shown in FIG. 1, the plurality of upper nozzles 61 are provided in the processing chamber 60 a and above the conveyance path 6. As shown in FIG. 2, each upper nozzle 61 has a discharge port 61 b extending at the tip thereof in a direction (first direction) (substantially Y-axis direction) substantially perpendicular to the transport direction AR <b> 1 of the substrate W.

  Thereby, about the microbubble water 61a (process liquid) discharged toward the upper surface of the board | substrate W of the conveyance path 6 from each upper nozzle 61, the cross section of this microbubble water 61a seen from the 1st direction is shown in FIG. As shown in FIG. Then, the microbubble water 61a is deposited on the liquid landing part 61c extending along the first direction.

  Further, as shown in FIG. 3, the plurality of upper nozzles 61 are arranged along the first direction. Therefore, the upper nozzle row including a plurality of (four in the present embodiment) upper nozzles 61 can discharge microbubble water 61a in the form of a curtain toward the upper surface of the substrate W. The water 61a can be deposited along the first direction. Therefore, the microbubble water 61a can be satisfactorily supplied to the entire upper surface of the substrate W to be transported.

  In the present embodiment, as shown in FIG. 1, three upper nozzle rows each including a plurality of upper nozzles 61 are provided above the transport path 6. Is not limited to this. For example, it may be one or two rows, or four or more rows.

  Each upper nozzle row has been described as having four upper nozzles 61, but the number of upper nozzles 61 is not limited to this. If the microbubble water 61a can be discharged in the form of a curtain, the number of the upper nozzles 61 may be one or plural (two or more).

  The plurality of lower nozzles 62 are provided in the processing chamber 60a and below the transfer path 6, and supply the microbubble water 62a to the lower surface of the substrate W (the surface on the negative side of the Z axis). Each lower nozzle 62 has a discharge port extending in the substantially Y-axis direction (first direction) at the tip, similarly to the upper nozzle 61.

  As a result, regarding the microbubble water 62a (treatment liquid) discharged from each lower nozzle 62 toward the lower surface of the substrate W in the transport path 6, the cross section of the microbubble water 62a viewed from the first direction is the upper nozzle 61. As in the case of, the fan has a substantially fan shape. Then, the microbubble water 62a is deposited on a liquid landing portion extending along a direction (first direction) (substantially Y-axis direction) substantially perpendicular to the transport direction AR1 of the substrate W.

  The plurality of lower nozzles 62 are arranged along the first direction, like the upper nozzle 61. Therefore, the lower nozzle row including a plurality of lower nozzles 62 can discharge the microbubble water 62a in the form of a curtain toward the lower surface of the substrate W, and the microbubble water 62a in the first direction. It can be made to land along. Therefore, the microbubble water 62a can be satisfactorily supplied to the entire lower surface of the substrate W being transferred.

  In the present embodiment, as shown in FIG. 1, three lower nozzle rows each including a plurality of lower nozzles 62 are provided below the conveyance path 6 in the same manner as the upper nozzle 61. However, the number of lower nozzle rows is not limited to this. For example, it may be one or two rows, or four or more rows.

  As shown in FIG. 1, the liquid knife 66 is provided in the processing chamber 60a and above the substrate carry-in port 60b. Accordingly, a liquid curtain is formed in the vicinity of the substrate carry-in port 60b by the microbubble water 66a (treatment liquid) discharged from the liquid knife 66. Therefore, the atmosphere in the processing chamber 10a in which the chemical process that is the previous process is executed is blocked from the atmosphere in the processing chamber 60a in which the cleaning process is executed.

  Further, the liquid knife 66 is provided on the upstream side of the upper nozzle 61 and the lower nozzle 62 as viewed from the transport direction AR1. Accordingly, the microbubble water 66 a from the liquid knife 66 is supplied to the substrate W prior to the cleaning process by the upper nozzle 61 and the lower nozzle 62. That is, the upper nozzle 61 and the lower nozzle 62 can supply the microbubble water 61a and 62a to the substrate W in which the microbubble water 66a is immersed. Therefore, the cleaning process by the upper nozzle 61 and the lower nozzle 62 is efficiently performed.

  As shown in FIG. 1, the storage tank 20 is provided with a microbubble generator 21 in the tank, and stores microbubble water 20 a generated in the microbubble generator 21.

  The microbubble generator 21 generates microbubbles by mixing nitrogen gas (gas phase) from the nitrogen gas supply source 41 and pure water (liquid phase) supplied from the pure water supply source 51. . For example, the generation of microbubbles is performed by utilizing a far-centered separation effect generated by rotating a gas-liquid two-phase fluid at high speed.

  Here, when microbubble water is discharged from the nozzles 61, 62, 66 and collides with the substrate W, a physical impact is applied to the upper surface of the substrate W. Then, contaminants such as chemicals, particles, and organic substances (for example, resist residues) attached to the substrate W are released from the substrate W and removed by this physical impact.

  Further, the microbubbles contained in the microbubble water gradually contract in the microbubble water, and a part thereof disappears (so-called “collapse”). When the microbubbles are crushed in this way, the inside of the microbubbles is adiabatically compressed. As a result, a minute region (so-called “hot spot”) where the microbubbles are located immediately before disappearance becomes a high temperature (for example, several thousand degrees Celsius) and a high pressure (for example, several thousand atmospheres). Therefore, the contaminant adhering to the substrate W is released from the substrate W and removed by the action of energy emitted from the hot spot.

  In addition, the physical impact by the collision of microbubble water mainly acts on a large-sized contaminant. On the other hand, the energy dissipated by the collapse of the microbubbles mainly acts on small-size contaminants.

  Moreover, the microbubble has electroadsorption property. Further, the size of the microbubble is as small as 70 μm or less, and the surface area per unit volume of microbubble water (area of the gas-liquid interface) becomes large. Therefore, contaminants floating in the microbubble water are efficiently adsorbed by the microbubbles.

  Furthermore, the microbubble water can efficiently remove contaminants attached to the substrate W due to the electroadsorption property of the microbubbles. FIG. 4 is a diagram for explaining a cleaning process on the upper surface side of the substrate W with pure water. FIG. 5 is a diagram for explaining the cleaning process on the upper surface side of the substrate W with microbubble water.

  Here, in the cleaning process using pure water, as shown in FIG. 4, when pure water 81 is supplied to the upper surface of the substrate W, a part of the supplied pure water 81 is provided on the substrate W by the water flow. It is also introduced into the trench groove 85 and is replaced with the chemical solution adhered to the inside of the trench groove 85.

  However, the chemical solution 82 adhering to the vicinity of the bottom corner of the trench groove 85 cannot be replaced with the pure water 81 unless the high-pressure pure water 81 is introduced into the trench groove 85. Accordingly, it is necessary to supply a large amount of pure water to the substrate W, and a large amount of drainage is discharged from the substrate processing apparatus 1. As a result, in the cleaning process using pure water only, a drainage treatment facility capable of treating a large amount of drainage is required, and there has been a problem that the equipment cost related to the drainage treatment increases.

  On the other hand, in the cleaning process using the microbubble water 83, the chemical liquid 82 is replaced with the microbubble water 83 by the water flow of the microbubble water 83 and the electric adsorption action of the microbubbles. That is, as shown in FIG. 5, the microbubbles 22 adhere to the chemical solution 82 near the bottom of the trench groove 85 and rise together with the chemical solution 82. As a result, the chemical solution 82 near the bottom of the trench groove 85 is easily replaced by the microbubble water 83.

  As described above, in the cleaning unit 60 of the present embodiment, (1) physical impact caused by microbubble water (treatment liquid), (2) energy emitted from a hot spot, and (3) electricity possessed by the microbubble. Contaminants adhering to the substrate W are removed by the static adsorptivity. Therefore, the cleaning unit 60 can reduce the time required for the cleaning process, and can reduce the amount of microbubble water (processing liquid amount) required for the cleaning process. As a result, it is possible to reduce the facility cost and the drainage treatment cost required for the drainage treatment facility.

  Further, when the contaminants attached to the substrate W are removed by the microbubble water, the contact angle on the surface of the substrate W is lowered and wettability is improved. This makes it possible to uniformly supply the processing liquid supplied in the subsequent process of the cleaning process to the substrate W. Therefore, the uniformity of the substrate processing in the subsequent process can be improved.

  Returning to FIG. 1, the upper nozzle 61 is branched from a common supply pipe 71 provided with a pump 78 and a branch point 72a on the common supply pipe 71, and a micro bubble water supply pipe 73 provided with a valve 76. And is connected in communication with the vicinity of the lower part of the storage tank 20. The lower nozzle 62 is branched from a common supply pipe 71 and a branch point 71a of the common supply pipe 71, and communicates with the storage tank 20 via a microbubble water supply pipe 74 provided with a valve 77. Connected. Further, the liquid knife 66 is branched from a common supply pipe 71 and a branch point 72a, and is connected to the storage tank 20 through a microbubble water supply pipe 72 provided with a valve 75.

  Accordingly, the valve 76 is opened, the valves 75 and 77 are closed, and the pump 78 is driven, whereby the microbubble water 20a stored in the storage tank 20 is supplied to the common supply pipe 71 side. The Then, the microbubble water 20a is discharged from the upper nozzle 61.

  Further, the valve 77 is opened, the valves 75 and 76 are closed, and the pump 78 is driven, whereby the microbubble water 20a in the storage tank 20 is discharged from the lower nozzle 62. Further, the valve 75 is opened, the valves 76 and 77 are closed, and the pump 78 is driven, whereby the microbubble water 66a is discharged from the liquid knife 66.

  Moreover, even if any two or more of the valves 75 to 77 are opened, the microbubble water 20a stored in the storage tank 20 is discharged from the corresponding two or more nozzles 61, 62, 66. Good.

  As described above, in the present embodiment, the plurality of upper nozzles 61, the plurality of lower nozzles 62, and the liquid knife 66 supply microbubble water (treatment liquid) and can be cleaned with microbubble water. Used as a processing liquid supply unit. Then, the microbubble water discharged toward the substrate W is discharged from the treatment chamber 60a of the cleaning unit 60 to the drainage drain 91 side through the discharge port 63 and the discharge pipe 64 provided with the valve 65. The

  Here, as described above, the microbubble generator 21 generates microbubbles by mixing nitrogen gas and pure water. That is, these microbubbles are inert gas microbubbles, and even if the microbubbles (nitrogen gas) are dissolved in the processing liquid containing microbubbles and pure water, the chemical stability of the processing liquid is high.

  Thereby, even if it is a case where microbubble water mixes in the chemical | medical solution 11a discharged from the several discharge nozzle 11 of the chemical | medical solution unit 10, a chemical | medical solution is not deteriorated. Therefore, the amount of the processing liquid used for the cleaning process can be reduced and the cleanliness of the substrate after the cleaning process can be improved without adversely affecting the chemical process.

<3. Advantages of the substrate processing apparatus of the present embodiment>
As described above, the substrate processing apparatus 1 of the present embodiment can supply the microbubble water (processing liquid) discharged from the nozzles 61, 62, and 66 to the substrate W after the chemical processing. Thereby, the chemical | medical solution adhering to the board | substrate in a chemical | medical solution process can be rapidly substituted with microbubble water. Therefore, the amount of processing liquid used for the cleaning process can be reduced.

  Moreover, the contaminants adhering to the substrate W after the chemical treatment can be favorably removed from the substrate W by the microbubble water. Therefore, the cleanliness of the substrate W after the cleaning process can be improved.

<4. Modification>
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

  (1) In the present embodiment, the microbubble generator 21 has been described as generating microbubbles by mixing pure water and nitrogen gas, but is not limited thereto. For example, the gas mixed in the microbubble generator 21 may be carbon dioxide.

  In this case, when the chemical liquid containing the organic amine is supplied from the plurality of discharge nozzles 11 of the chemical liquid unit 10, the following advantages arise. That is, when the organic amine comes into contact with pure water, a strong alkali is generated. On the other hand, carbon dioxide gas is dissolved in the microbubble water, and the microbubble water has acidity.

  Thus, when the microbubble water is supplied to the substrate W after the chemical solution treatment, the chemical solution is neutralized by the acidic microbubble water. Therefore, it is possible to satisfactorily execute the cleaning process with the microbubble water while preventing the substrate W from being corroded by the strong alkali based on the organic amine.

  (2) The gas mixed in the microbubble generator 21 may be a gas having an oxidizing power, for example, a gas (air, air) containing oxygen (O 2), oxygen gas, or ozone gas. In this case, the following advantages arise when the stripping solution or developer is supplied as a chemical solution.

  That is, organic substances such as resist residues are attached to the substrate W after the chemical treatment (peeling treatment or development treatment). In this case, an organic substance (for example, composed of carbon C, hydrogen H, or the like) attached to the substrate W or an organic substance in microbubble water is a gas having an oxidizing power (a gas containing oxygen, oxygen gas, ozone gas, or the like). ) Is decomposed into, for example, CO 2 and H 2 O and removed by the oxidizing power of the microbubbles formed by (2). Therefore, the cleanliness of the substrate W after the cleaning process can be further improved.

  (3) Further, in the chemical liquid unit 10 of the present embodiment, the used chemical liquid used for the chemical liquid treatment is discharged to the drainage drain 91 side, but is not limited thereto. For example, a circulation mechanism (not shown) may be further added so that the chemical liquid discharged from the discharge port 13 is discharged from the discharge nozzle 11 again. Thereby, the usage-amount of a chemical | medical solution can be reduced.

  (4) Furthermore, in this Embodiment, although the microbubble generation part 21 demonstrated as what was provided in the tank of the storage tank 20, the attachment position of the microbubble generation part 21 is not limited to this.

  FIG. 6 is a diagram showing an overall configuration of a substrate processing apparatus 100 as another example of the embodiment of the present invention. The substrate processing apparatus 100 has a hardware configuration similar to that of the substrate processing apparatus 1 except for the mounting position of the microbubble generating unit.

  As shown in FIG. 6, the microbubble generator 121 is provided in a common supply pipe 71 (first supply pipe) that supplies microbubble water to the nozzles 61, 62, and 66. The microbubble generator 121 is connected to the nitrogen gas supply source 41 through a gas supply pipe 42 provided with a valve 45.

  Therefore, the microbubble generator 121 can generate microbubbles by mixing the pure water flowing through the common supply pipe 71 and the nitrogen gas from the nitrogen gas supply source 41. Thereby, the substrate processing apparatus 100 can supply microbubble water (processing liquid) to the substrate W without using a special apparatus other than the microbubble generating unit 121. Therefore, the manufacturing cost of the substrate processing apparatus 100 and the footprint of the apparatus can be reduced.

  Further, the microbubble diameter on the substrate W changes according to the mounting position of the microbubble generator 121 on the common supply pipe 71 (that is, the distance from each nozzle 61, 62, 66 to the microbubble generator 121). To do. That is, when the mounting position of the microbubble generating unit 121 is adjusted, the microbubble diameter on the substrate W is controlled.

  Therefore, the microbubble diameter is controlled to be within a range required in a good cleaning process by attaching the microbubble generator 121 to a predetermined position of the common supply pipe 71. Thereby, the microbubble water containing the microbubble of an appropriate diameter size can be supplied to the substrate W. Therefore, it is possible to perform the cleaning process more satisfactorily. In addition, the predetermined position where the microbubble generating unit 121 is attached to the common supply pipe 71 is obtained by experiment, for example.

It is a figure which shows an example of the whole structure of the substrate processing apparatus in embodiment of this invention. It is a figure for demonstrating the discharge condition of the micro bubble water (process liquid) discharged from an upper nozzle. It is a figure for demonstrating the discharge condition of the micro bubble water (process liquid) discharged from an upper nozzle. It is a figure for demonstrating the washing process by a pure water. It is a figure for demonstrating the washing process by microbubble water. It is a figure which shows the other example of the whole structure of the substrate processing apparatus in embodiment of this invention.

Explanation of symbols

1, 100 Substrate processing device 5 Conveyance roller (conveyance unit)
DESCRIPTION OF SYMBOLS 10 Chemical liquid unit 11 Discharge nozzle 11a Chemical liquid 20 Storage tank 21, 121 Micro bubble generation part 22 Micro bubble 31 Chemical liquid supply source 41 Nitrogen gas supply source 51 Pure water supply source 60 Cleaning unit 61 Upper nozzle 61a, 62a, 66a Micro bubble water 61b Discharge port 62 Lower nozzle 66 Liquid knife 71 Common supply pipe (first supply pipe)
AR1 Transport direction W Substrate

Claims (13)

A chemical solution supply unit that supplies the chemical solution to the substrate and enables chemical treatment;
A microbubble generating section for generating microbubbles;
A treatment liquid supply unit that supplies a treatment liquid containing microbubbles generated by the microbubble generation unit to the substrate to which the chemical liquid is supplied by the chemical solution supply unit, and enables a cleaning process using the treatment liquid; ,
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the processing liquid supplied from the processing liquid supply unit includes microbubbles generated by mixing pure water and an inert gas in the microbubble generation unit. The substrate processing apparatus according to claim 1,
The chemical solution supply unit supplies a chemical solution containing an organic amine,
The substrate processing apparatus, wherein the processing liquid supplied from the processing liquid supply unit includes microbubbles generated by mixing pure water and carbon dioxide in the microbubble generation unit. The substrate processing apparatus according to claim 1,
The chemical solution supplied from the chemical solution supply unit is a stripping solution that is formed on the substrate and strips a resist film that has undergone an etching process.
The substrate processing apparatus, wherein the processing liquid supplied from the processing liquid supply unit includes microbubbles generated by mixing pure water and a gas having oxidizing power in the microbubble generating unit. The substrate processing apparatus according to claim 1,
The chemical solution supplied from the chemical solution supply unit is a developer that is formed on the substrate and develops a resist film that has undergone an exposure process,
The substrate processing apparatus, wherein the processing liquid supplied from the processing liquid supply unit includes microbubbles generated by mixing pure water and a gas having oxidizing power in the microbubble generating unit. In the substrate processing apparatus of Claim 4 or Claim 5,
The substrate processing apparatus, wherein the gas having an oxidizing power is a gas containing oxygen. The substrate processing apparatus according to any one of claims 1 to 6,
The substrate processing apparatus, wherein the gas having oxidizing power is ozone gas. The substrate processing apparatus according to any one of claims 1 to 7,
The treatment liquid supply unit discharges the treatment liquid in the form of a curtain toward the substrate, and the treatment liquid is applied to the substrate along a first direction substantially perpendicular to a conveyance direction of the substrate by a conveyance unit. A substrate processing apparatus, wherein the substrate is deposited. The substrate processing apparatus according to any one of claims 1 to 7,
The treatment liquid supply unit
Having a plurality of nozzles arranged along a first direction substantially perpendicular to the substrate transport direction by the transport unit;
Each nozzle
A discharge port extending in the first direction;
A substrate processing apparatus comprising: The substrate processing apparatus according to any one of claims 1 to 9,
The substrate processing apparatus, wherein the processing liquid supply unit supplies microbubbles generated in a storage tank to the substrate. The substrate processing apparatus according to any one of claims 1 to 9,
A first supply pipe that is connected to the processing liquid supply unit and supplies the processing liquid to the processing liquid supply unit;
Further comprising
The substrate processing apparatus, wherein the microbubble generator is provided in the first supply pipe. The substrate processing apparatus according to claim 11, wherein
The substrate processing apparatus, wherein the microbubble generator is attached to a predetermined position of the first supply pipe so that the microbubble diameter is in a range required in a cleaning process with a good microbubble diameter. (a) supplying a chemical to the substrate;
(b) supplying a treatment liquid containing microbubbles generated by the microbubble generator to the substrate to which the chemical liquid has been supplied in the step (a);
A substrate processing method comprising:

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