1311457 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種散熱器，尤侧於-種具較高散熱效率的散熱 器。 【先前技術】 在目前之散熱領域中，熱管式散熱器由於具有良好之散熱性能， 現已被愈來愈多之薇商所接受。該種散熱器可將電子元件產生之熱量 快速地傳導出去，避免電子元件内部熱量之累積，延長電子元件的使1311457 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat sink, and more particularly to a heat sink having a high heat dissipation efficiency. [Prior Art] In the current heat dissipation field, the heat pipe type heat sink has been accepted by more and more Weishang due to its good heat dissipation performance. The heat sink can quickly conduct heat generated by the electronic components, avoid the accumulation of heat inside the electronic components, and prolong the electronic components.
用筹命。 、 〜如何熱管與散舰》之難觸於提昇該種散無之散熱性 月匕產生重要影響。通常之做法係在熱管與散_片間塗觸膏等導熱 介質以降低它們之間的熱阻’從而提昇整個散熱器之散熱性能。 如第-圖所示為-習知之熱管式散熱器2的立體圖，該散熱器2 之各政U 3上3又置-開孔4,該開孔4包括收容熱管5的圓形熱管 孔及，置錫膏等鲜料的圓形銲料孔6，該銲料孔6設於熱管孔上部，’與 該熱管孔滅通。該散熱H 2組裝時，縣將銲料及熱管5分別置於 散熱賴3之銲料孔6及歸孔内，完成該散熱器2的馳裝，然後 加熱該預組裝後的散熱器2，使銲料孔6内的辉料融化，沿該辉料孔6 咖壁流經鱗· 6與齡接合雜1翻達鮮孔，填充於教 散_片3間的㈣内，經冷卻後，將該熱管5峡至散熱續 2之組裝過程中，當鱗的銲料流經該銲料孔6與熱 子的接合雜I時’料堆積在該接合部位〗而形成附著在散熱轉片3 _^小錫珠’錢簡驗費’增加魏熱器 【發明内容】 有鑑於此， 一種散熱器 下面以具體實施例說明_種加工成本較低的散熱器。 ’包括複練蘭>j及穿設於料散熱鰭片令的熱 1311457 散偏與鮮之間藉由接合職合，該散熱則上設有可使 開孔’該開孔的邊緣包括第一邊緣部及第二邊緣部’該第 一邊緣部的形狀與熱管的形狀相對應，第二邊緣部圍成-躲收容該 接合劑的空間，該第二邊緣部設有二與該第一邊緣部連接的導引面， 该一導引面間的距離由遠離第一邊緣部的位置向近第一邊緣部的位置 逐漸增加’可使該空間内的接合劑熔融後沿該導引面流向第一邊緣 部’將熱管與散熱鰭片接合。Use life. ~ How to heat pipe and bulk ship" hard to touch the heat dissipation of this kind of dispersion. The moon has an important impact. The usual practice is to apply a heat-conducting medium such as a paste between the heat pipe and the diffuser to reduce the thermal resistance between them to improve the heat dissipation performance of the entire heat sink. As shown in the figure, there is shown a perspective view of a conventional heat pipe type heat sink 2, wherein each of the heat exchangers 2 has a third hole-opening 4, and the opening 4 includes a circular heat pipe hole for accommodating the heat pipe 5 and A circular solder hole 6 of a fresh material such as a solder paste is placed, and the solder hole 6 is provided in an upper portion of the heat pipe hole, and is extinguished from the heat pipe hole. When the heat dissipation H 2 is assembled, the county places the solder and the heat pipe 5 in the solder holes 6 and the holes of the heat dissipation layer 3, completes the mounting of the heat sink 2, and then heats the pre-assembled heat sink 2 to make the solder The phosphor in the hole 6 melts, and flows along the surface of the glow hole 6 through the scale 6 and the age of the joint 1 to fill the fresh hole, and is filled in the (4) between the teachings and the film 3, and after cooling, the heat pipe is cooled. During the assembly process of 5 gorges to heat dissipation 2, when the solder of the scale flows through the joint of the solder hole 6 and the heat, the material is deposited at the joint portion to form a heat-dissipating fin 3 _^ small tin beads 'Qian Jian's fee' increases the heat device [Invention] In view of this, a heat sink will be described below with a specific embodiment to describe a heat sink with a lower processing cost. 'Including re-learning blue> j and the heat 1311457 worn by the heat sink fins, the gap between the loose and the fresh is by the joint job, the heat dissipation is provided on the edge of the opening An edge portion and a second edge portion of the first edge portion have a shape corresponding to the shape of the heat pipe, the second edge portion encloses a space for accommodating the bonding agent, and the second edge portion is provided with two and the first portion a guiding surface connected to the edge portion, the distance between the guiding surfaces is gradually increased from a position away from the first edge portion to a position near the first edge portion, so that the bonding agent in the space can be melted along the guiding surface Flow to the first edge portion 'bonds the heat pipe to the heat sink fins.
、么，散熱器的組裝過程中，該接合劑熔融後沿該導引面流向該第一 邊，，’由於該導引面傾斜設置，該融化後的焊料較易沿該導引面流 向3玄第一邊緣部’可避免該焊料附著在該第一邊緣部與第二邊緣部的 接合部位而形成小錫珠所造成的浪費。、 【實施方式】 ' 下面參照附圖結合實施例對本發明作進一步說明。 —«月參閱第一至第四圖，本發明所述之散熱器10包括一基板12、設 於，基板12上的複數散熱鰭片14及穿設於該等散熱鰭片14内的複數 熱官16。该熱官16可與一發熱元件18相接觸，將該發埶元件π產 之熱量傳遞至該等散熱鰭片14。 ’ ' 請一並參閱第五圖，該等散熱鰭片14相互平行，各該散熱鰭片Μ 包括一矩形本體141，該本體141之上、下兩端分別向同一方向彎折形 土有垂直於該本體141的翼片142，各散熱鰭片14的翼片142 ^ ^ 前一散熱鰭片14的本體141相抵靠，使各相鄰的二散熱鰭片^ ^ 在-定的間距，從而在該等散熱籍片14的本體⑷間形成 = 的氣流通道。該等散熱鰭片14在本體H1上對應該等埶營6 f開孔143，該等熱管16穿設於對應之開孔143内，藉由^‘ 專散熱鰭片14相接合，該接合劑可為錫膏或錫條等銲料。哕 ^圍向遠離該等翼片M2的-側延伸形成-可與熱管16g觸“觸: 各開孔143的壁部包括第一邊緣部145及與該第—邊緣立 連接的第二邊緣部146。該第一邊緣部145與熱管π的邱、、八°卩相 接合劑相接合，本實施例中之熱管16為圓形，其對應的第二二，f藉由 為一圓弧。該第二邊緣部146呈倒“V”形，在哕笛_ j邊緣部145 唸弟—邊緣部1姑的 1311457 壁部形成二傾斜的導引面147’該二導引面147與該第一邊緣部145 光滑連接’且該二導引面147間的距離由遠離第一邊緣部145的位置 向第一邊緣部145逐漸增加，較易使接合劑沿該導引面147流向第一 邊緣部145。During the assembly process of the heat sink, the bonding agent flows along the guiding surface to the first side after melting, and 'the molten solder is easier to flow along the guiding surface because the guiding surface is inclined. The first first edge portion can prevent the solder from adhering to the joint portion of the first edge portion and the second edge portion to form waste caused by the small tin beads. [Embodiment] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings. Referring to the first to fourth figures, the heat sink 10 of the present invention includes a substrate 12, a plurality of heat dissipation fins 14 disposed on the substrate 12, and a plurality of heats disposed in the heat dissipation fins 14 Officer 16. The heat official 16 is in contact with a heat generating component 18, and the heat generated by the hairpin component π is transferred to the heat sink fins 14. Referring to the fifth figure, the heat dissipation fins 14 are parallel to each other, and each of the heat dissipation fins 包括 includes a rectangular body 141. The upper and lower ends of the body 141 are bent in the same direction and have vertical In the fin 142 of the body 141, the fins 142 of each of the heat dissipating fins 14 are abutted against the body 141 of the fins 14 so that the adjacent fins are at a predetermined distance, thereby An air flow passage of = is formed between the bodies (4) of the heat radiating sheets 14. The heat dissipating fins 14 are correspondingly arranged on the main body H1, and the heat pipes 16 are disposed in the corresponding openings 143. The bonding fins are joined by the heat dissipation fins 14 It can be solder such as solder paste or tin bar. The 哕^ is formed to extend away from the side of the fins M2 - can be in contact with the heat pipe 16g. The wall portion of each of the openings 143 includes a first edge portion 145 and a second edge portion connected to the first edge. 146. The first edge portion 145 is joined to the heat pipe π, and the eight° 卩 phase bonding agent. The heat pipe 16 in the embodiment is circular, and the corresponding second two, f is an arc. The second edge portion 146 has an inverted "V" shape, and at the edge portion 145 of the whistle _j, the 1311457 wall portion of the edge portion 1 forms a second inclined guiding surface 147'. An edge portion 145 is smoothly connected and the distance between the two guiding surfaces 147 is gradually increased from the position away from the first edge portion 145 toward the first edge portion 145, and the bonding agent is more likely to flow along the guiding surface 147 to the first edge. Part 145.
該散熱器10組裝時，將各散熱鰭片14沿一定方向堆疊在一起， 然後將熱管16穿設於該等散熱鰭片14之開孔143内，與第一邊緣部 145相接觸，並將接合劑置於該等散熱鰭片14之第二邊緣部ι46所圍 成的空間内’得到預組裝的散熱器10’接下來對該預組裝後散熱器1〇 加熱’使接合劑融化並沿該二導引面147流向該第一邊緣部145，填充 於散熱鰭片14與熱管16間之空隙内，經爭卻後，該接合劑將該等熱-管16接合至散熱鰭片14的第一邊緣部145上，使散熱鰭片14與熱管 16間存在良好的熱接觸。 該散熱器10的組裝過程中，當對該預組裝後的散熱器1〇加熱 時’該第二邊緣部146所圍之空間内融熔的接合劑沿該導引面147流 向該第一邊緣部145,並在表面張力的作用下均勻填充於散熱鰭片14 與熱管16間之空隙内。由於該導引面147傾斜設置，使該融化後的接 合劑較易沿該導引面147流向該第一邊緣部145，填充於散熱鰭片14 與熱管16之間，將熱管16固定至散熱鰭片μ内，避免該接合劑附著 在第一邊緣部145與第二邊緣部140的接合部位而形成小錫珠所造成 的浪費。該接觸部144的設置，可使部分接合劑舖設於該接觸部144 亡’使接合劑不易因過多而洩漏，提高接合劑的利用率；該接觸部144 ，可增加熱管16與第一邊緣部145的接觸面積，從而增加熱管16與 政熱鰭片14間的傳熱面積，提高散熱器1〇的散熱效率。 如第五圖所示’本實施例中，第二邊緣部146之二導引面147藉 由位於開孔143頂端之圓弧面連接為一體，可以理解地，該二導引 面147亦可藉由一平面連接，或直接相交於開孔Μ〗頂端。 一，^明中’第二邊緣部146位於第一邊緣部145上部，同理，第 厂邊緣部146亦可位於第一邊緣部145下部或兩側，當第二邊緣部146 第—邊緣部145下部或兩側時，在加熱過程中需將該散熱器稍作 疋，使熔融之接合劑沿該導引面147流向該第一邊緣部145。 。亥政熱器10中，散熱鰭片14之接觸部144與翼片142可沿一相 方向向相鄰散熱鰭片14之主體14丨延伸。各/散熱鰭片14上設置 8 1311457 辽異片142 翼片142之征蚀同的方向向主體丨41之兩側垂直延伸形成，該等 純角。該散埶二:可;與散熱韓片14之主體141間形成一銳角或一 ^ ® Η； Μ ,46 低接合劑由散熱轉片益上形成一隔離帶，該隔離帶可降 率。 之㈣漏的可能性，進—步提高接合劑的利用 【圖式簡單說明】 第一圖為一習知散熱器的立體圖； 第二圖為該散熱器之立體分解圖； 苐二圖為g亥散熱器之立體組裝圖. 第四圖為第三圖沿IV-IV線之剖示圖；、 第五圖為該散熱器中單個散熱讀 【主要元件符號說明】 W的立體圖。 10 基板 14 本體 142 開孔 144 卓一邊緣部 146 導引面 16 發熱元件 12 141 143 145 147 18 散熱器 散熱鰭片 翼片 接觸部 第二邊緣部 敎營 ί、、、 & 9When the heat sink 10 is assembled, the heat dissipation fins 14 are stacked together in a certain direction, and then the heat pipe 16 is inserted into the opening 143 of the heat dissipation fins 14 to be in contact with the first edge portion 145, and The bonding agent is placed in a space surrounded by the second edge portion ι46 of the heat dissipation fins 14 'to obtain a pre-assembled heat sink 10' and then to heat the pre-assembled heat sink 1 'to melt the bonding agent and along The two guiding surfaces 147 flow to the first edge portion 145 and are filled in the gap between the heat dissipation fins 14 and the heat pipe 16 . After the contention, the bonding agent bonds the heat pipes 16 to the heat dissipation fins 14 . On the first edge portion 145, there is good thermal contact between the heat dissipation fins 14 and the heat pipe 16. During assembly of the heat sink 10, when the pre-assembled heat sink 1 is heated, 'the bonding agent in the space surrounded by the second edge portion 146 flows along the guiding surface 147 toward the first edge. The portion 145 is uniformly filled in the gap between the heat dissipation fin 14 and the heat pipe 16 by the surface tension. Since the guiding surface 147 is disposed obliquely, the melted bonding agent flows along the guiding surface 147 to the first edge portion 145, and is filled between the heat dissipation fin 14 and the heat pipe 16 to fix the heat pipe 16 to the heat dissipation. In the fins μ, it is avoided that the bonding agent adheres to the joint portion of the first edge portion 145 and the second edge portion 140 to form waste of small tin beads. The contact portion 144 is disposed such that a portion of the bonding agent is laid on the contact portion 144, so that the bonding agent is not easily leaked due to excessive, and the utilization ratio of the bonding agent is improved. The contact portion 144 can increase the heat pipe 16 and the first edge portion. The contact area of 145 increases the heat transfer area between the heat pipe 16 and the thermal fin 14 and improves the heat dissipation efficiency of the heat sink 1 . As shown in FIG. 5, in the present embodiment, the two guiding surfaces 147 of the second edge portion 146 are integrally connected by a circular arc surface located at the top end of the opening 143. It can be understood that the two guiding surfaces 147 can also be Connected by a plane, or directly intersected at the top of the hole. 1. The second edge portion 146 is located at the upper portion of the first edge portion 145. Similarly, the first factory edge portion 146 may also be located at the lower or both sides of the first edge portion 145, when the second edge portion 146 is the first edge portion. When the lower portion or both sides of the 145 are used, the heat sink is slightly twisted during the heating process, so that the molten bonding agent flows along the guiding surface 147 toward the first edge portion 145. . In the heat exchanger 10, the contact portion 144 and the fin 142 of the heat dissipation fin 14 can extend toward the main body 14 of the adjacent heat dissipation fin 14 in a phase direction. Each of the heat dissipating fins 14 is provided with 8 1311457 dissimilar pieces 142. The eccentricity of the fins 142 is perpendicularly formed on both sides of the main body 丨 41, and the pure angles are formed. The divergence two: can; form an acute angle or a ^ ® 与 with the main body 141 of the heat dissipating Korean film 14; Μ, 46 low bonding agent is formed by a heat dissipating fin to form an isolation band, and the isolation band can be lowered. (4) The possibility of leakage, further improve the utilization of the bonding agent [Simplified description of the drawing] The first figure is a perspective view of a conventional heat sink; the second figure is an exploded view of the heat sink; The three-dimensional assembly diagram of the sea radiator. The fourth figure is a cross-sectional view of the third figure along the line IV-IV; and the fifth figure is a perspective view of the single heat-dissipation reading of the main component (the main component symbol description) W. 10 Substrate 14 Body 142 Opening 144 Excellent edge 146 Guide surface 16 Heating element 12 141 143 145 147 18 Heat sink Heat sink fins Contact part Second edge part 敎, 、, & 9