TWI242240B - Supply system for clean liquid - Google Patents
Supply system for clean liquid Download PDFInfo
- Publication number
- TWI242240B TWI242240B TW090121912A TW90121912A TWI242240B TW I242240 B TWI242240 B TW I242240B TW 090121912 A TW090121912 A TW 090121912A TW 90121912 A TW90121912 A TW 90121912A TW I242240 B TWI242240 B TW I242240B
- Authority
- TW
- Taiwan
- Prior art keywords
- cleaning
- cleaning liquid
- liquid
- station
- liquid tank
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000268450A JP3683485B2 (ja) | 2000-09-05 | 2000-09-05 | 洗浄液の供給システム |
Publications (1)
Publication Number | Publication Date |
---|---|
TWI242240B true TWI242240B (en) | 2005-10-21 |
Family
ID=18755231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW090121912A TWI242240B (en) | 2000-09-05 | 2001-09-04 | Supply system for clean liquid |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3683485B2 (ko) |
KR (1) | KR100767392B1 (ko) |
CN (1) | CN100446189C (ko) |
TW (1) | TWI242240B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7968272B2 (en) | 2005-11-18 | 2011-06-28 | Kabushiki Kaisha Toshiba | Semiconductor device manufacturing method to form resist pattern |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100780718B1 (ko) | 2004-12-28 | 2007-12-26 | 엘지.필립스 엘시디 주식회사 | 도포액 공급장치를 구비한 슬릿코터 |
KR100700180B1 (ko) | 2004-12-31 | 2007-03-27 | 엘지.필립스 엘시디 주식회사 | 예비토출부를 구비한 슬릿코터 및 이를 이용한 코팅방법 |
KR100700181B1 (ko) | 2004-12-31 | 2007-03-27 | 엘지.필립스 엘시디 주식회사 | 노즐대기부를 구비한 슬릿코터 및 이를 이용한 코팅방법 |
KR100675643B1 (ko) | 2004-12-31 | 2007-02-02 | 엘지.필립스 엘시디 주식회사 | 슬릿코터 |
KR101009047B1 (ko) * | 2009-02-09 | 2011-01-18 | 세메스 주식회사 | 기판 세정 장치 |
CN101947523B (zh) * | 2010-10-21 | 2012-05-30 | 高佳太阳能股份有限公司 | 硅片清洗废水回用装置 |
CN102632051A (zh) * | 2012-04-16 | 2012-08-15 | 江苏永能光伏科技有限公司 | 去磷硅玻璃清洗机中纯水二次利用装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5252475A (en) * | 1975-10-27 | 1977-04-27 | Nec Home Electronics Ltd | Cleaning system |
US5503681A (en) * | 1990-03-16 | 1996-04-02 | Kabushiki Kaisha Toshiba | Method of cleaning an object |
JPH04297590A (ja) * | 1991-03-27 | 1992-10-21 | Asahi Chem Ind Co Ltd | 洗浄方法 |
JP3408895B2 (ja) * | 1995-06-16 | 2003-05-19 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
KR0179783B1 (ko) * | 1995-12-19 | 1999-04-15 | 문정환 | 반도체 웨이퍼 세정장치 |
US5673713A (en) * | 1995-12-19 | 1997-10-07 | Lg Semicon Co., Ltd. | Apparatus for cleansing semiconductor wafer |
KR0179784B1 (ko) * | 1995-12-19 | 1999-04-15 | 문정환 | 반도체 웨이퍼 세정장치 |
-
2000
- 2000-09-05 JP JP2000268450A patent/JP3683485B2/ja not_active Expired - Fee Related
-
2001
- 2001-09-04 KR KR1020010054068A patent/KR100767392B1/ko active IP Right Grant
- 2001-09-04 TW TW090121912A patent/TWI242240B/zh not_active IP Right Cessation
- 2001-09-05 CN CNB011372311A patent/CN100446189C/zh not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7968272B2 (en) | 2005-11-18 | 2011-06-28 | Kabushiki Kaisha Toshiba | Semiconductor device manufacturing method to form resist pattern |
Also Published As
Publication number | Publication date |
---|---|
CN1343002A (zh) | 2002-04-03 |
KR20020019406A (ko) | 2002-03-12 |
JP3683485B2 (ja) | 2005-08-17 |
CN100446189C (zh) | 2008-12-24 |
KR100767392B1 (ko) | 2007-10-17 |
JP2002079193A (ja) | 2002-03-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |