TWI256999B - Apparatus and method for detecting defect and apparatus and method for extracting wire area - Google Patents

Apparatus and method for detecting defect and apparatus and method for extracting wire area

Info

Publication number
TWI256999B
TWI256999B TW094112336A TW94112336A TWI256999B TW I256999 B TWI256999 B TW I256999B TW 094112336 A TW094112336 A TW 094112336A TW 94112336 A TW94112336 A TW 94112336A TW I256999 B TWI256999 B TW I256999B
Authority
TW
Taiwan
Prior art keywords
image
area
wire
eroded
defect
Prior art date
Application number
TW094112336A
Other languages
English (en)
Other versions
TW200540411A (en
Inventor
Hiroshi Sano
Eiji Nishihara
Yasushi Nagata
Atsushi Imamura
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200540411A publication Critical patent/TW200540411A/zh
Application granted granted Critical
Publication of TWI256999B publication Critical patent/TWI256999B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW094112336A 2004-05-13 2005-04-19 Apparatus and method for detecting defect and apparatus and method for extracting wire area TWI256999B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004143794A JP4518835B2 (ja) 2004-05-13 2004-05-13 欠陥検出装置、配線領域抽出装置、欠陥検出方法および配線領域抽出方法

Publications (2)

Publication Number Publication Date
TW200540411A TW200540411A (en) 2005-12-16
TWI256999B true TWI256999B (en) 2006-06-21

Family

ID=35309446

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094112336A TWI256999B (en) 2004-05-13 2005-04-19 Apparatus and method for detecting defect and apparatus and method for extracting wire area

Country Status (5)

Country Link
US (1) US20050254699A1 (zh)
JP (1) JP4518835B2 (zh)
KR (1) KR100689792B1 (zh)
CN (1) CN100565196C (zh)
TW (1) TWI256999B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408362B (zh) * 2009-10-19 2013-09-11 Innolux Corp 陣列基板與液晶面板的自動檢測方法，製程機台及其陣列基板自動檢測裝置
TWI794953B (zh) * 2020-09-11 2023-03-01 美商美超微電腦股份有限公司 檢查電路板之未經授權修改

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008232814A (ja) * 2007-03-20 2008-10-02 Shimadzu Corp Ｘ線異物検査装置
US8300918B2 (en) * 2007-03-30 2012-10-30 Dainippon Screen Mfg. Co., Ltd. Defect inspection apparatus, defect inspection program, recording medium storing defect inspection program, figure drawing apparatus and figure drawing system
JP5015721B2 (ja) * 2007-03-30 2012-08-29 大日本スクリーン製造株式会社 欠陥検査装置、欠陥検査プログラム、図形描画装置および図形描画システム
WO2010032562A1 (ja) * 2008-09-18 2010-03-25 インターナショナル・ビジネス・マシーンズ・コーポレーション 検査対象物の欠陥の発見を支援するシステム及び方法
JP5545240B2 (ja) * 2011-02-22 2014-07-09 株式会社デンソー 仮組み用ワイヤ残留検出装置および仮組み用ワイヤ残留検出方法
US9092842B2 (en) * 2011-08-04 2015-07-28 Sharp Laboratories Of America, Inc. System for defect detection and repair
JP5971516B2 (ja) * 2012-03-28 2016-08-17 日立化成株式会社 配線基板の検査方法
CN103106396B (zh) * 2013-01-06 2016-07-06 中国人民解放军91655部队 一种危险区域检测方法
CN103969853B (zh) * 2013-02-05 2016-06-01 北京京东方光电科技有限公司 阵列基板及其检测方法和检测装置
JP2015025758A (ja) * 2013-07-26 2015-02-05 Hoya株式会社 基板検査方法、基板製造方法および基板検査装置
JP6244981B2 (ja) * 2014-02-28 2017-12-13 大日本印刷株式会社 外観検査装置、外観検査方法、およびプログラム
WO2016051807A1 (ja) * 2014-10-02 2016-04-07 日本特殊陶業株式会社 判定方法、レーザ装置、及びセンサの製造方法
CN105891232A (zh) * 2014-12-23 2016-08-24 北京金晶智慧有限公司 一种快速检查大面积Low-E镀膜玻璃膜层缺陷的方法
US9983148B2 (en) * 2015-05-28 2018-05-29 Kla-Tencor Corporation System and method for production line monitoring
KR102592921B1 (ko) * 2015-12-31 2023-10-23 삼성전자주식회사 패턴 결함 검사 방법
JP6617963B2 (ja) * 2016-02-17 2019-12-11 株式会社Ｓｃｒｅｅｎホールディングス 基板保持状態の異常検査の検査領域の自動決定方法および基板処理装置
CN110021005B (zh) * 2018-01-05 2022-03-15 财团法人工业技术研究院 电路板瑕疵筛选方法及其装置与计算机可读取记录介质
CN111382615A (zh) * 2018-12-28 2020-07-07 致茂电子(苏州)有限公司 影像检测方法
JP2020144691A (ja) * 2019-03-07 2020-09-10 株式会社Ｓｃｒｅｅｎホールディングス 代表色決定方法、検査装置、検査方法およびプログラム
US11374374B2 (en) 2019-08-09 2022-06-28 The Boeing Company Method and system for alignment and insertion of wire contact with wire contact insertion holes of a connector
CN110473798B (zh) * 2019-08-19 2021-10-19 上海华力微电子有限公司 一种晶圆表面超小尺寸缺陷检测方法
US11670894B2 (en) 2020-06-19 2023-06-06 The Boeing Company Method and system for error correction in automated wire contact insertion within a connector
US11151405B1 (en) * 2020-06-19 2021-10-19 The Boeing Company Method and system for machine vision detection
CN114862897A (zh) * 2022-04-24 2022-08-05 北京百度网讯科技有限公司 一种图像背景处理方法、装置及电子设备
CN114627113B (zh) * 2022-05-12 2022-07-29 成都数之联科技股份有限公司 一种印制电路板缺陷检测方法及系统及装置及介质
CN115661148B (zh) * 2022-12-26 2023-04-11 视睿（杭州）信息科技有限公司 一种晶圆晶粒排列检测方法及系统
CN116245876A (zh) * 2022-12-29 2023-06-09 摩尔线程智能科技(北京)有限责任公司 缺陷检测方法、装置、电子设备、存储介质和程序产品
CN115753778B (zh) * 2023-01-10 2023-07-07 泉州海关综合技术服务中心 一种茶叶灰分测定方法和系统

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232583A (ja) * 1985-08-05 1987-02-12 Toshiba Corp 濃淡画像の処理方法
JPH01276003A (ja) * 1988-04-28 1989-11-06 Seiko Instr Inc 微小部品の位置認識方法
JPH02108167A (ja) * 1988-10-17 1990-04-20 Hitachi Constr Mach Co Ltd 光学検査装置
US4975972A (en) * 1988-10-18 1990-12-04 At&T Bell Laboratories Method and apparatus for surface inspection
JPH0731126B2 (ja) * 1989-10-19 1995-04-10 株式会社クボタ 粒状物検査システム
JP3009205B2 (ja) * 1990-11-02 2000-02-14 株式会社日立製作所 検査方法及びその装置
JP3265595B2 (ja) * 1991-09-27 2002-03-11 オムロン株式会社 画像処理方法およびその装置
JP3309530B2 (ja) * 1993-02-03 2002-07-29 松下電器産業株式会社 配線パターン検査装置
JPH0933449A (ja) * 1995-07-20 1997-02-07 Toyobo Co Ltd シートの微小突起検査装置
US5848189A (en) * 1996-03-25 1998-12-08 Focus Automation Systems Inc. Method, apparatus and system for verification of patterns
US20040081350A1 (en) * 1999-08-26 2004-04-29 Tadashi Kitamura Pattern inspection apparatus and method
US7817844B2 (en) * 1999-08-26 2010-10-19 Nanogeometry Research Inc. Pattern inspection apparatus and method
JP4669940B2 (ja) * 2001-01-10 2011-04-13 国際技術開発株式会社 パターン欠陥検出方法および装置
JP4139571B2 (ja) * 2001-02-28 2008-08-27 大日本スクリーン製造株式会社 カラー画像の領域分割
US7190832B2 (en) * 2001-07-17 2007-03-13 Amnis Corporation Computational methods for the segmentation of images of objects from background in a flow imaging instrument
JP2003172711A (ja) * 2001-09-26 2003-06-20 Dainippon Screen Mfg Co Ltd 画像処理を利用した検査対象物の表面検査
JP2004085543A (ja) * 2002-06-27 2004-03-18 Topcon Corp 外観検査装置及び外観検査方法
JP2004132950A (ja) * 2002-08-09 2004-04-30 Topcon Corp 外観検査装置及び外観検査方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408362B (zh) * 2009-10-19 2013-09-11 Innolux Corp 陣列基板與液晶面板的自動檢測方法，製程機台及其陣列基板自動檢測裝置
TWI794953B (zh) * 2020-09-11 2023-03-01 美商美超微電腦股份有限公司 檢查電路板之未經授權修改

Also Published As

Publication number Publication date
KR100689792B1 (ko) 2007-03-08
KR20060045967A (ko) 2006-05-17
US20050254699A1 (en) 2005-11-17
TW200540411A (en) 2005-12-16
JP4518835B2 (ja) 2010-08-04
CN1696671A (zh) 2005-11-16
JP2005326226A (ja) 2005-11-24
CN100565196C (zh) 2009-12-02

Similar Documents

Publication Publication Date Title
TWI256999B (en) Apparatus and method for detecting defect and apparatus and method for extracting wire area
TW200613696A (en) Film detection apparatus for detecting organic film formed on printed circuit board, inspection system, and method of inspecting printed circuit board
TW200716969A (en) Defect detecting method and defect detecting device
CN105453153B (zh) 交通灯检测
TWI264793B (en) Defect detection apparatus and defect detection method
EP2146306A3 (en) Image processing apparatus and image processing method
WO2010104800A3 (en) Methods and systems for generating an inspection process for a wafer
DE602006007094D1 (de) Verfahren und vorrichtung zum korrigieren von hybridblitzartefakten in digitalen bildern
JP5234639B2 (ja) スルーホールの検査装置
MY188165A (en) System and method for inspecting a wafer
DE602005007583D1 (de) Verfahren, vorrichtung und programm zur erfassung eines objekts
TW201612504A (en) Inspection apparatus and inspection method
TW200604515A (en) Technique for detecting a defect of an object by area segmentation of a color image of the object
ATE390800T1 (de) Verfahren und vorrichtung zum detektieren von defekten bildpunkten gemäss dem ausleseverfahren
MY171987A (en) Method, computer system and apparatus for recipe generation for automated inspection of semiconductor devices
NZ591722A (en) Obstacle detection system for use with mobile machines includes inverting image and assigning each pixel of the image one of two values
WO2018068417A1 (zh) 元件缺陷检测方法和系统
ATE535819T1 (de) Verfahren und vorrichtung zum testen von unbestückten leiterplatten
TW200628758A (en) Method and system of inspecting mura-defect and method of fabricating photomask
WO2012161874A3 (en) Contour-based defect detection using an inspection apparatus
WO2017071406A1 (zh) 金针类元件的引脚检测方法和系统
ATE521882T1 (de) Messverfahren und -vorrichtung für die konzentration von inhaltsstoffen
WO2006127408A3 (en) Method and system for increased accuracy for extraction of electrical parameters
DE502005006670D1 (de) Vorrichtung und Verfahren zum Bestimmen eines Korrelationswertes
WO2005008223A3 (en) Methods for defect detection and process monitoring based on sem images