TWI242240B - Supply system for clean liquid - Google Patents

Supply system for clean liquid Download PDF

Info

Publication number
TWI242240B
TWI242240B TW090121912A TW90121912A TWI242240B TW I242240 B TWI242240 B TW I242240B TW 090121912 A TW090121912 A TW 090121912A TW 90121912 A TW90121912 A TW 90121912A TW I242240 B TWI242240 B TW I242240B
Authority
TW
Taiwan
Prior art keywords
cleaning
cleaning liquid
liquid
station
liquid tank
Prior art date
Application number
TW090121912A
Other languages
English (en)
Chinese (zh)
Inventor
Futoshi Shimai
Yasunobu Hira
Jun Koshiyama
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Application granted granted Critical
Publication of TWI242240B publication Critical patent/TWI242240B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
TW090121912A 2000-09-05 2001-09-04 Supply system for clean liquid TWI242240B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000268450A JP3683485B2 (ja) 2000-09-05 2000-09-05 洗浄液の供給システム

Publications (1)

Publication Number Publication Date
TWI242240B true TWI242240B (en) 2005-10-21

Family

ID=18755231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090121912A TWI242240B (en) 2000-09-05 2001-09-04 Supply system for clean liquid

Country Status (4)

Country Link
JP (1) JP3683485B2 (ko)
KR (1) KR100767392B1 (ko)
CN (1) CN100446189C (ko)
TW (1) TWI242240B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7968272B2 (en) 2005-11-18 2011-06-28 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method to form resist pattern

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100780718B1 (ko) 2004-12-28 2007-12-26 엘지.필립스 엘시디 주식회사 도포액 공급장치를 구비한 슬릿코터
KR100675643B1 (ko) 2004-12-31 2007-02-02 엘지.필립스 엘시디 주식회사 슬릿코터
KR100700180B1 (ko) 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 예비토출부를 구비한 슬릿코터 및 이를 이용한 코팅방법
KR100700181B1 (ko) 2004-12-31 2007-03-27 엘지.필립스 엘시디 주식회사 노즐대기부를 구비한 슬릿코터 및 이를 이용한 코팅방법
KR101009047B1 (ko) * 2009-02-09 2011-01-18 세메스 주식회사 기판 세정 장치
CN101947523B (zh) * 2010-10-21 2012-05-30 高佳太阳能股份有限公司 硅片清洗废水回用装置
CN102632051A (zh) * 2012-04-16 2012-08-15 江苏永能光伏科技有限公司 去磷硅玻璃清洗机中纯水二次利用装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5252475A (en) * 1975-10-27 1977-04-27 Nec Home Electronics Ltd Cleaning system
US5503681A (en) * 1990-03-16 1996-04-02 Kabushiki Kaisha Toshiba Method of cleaning an object
JPH04297590A (ja) * 1991-03-27 1992-10-21 Asahi Chem Ind Co Ltd 洗浄方法
JP3408895B2 (ja) * 1995-06-16 2003-05-19 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
KR0179784B1 (ko) * 1995-12-19 1999-04-15 문정환 반도체 웨이퍼 세정장치
KR0179783B1 (ko) * 1995-12-19 1999-04-15 문정환 반도체 웨이퍼 세정장치
US5673713A (en) * 1995-12-19 1997-10-07 Lg Semicon Co., Ltd. Apparatus for cleansing semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7968272B2 (en) 2005-11-18 2011-06-28 Kabushiki Kaisha Toshiba Semiconductor device manufacturing method to form resist pattern

Also Published As

Publication number Publication date
JP3683485B2 (ja) 2005-08-17
CN1343002A (zh) 2002-04-03
KR20020019406A (ko) 2002-03-12
CN100446189C (zh) 2008-12-24
JP2002079193A (ja) 2002-03-19
KR100767392B1 (ko) 2007-10-17

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MM4A Annulment or lapse of patent due to non-payment of fees