TWI240061B - Method for manufacturing heat collector - Google Patents

Method for manufacturing heat collector Download PDF

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Publication number
TWI240061B
TWI240061B TW093103664A TW93103664A TWI240061B TW I240061 B TWI240061 B TW I240061B TW 093103664 A TW093103664 A TW 093103664A TW 93103664 A TW93103664 A TW 93103664A TW I240061 B TWI240061 B TW I240061B
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TW
Taiwan
Prior art keywords
heat
liquid
collector
liquid cooling
manufacturing
Prior art date
Application number
TW093103664A
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English (en)
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TW200528677A (en
Inventor
Jung-Fong Huang
Chih-Chien Huang
Original Assignee
Forward Electronics Co Ltd
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Publication date
Application filed by Forward Electronics Co Ltd filed Critical Forward Electronics Co Ltd
Priority to TW093103664A priority Critical patent/TWI240061B/zh
Priority to US10/866,771 priority patent/US20050178004A1/en
Priority to US10/962,593 priority patent/US20050178530A1/en
Publication of TW200528677A publication Critical patent/TW200528677A/zh
Application granted granted Critical
Publication of TWI240061B publication Critical patent/TWI240061B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49359Cooling apparatus making, e.g., air conditioner, refrigerator
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49373Tube joint and tube plate structure

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

1240061 % 玫、發明說明: 【發明所屬之技術領域】 尤指一種適用於 電腦裝置之集熱器製造方法。 5 【先前技術】 其 出 於一般電腦裝置中, 中央處理單元(CPU), ,則必須組設有一散熱裝置。 其内部之主要發熱 電子元件係為 而為有效將其所產生之熱量散 10 _參閱圖1係習知水冷式散熱裝置之立體圖,盆主要 包括有-集熱料91、—水箱92、以及—散熱單元、93, 其中之11熱單元91係用以收集上述中央處理單元(CPU)等 發熱電子70件所產生之熱量’並經由熱管%將熱量帶至散 熱單元93加以散出,而水箱92則是_儲存整體散熱裝 15 置所使用之液體介質。 請參閱圖2係習知集熱單元之立體分解圖,其中顯示 集熱單元91係由一集熱片911、一墊片912、以及一上蓋 913所組成,且於集熱片911上凹設有—液體流道91〇,缺 而,習知之集熱單元91之零件數目較多,1液體流道⑽ 20内之液體係藉由墊片912而加以密封,藉μ止液㈣ 漏’但塾片912使用一段時間之後,仍會因為機械疲勞而 產生損壞,並因此造成集熱單元91產生液體沒漏之問題, 並非十分理想。 1240061 【發明内容】 —~冰魏之錄目一的輕—提農二種I熱器一製造方法二俾 5 能有效防止液體之㈣,並可減少零件數,降低製造成本^ 為達成上述目的,本發明之集熱器製造方法 下列步驟: 文匕枯 步驟A ··提供一液冷管於一集熱片之上表面上,且液 係迂迴靑折於同一共平面上,而此共平面則係平貼於 集熱片之上表面; 10 步驟B :提供焊料於集熱片上表面與液冷管上; nt驟c ··加熱液冷管、集熱片、與谭料,並使焊料熔 <流動填塞於集熱片上表面與液冷#間之毛 以及 15 步驟D:冷卻液冷管與集熱片,促使焊料凝固而結合 集熱片與液冷管。 此外,本發明另一特色之集熱器結構則主要包括有一 集熱片、以及一液冷管。其中,集熱片並包括有一上表面, :液冷管係焊接組設於集熱片之上表面,且液冷管係迁迴 弓折於同一共平面上,並以此共平面平貼於集熱片之上表 面,同時於液冷管之二端分別形成有一出口、以及一入口。 由上述可知,本發明之集熱器製造方法或是集敎0 構係僅單純使用-集熱片與-液冷管即可完成’如此可有。 效減少零件數’相對可降低製造成本。此外’藉由液冷管 之設計,可使散熱用之液體流動於液冷管内,因此無須如 20 1240061 傳統般必須另外設置一密封用之墊 防止散熱用之液體發生a漏問題m目對即可達成有效
【實施方式】 5 為能讓貴審查委員能更瞭解 舉一較佳具體實施例說明如下。 月之技術内容,特 =時參_3係本發明之流_ 體刀解圖、及圖5係本發明之立體租 知月之立 10 顯示有-本發明之集熱器結構,而圖二 製造方法之流程,詳細說明如下。、U不本發明集熱器 首先,係提供一液冷管i於一集熱片2之上表心上 (SA)’且液冷管丨係迁迴f折於同—共平面 是平貼於集熱片2之上表-1。前述之液冷管= 15 板或是其他等效方式使其呈扁平狀,如此可增加液 冷官1與集熱片2上表面21間之接觸面積。 之後’提供-㈣點低於液冷管i與集熱片2之溶點之 焊料3,於本實施例巾,係使用燐銅焊棒(而drod〇f 心)、,且將其長度依照液冷fl迁迴f折之長度而做適當 之到裁’然後將其置放於集熱片2上表面21與液冷管^ 20 (SB)。 當焊料3置放完成之後,將液冷管丨、集熱片2、與焊 料3送入一烘爐(圖未示)内進行加熱作業”。,於本實施 例中’係使用-種名為光輝爐(Furnace卜―叩)之烘爐,其 可加熱液冷管1、集熱片2、與焊料3,此時,由於焊料3之 l24〇〇6j 警壤:賓\ ^點係低於液冷管1與集熱片2之炫點,因此,焊料3可先溶
Ilf以毛細力流動填塞於集熱片2上表面21與液冷管丨間 毛-細-隙缝與^— 〜Ss…— ———— 5 人隹=,冷卻液冷管1與集熱片2,促使焊:凝固: 合集熱片2與液冷管1(81)), U肉、、口 且其可置設於-中央處理卩可完成一集熱器結構, 元件上使用。、早兀4(如圖4所示)之發熱電子 請再同時參閱圖4、及图ς .., 10 出之集熱器結構係包括有—二精2由上述之製造方法所得 *’集熱片2並包括有Λ/面:以及一液冷管卜其 棒之焊料3焊接組設於集熱片 千 且液冷官1係迂迴彎折於同一 16721 則係平貼於集熱片2之 ',而此共平面η 分別形成有1口12 /_面21,_於液冷管1之二端則 15 述之^本實施例中,由於銅具有較佳之埶傳導特性故上 乃2係為一鋼片,而液 丨果熱 或其他金屬材質。 …一銅官’當然亦可使用鋁 由上述可知,集熱器於 2與—液冷管丨即 、係僅品使用一集熱片 少零件數,相對 "如此可確實減 計,可使鸯勒♦低成本。此外,藉由液冷管丨之嗖 J使放熱用之液體流動於液 吕1之口又 般必須另外設置一宓 Q此热須如傳統 散熱用之液俨’相對即可達成有效防止 / 夜體發生洩漏問題之目的。 止 20 ΙΑ 1240061 上述實施例僅係為了方便說明而舉例而已,本發明所 主張之權利範圍自應以申請專利範圍所述為準,而非僅限 -於—上一述—實—施眉_ 5【圖式簡單說明】 圖1係習知水冷式散熱裝置之立體圖。 圖2係習知集熱單元之立體分解圖。 圖3係本發明之流程圖。 圖4係本發明之立體分解圖。 10圖5係本發明之立體組合圖。 【圖號說明】 1 液冷管 13 入口 3 焊料 91〇液體流道 913上蓋 94 熱管 11 共平面 2 集熱片 4 中央處理單 911集熱片 92水箱 u 出口 21 上表面 元91 集熱單元 912墊片 93散熱單元

Claims (1)

1240061 η 94 5.2 拾、申請專利範圍·· 1. -種集熱器製造方法,包括下列步驟: ’驟t:-貧供 >液本管 冷管係迁迴彎折於同一丘平面/抑W士’締 上表面; /、十面上,且該共平面係平貼於該 步驟B:提供焊料於該集熱片上表面與該液冷管上; 步驟C :加熱該液冷管、 ._ ^ , 該焊料熔化德、、…h 片、與§亥焊料,並使 真該集熱片上表面與該液冷管間之 毛細隙縫内;以及 10 =驟D :冷卻該液冷管與該集熱片,促使該焊料凝固 而、、、口 3該集熱片與該液冷管。 2·广申請專利範圍第i項所述之集熱器製造方法,其 ’於該步驟A中,該液冷管係略呈扁平狀。 15 中,、如申明專利範圍第1項所述之集熱器製造方法,其 於邊步驟B中,該焊料係指燐銅焊棒,且其熔點係低 於该液冷管與該集熱片之熔點。 、·如申请專利範圍第1項所述之集熱器製造方法,其 ,於該步驟c中,係於一烘爐内進行加熱作業。 5·如申請專利範圍第4項所述之集熱器製造方法,其 中,該烘爐係為一光輝爐。
TW093103664A 2004-02-16 2004-02-16 Method for manufacturing heat collector TWI240061B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW093103664A TWI240061B (en) 2004-02-16 2004-02-16 Method for manufacturing heat collector
US10/866,771 US20050178004A1 (en) 2004-02-16 2004-06-15 Heat absorber and its fabrication
US10/962,593 US20050178530A1 (en) 2004-02-16 2004-10-13 Heat absorber and its fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093103664A TWI240061B (en) 2004-02-16 2004-02-16 Method for manufacturing heat collector

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TWI240061B true TWI240061B (en) 2005-09-21

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
WO2018044813A1 (en) * 2016-08-31 2018-03-08 Nlight, Inc. Laser cooling system
US10784645B2 (en) 2018-03-12 2020-09-22 Nlight, Inc. Fiber laser having variably wound optical fiber
CN111402728B (zh) * 2020-03-24 2022-05-31 京东方科技集团股份有限公司 弯折垫片组件、柔性oled模组以及oled设备

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US20050178004A1 (en) 2005-08-18
US20050178530A1 (en) 2005-08-18

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