TWI261818B - Recording/reproducing separation type magnetic head - Google Patents
Recording/reproducing separation type magnetic head Download PDFInfo
- Publication number
- TWI261818B TWI261818B TW092134596A TW92134596A TWI261818B TW I261818 B TWI261818 B TW I261818B TW 092134596 A TW092134596 A TW 092134596A TW 92134596 A TW92134596 A TW 92134596A TW I261818 B TWI261818 B TW I261818B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- shield
- magnetic pole
- magnetic head
- film thickness
- Prior art date
Links
- 238000000926 separation method Methods 0.000 title claims abstract description 36
- 239000010408 film Substances 0.000 claims abstract description 237
- 230000000694 effects Effects 0.000 claims abstract description 69
- 239000010409 thin film Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000011229 interlayer Substances 0.000 claims abstract description 22
- 238000009413 insulation Methods 0.000 claims abstract description 5
- 230000001939 inductive effect Effects 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 15
- 239000012528 membrane Substances 0.000 claims description 4
- 238000009966 trimming Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 230000006698 induction Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 239000000956 alloy Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 230000001172 regenerating effect Effects 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 230000008929 regeneration Effects 0.000 description 3
- 238000011069 regeneration method Methods 0.000 description 3
- 101100481570 Caenorhabditis elegans tlp-1 gene Proteins 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910003321 CoFe Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000002917 insecticide Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D7/00—Planing or slotting machines characterised only by constructional features of particular parts
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
- G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
- G11B5/3912—Arrangements in which the active read-out elements are transducing in association with active magnetic shields, e.g. magnetically coupled shields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D1/00—Planing or slotting machines cutting by relative movement of the tool and workpiece in a horizontal straight line only
- B23D1/08—Planing or slotting machines cutting by relative movement of the tool and workpiece in a horizontal straight line only by movement of the tool
- B23D1/10—Planing or slotting machines cutting by relative movement of the tool and workpiece in a horizontal straight line only by movement of the tool with means for adjusting the tool-guide vertically
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
- Mechanical Engineering (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003037680A JP2004247001A (ja) | 2003-02-17 | 2003-02-17 | 記録再生分離型磁気ヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200421289A TW200421289A (en) | 2004-10-16 |
| TWI261818B true TWI261818B (en) | 2006-09-11 |
Family
ID=33022400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092134596A TWI261818B (en) | 2003-02-17 | 2003-12-08 | Recording/reproducing separation type magnetic head |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7262940B2 (enExample) |
| JP (1) | JP2004247001A (enExample) |
| KR (1) | KR100621505B1 (enExample) |
| TW (1) | TWI261818B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5338711B2 (ja) * | 2010-02-23 | 2013-11-13 | Ｔｄｋ株式会社 | 磁気センサー、磁気検出装置、及び磁気ヘッド |
| US8432773B2 (en) | 2010-12-08 | 2013-04-30 | Tdk Corporation | Thermally-assisted magnetic head having bank layer between magnetic pole and plasmon generator |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5633771A (en) * | 1993-09-29 | 1997-05-27 | Kabushiki Kaisha Toshiba | Magnetoresistance effect type head and separate recording-reproducing type magnetic head |
| KR0153311B1 (ko) * | 1994-04-06 | 1998-12-15 | 가나이 쯔도무 | 자기 저항 효과형 박막 자기 헤드 및 그 제조 방법 |
| JPH10162322A (ja) * | 1996-11-28 | 1998-06-19 | Nec Corp | 磁気抵抗効果型複合ヘッドおよびその製造方法 |
| JP2914343B2 (ja) * | 1997-04-07 | 1999-06-28 | 日本電気株式会社 | 磁気抵抗効果型複合ヘッド及びその製造方法並びに磁気記憶装置 |
| KR100623812B1 (ko) * | 1998-07-21 | 2006-09-12 | 시게이트 테크놀로지 엘엘씨 | 자기저항 기록 헤드에서의 센서 온도 감소 |
| JP2000306215A (ja) * | 1999-04-16 | 2000-11-02 | Toshiba Corp | 磁気ヘッド及びこれを用いた磁気ディスク装置 |
| JP3599235B2 (ja) * | 1999-07-19 | 2004-12-08 | Ｔｄｋ株式会社 | 薄膜磁気ヘッド、磁気ヘッド装置及び磁気ディスク装置 |
| JP3473684B2 (ja) * | 1999-11-08 | 2003-12-08 | 日本電気株式会社 | 磁気ヘッドおよびその製造方法、それを用いる磁気記録再生装置 |
| JP2001110008A (ja) * | 1999-10-06 | 2001-04-20 | Nec Corp | 磁気ヘッドおよびその製造方法、および磁気記録再生装置 |
-
2003
- 2003-02-17 JP JP2003037680A patent/JP2004247001A/ja active Pending
- 2003-12-08 TW TW092134596A patent/TWI261818B/zh not_active IP Right Cessation
-
2004
- 2004-02-12 US US10/778,909 patent/US7262940B2/en not_active Expired - Fee Related
- 2004-02-17 KR KR1020040010305A patent/KR100621505B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040074952A (ko) | 2004-08-26 |
| US20040228041A1 (en) | 2004-11-18 |
| TW200421289A (en) | 2004-10-16 |
| US7262940B2 (en) | 2007-08-28 |
| JP2004247001A (ja) | 2004-09-02 |
| KR100621505B1 (ko) | 2006-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |