1237545 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種快速導熱之散熱裝置，特別是内部填 充有一冷煤填充物或由甲醇、乙醇及純水經由一適當比例混 合而成之填充物置入一鈍化處理後之散熱裝置。 【先前技術】 散熱器係利用輻射、對流和傳導作用，而能排放熱量至 周圍的裝置。 習用潛熱式散熱裝置係如我國公告第562392號專利案 (下稱引證案），其主要構成特徵為：一吸熱部，該吸熱部係 由同導熱之金屬導體構成一封閉容器，於内部填充有高比熱 之液態流體，並於該吸熱部内設有一金屬平板，該金屬平板 係沈浸於該液態流體之中並具有一延伸至吸熱部外之接觸 墊，該接觸墊與該發熱源接觸；一蒸氣流道，與該吸熱部連 通，該吸熱部内之液態流體過熱形成之蒸氣導引至該蒸氣流 道，而所形成之蒸氣於該蒸氣流道凝結成液態後並由該蒸氣 流道流回該吸熱部·，一散熱部，該散熱部係由高導熱之金屬 導體構成一鰭片結構，其包覆於該蒸氣流道，藉以傳導該蒸 氣μ道之熱虽至外界，而其構成上之主要缺點為：該引證案 係採用液體循環冷卻散熱的方式達到散熱效果，然冷卻水於 循環使用一段時間後，其散熱效果將逐漸降低。 1237545 、習用散熱装置組合，係裝設於電子裝置殼體内部，其構 复寺徵為.一散熱器，具有一基板、一圓管及一散熱鰭片體， ’、中该圓管係’於基板頂面，其管壁開設有複數通氣孔， 該散熱.11片體與圓管外壁貼合，其散_片對應通氣孔設有 貫通至外表面之開σ;及―導風管，該導風管—端係與散熱 态之圓官相連；及—風扇，係可與該導風管之另一端相連， 并固定於電腦機殼上；其構成上之主要缺點為：該裝置使用 風扇將外界冷空氣吸人，吹送至導風管内達到—散發熱氣之 功效，並無該熱能從溫度高的部分傳送到溫度低的部分後再 行散發熱氣。 。習知之散熱裝置係如我國公告551532、56〇841或551543 號專利案（下稱引證案），大多為散熱裝置結構改良等專利 本案發明人鑑於上述習用之散熱褒置所衍生的各項缺 點，乃亟思加以改良創新，並經多年苦心孤錯潛心研究後， 終於成功研發完成本件快速導熱之散熱裝置。 【發明目的】 :發明之目的即在於提供一種可快速將熱能從溫度高的 部为傳运到溫度低的部分之一快速導熱之散熱裝置。 本舍明之次一目的係在於提供一 由於㈣”使料填充物包括： 置 種快速導熱之散熱裝 甲醇、乙醇，皆為受 1237545 件雙熱時可增強流 體填充物滿動 高效率的導熱 熱易揮發的物質，在導熱元 以提高傳熱分係數’以達容易加速對流傳熱 效果。 本發明之另一目的係在於括 、k t、一種可依使用者之需要將 散熱裝置固定於中央處理器或曰 次t熱日日片上的快速導熱之散 熱裝置。 發明内容 可達成上述發明目的之快诘邋 J <既逯導熱之散熱裝置，係由一頂 盍、一散熱元件及一導敎元# ^ n Λ、 …、几件所構成一封閉容器，包括有： 一頂蓋，其中穿透設置有第一填充管； 該散熱元件中間設有 間，並與該孔洞連接； 一散熱元件，係為一散熱鰭片體， 一孔洞，使頂蓋固設於散熱元件之左空 -導熱元件’該導熱元件係由—主體、—^位部及一第 二填充管所組成’其中該定位部係固設於散熱元件之右空 間，並與該孔洞連通，而該主體係貼合於一中央處理器正上 方之表面，並延伸與中央處理器兩側邊貼合之一導電、導熱 良好之金屬材質製成之導熱體； 前述第一、第二填充管採用高壓或利用虹吸原理容置有 液體填充物，該填充物係冷媒或由甲醇、乙醇及純水經由一 適當比例混合而成，該液體填充物的成分中，曱醇重量百分 比約為30%、乙醇重量百分比約為40%、而純水約為整體填 1237545 充物之重量百分比約為30%者，且填充管於填充物置入後再 施以氬焊將密封；而該頂蓋、散熱元件、導熱元件的金屬部 份經過一鈍化處理，使金屬產生電化學行為而引起散熱裝置 表面形成一具有貴金屬某些特徵的鈍化膜。 【實施方式】 請參閱圖一〜三，本發明所提供之快速導熱之散熱裝置， 主要包括有：一頂蓋（1)，其中穿透設置有第一填充管（11); 一散熱元件（2)，係為一散熱鰭片體，該散熱元件（2)中間設 有一孔洞（21)，使頂蓋（1)固設於散熱元件（2)之左空間，並 與该孔洞（21)連接；一導熱元件（3)，該導熱元件（3)係由一 主體（31)、一定位部（32)及一第二填充管（33)所組成，其中 該定位部（32)係固設於散熱元件（2)之右空間，並與該孔洞 (21)連通，而該主體（31)係貼合於一中央處理器（5)正上方 之表面，並延伸與中央處理器（5)兩側邊貼合之一導電、導 熱良好之金屬材質製成之導熱體； 前述第一填充管（11)、第二填充管（33)採用高壓或利用 虹吸原理容置有液體填充物（4),該液體填充物（4)係冷媒或 由甲醇、乙醇及純水經由一適當比例混合而成，該填充物（4) 的成分中，甲醇重量百分比約為30%、乙醇重量百分比約為 _、而純水約為整體填充物⑷之重量百分比約4嶋， 且填充官於填充物（4)置入後再施以氬焊將密封；而該頂蓋 l237545 (1)、散熱元件（2)、導熱元件（3)的金屬部份經過—鈍化處 ^ ’使金屬產生電化學行為而引起散熱裝置表面形成―具^ 貝金屬某些特徵的鈍化膜。 该散熱裝置係採用一冷煤填充物（4)或由甲醇、乙醇及 L由4當比例混合而成之填充物⑷，採用高壓或利 用广吸原理將填充物⑷置入一鈍化處理後之散熱裝置。本 2月之政熱裝置係採用—金屬鈍化處理將散熱裝置的表面 她以金屬電化學行為使散熱裝置具有貴金屬的某些特徵（低 的腐姑速率、正的電極電勢）的過程’當散熱裝置表面獲得 =破壞的鈍化膜後，該純化膜具有侵餘性陰離子難以擴散的 結構、耐機械破壞的延性、低的溶解度、低的電子導電性及 良好的再鈍化能力者。 請參閱圖三，當散熱裝置鈍化處理後再將填充物㈠乂經 由第-第-填充管⑴)、第二填充管(33)採用高壓或利用虹 吸原理置入散熱裝置之孔洞(21)中後再施以氣焊或電㈣ 將散熱裝置密封’使流體填充物⑷在散熱裝置之封閉容器 :部流動’當流體填充物⑷在散熱裝置内部邊界層不互相 混雜、且跡、線有條不紊的流動時，另可將散熱元件⑵之孔 洞（21)設置-傾斜面，更可使垂直於流動方向上的熱量加速 傳遞’錢熱裝置雖然只能透過流體填充物⑷内部的流動 來V…仁"IL體填充物（4)的流動卻造成了沿流動方向的温 Ϊ237545 度變化，使壁面處的溫度梯度增加，因而促進了傳熱。 或當流體填充物（4)在散熱裝置孔洞（21)内部邊界層是 處於隨機的旋渦運動時，垂直於流動方向上的熱量傳遞除了 :傳導外’其主要會依靠不同溫度的填充物⑷微團之間劇 烈混合而產生一對流傳熱之快速傳熱效果，可使貼附於中央 處理益（5)之導熱元件T快速將熱能從溫度冑白勺巾央處理器 (5)傳送到溫度低的散熱元件（2)，並於散熱元件（2)上方固 定-風扇(圖未表示)，該風扇(圖未表示)固定於該散熱元件 (2)中空部位之上方後，使該中央處理器（5)運作時所產生之 高溫，可經由該導熱元件（3)傳導至該散熱元件（2)上，藉由 風扇（圖未表示）將氣體導人，可直接通過散熱元件⑵:散 :韓片將熱源導散出’令該中央處理器⑸之溫度可快速傳 冷至散熱元件（2) ’以達中央處理器（5)可正常維持一工作溫 度之散熱裝置。 【特點及功效】1237545 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a heat-dissipating device that conducts heat quickly, in particular, it is filled with a cold coal filler or a mixture of methanol, ethanol, and pure water mixed in an appropriate ratio. The object is placed in a heat sink after passivation. [Previous Technology] A radiator is a device that can radiate heat to the surroundings using radiation, convection, and conduction. The conventional latent heat-dissipating device is, for example, China's Announcement Patent No. 562392 (hereinafter referred to as the “Citation Case”), and its main structural features are: a heat-absorbing portion, which is a closed container composed of a metal conductor that conducts heat, and is filled with A high specific heat liquid fluid, and a metal flat plate is arranged in the heat absorption part, the metal flat plate is immersed in the liquid fluid and has a contact pad extending outside the heat absorption part, the contact pad is in contact with the heat source; a vapor The flow channel communicates with the heat absorption part, and the vapor formed by the overheating of the liquid fluid in the heat absorption part is guided to the vapor flow path, and the formed vapor is condensed into a liquid in the vapor flow path and flows back from the vapor flow path to the Heat absorbing part. A heat radiating part. The heat radiating part is a fin structure composed of a metal conductor with high thermal conductivity, which is coated on the vapor flow path, so that although the heat of the vapor μ path is conducted to the outside, its structure is The main disadvantage is that the cited case uses liquid circulation cooling to achieve heat dissipation. However, after cooling water is used for a period of time, its heat dissipation effect will gradually decrease. 1237545, a conventional cooling device combination, is installed inside the electronic device housing. Its structure is a radiator. It has a base plate, a circular tube, and a cooling fin body. The top surface of the substrate is provided with a plurality of ventilation holes on the pipe wall for heat dissipation. The 11 piece body is attached to the outer wall of the circular tube, and the scattered piece corresponding to the ventilation hole is provided with an opening σ that penetrates to the outer surface; and The air duct—the end is connected to the radiator in the cooling state; and—the fan can be connected to the other end of the air duct and fixed to the computer casing; the main disadvantage of its structure is that the device uses a fan The outside cold air is sucked in and blown into the air duct to achieve the effect of dissipating heat. There is no heat energy transmitted from the high temperature part to the low temperature part and then the heat is dissipated. . The conventional heat dissipation device is the patent case No. 551532, 56 0841 or 551543 (hereinafter referred to as the cited case) of China, most of which are patents such as the structure improvement of the heat dissipation device. The inventor of the present case considered various disadvantages derived from the conventional heat dissipation device. After eager to improve and innovate, and after years of painstaking and meticulous research, finally successfully developed this piece of rapid heat conduction heat dissipation device. [Objective of the Invention]: The purpose of the invention is to provide a heat-dissipating device capable of quickly transferring heat energy from a high-temperature part to a low-temperature part. The second purpose of Ben Sheming is to provide a "filler" filling material that includes: a type of fast heat-conducting heat-dissipating methanol and ethanol, both of which can enhance the efficiency of the fluid-filling material when it is heated by 1237545 pieces of heat. Volatile substances are used to increase the heat transfer coefficient in the heat conduction element to achieve the effect of accelerating convective heat transfer easily. Another object of the present invention is to include kt, a heat sink that can be fixed to the central processing according to the needs of users. Device or a rapid heat-conducting heat-dissipating device on a hot film on the next day. SUMMARY OF THE INVENTION The heat-conducting heat-dissipating device that achieves the above-mentioned object of the invention is composed of a top frame, a heat-dissipating element, and a guide.元 # ^ n Λ,…, a closed container composed of several pieces, including: a top cover in which a first filling tube is penetratingly arranged; a middle part of the heat dissipation element is connected to the hole; a heat dissipation element It is a heat dissipation fin body, a hole, so that the top cover is fixed to the left space of the heat dissipation element-the heat conduction element. The heat conduction element is composed of-the main body, the ^ position portion and a second filling tube. The positioning part is fixedly located in the right space of the heat dissipation element and communicates with the hole. The main system is attached to a surface directly above the central processing unit and extends to one of the two sides of the central processing unit to conduct electricity. A thermal conductor made of a metal material with good thermal conductivity; the aforementioned first and second filling tubes contain a high-pressure or siphon principle to contain a liquid filler, which is a refrigerant or methanol, ethanol, and pure water through an appropriate ratio The liquid filler is composed of about 30% by weight of methanol, about 40% by weight of ethanol, and about 1237545 by weight of pure water, and the filler is about 30% by weight. After the tube is placed in the filler, argon welding is applied to seal it; and the metal parts of the top cover, the heat-dissipating element and the heat-conducting element are subjected to a passivation process, which causes the metal to have an electrochemical behavior and cause the surface of the heat-dissipating device to form a precious metal. Characteristics of the passivation film. [Embodiments] Please refer to Figures 1-3. The heat-dissipating device for rapid heat conduction provided by the present invention mainly includes: a top cover (1), which penetrates the device. There is a first filling tube (11); a heat dissipation element (2), which is a heat dissipation fin body, a hole (21) is provided in the middle of the heat dissipation element (2), so that the top cover (1) is fixed to the heat dissipation element ( 2) the left space and is connected to the hole (21); a heat conducting element (3), the heat conducting element (3) is composed of a main body (31), a positioning portion (32) and a second filling pipe (33) ), Wherein the positioning portion (32) is fixedly disposed in the right space of the heat dissipation element (2) and communicates with the hole (21), and the main body (31) is attached to a central processing unit (5) The surface directly above, and extending a heat conductive body made of a metal material with good electrical conductivity and thermal conductivity that is attached to both sides of the central processing unit (5); the first filling tube (11) and the second filling tube (33) A liquid filler (4) is contained in the high pressure or the siphon principle. The liquid filler (4) is a refrigerant or is made by mixing methanol, ethanol and pure water through an appropriate ratio. The components of the filler (4) are , The weight percentage of methanol is about 30%, the weight percentage of ethanol is about _, and the pure water is about 4% by weight of the overall filling, The filling officer applies argon welding to seal after the filling material (4) is placed; and the metal parts of the top cover 1237545 (1), the heat dissipation element (2), and the heat conducting element (3) pass through the passivation place ^ 'make The electrochemical behavior of the metal causes the surface of the heat sink to form a passivation film with certain characteristics of the metal. The heat-dissipating device adopts a cold coal filling material (4) or a filling material consisting of methanol, ethanol, and L in a ratio of 4 equivalents. The filling material is placed into a passivation treatment using high pressure or the principle of wide absorption. Cooling device. This February ’s political thermal installation is a process in which metal passivation treatment is used to make the surface of the heat sink with metal electrochemical behavior. The heat sink has certain characteristics of precious metals (low decay rate, positive electrode potential). After the device surface obtains a damaged passivation film, the purified film has a structure in which it is difficult for diffuse anions to diffuse, mechanical ductility, low solubility, low electronic conductivity, and good repassivation ability. Please refer to FIG. 3, after the heat dissipation device is passivated, the filling material ㈠ 乂 is inserted into the hole (21) of the heat dissipation device by high pressure or using the siphon principle through the first-third-filling tube ⑴) and the second filling tube (33). After that, gas welding or electricity is applied. The heat sink is sealed to 'make the fluid filling ⑷ in the closed container of the heat sink: partial flow'. When the fluid filling ⑷ is not mixed with each other in the inner boundary layer of the heat sink, and the traces and lines flow in an orderly manner At the same time, the hole (21) of the heat dissipation element-can also be set-an inclined surface, which can accelerate the transfer of heat perpendicular to the flow direction. Although the money heating device can only pass through the internal flow of the fluid filling 来 to ... The flow of the IL body filler (4) caused a change in temperature Ϊ 237,545 degrees along the flow direction, which increased the temperature gradient at the wall surface, thereby promoting heat transfer. Or when the fluid filler (4) is in a random vortex motion in the inner boundary layer of the heat sink hole (21), the heat transfer perpendicular to the flow direction is in addition to: conduction, which mainly depends on the filler at different temperatures. Vigorous mixing between the clusters results in a rapid heat transfer effect of a pair of flow heat transfer, which allows the thermally conductive element T attached to the central processing unit (5) to quickly transfer heat energy from the temperature to the central processor (5) to the temperature Low heat dissipation element (2), and fixed above the heat dissipation element (2)-a fan (not shown), the fan (not shown) is fixed above the hollow part of the heat dissipation element (2), and the central processing is performed The high temperature generated during the operation of the heater (5) can be conducted to the heat dissipation element (2) through the heat conducting element (3), and the gas is guided by the fan (not shown). : The Korean film will dissipate the heat source, so that the temperature of the CPU can be quickly transferred to the heat sink (2), so as to reach the CPU (5), which is a heat sink that can normally maintain an operating temperature. [Features and effects]
本發明所提供之快速導熱之散熱裝置，#流體填充物置 入由頂蓋、散熱S件及導熱元件所構成封閉容器後，該填充 物可提阿傳熱分係、數，以強化對流傳熱、提高熱流量，進而 將中央處理器運作時所產生之高溫，可經由該導熱元件快速 傳導熱能至散熱元件上，以達快速導熱之功效。 A 上列洋細％明係針對本發明之一可行實施例之具體說 10 1237545 之專利範圍，凡未脫離 更，均應包含於本案之 明，惟該實施例並非用以限制本發明 本發明技藝精神所為之等效實施或變 專利範圍中。 综上所述’本案不但在技術思想上確屬創新，並能較習 用物品增進上述多項功效，應已充分符合新穎性及進步性之 法定發明專利要件’爰依法提出申請，料貴局核准本件 發明專利申請案，以勵發明，至感德便。 【圖式簡單說明】 明參閱以下有關本發明一較佳實施例之詳細說明及其附 圖將可進步瞭解本發明之技術内容及其目的功效；有關 該實施例之附圖為： 圖一為本發明快速導熱之散熱裝置之立體分解視圖； 圖一為該快速導熱之散熱裝置之第一示意圖；以及 圖三為該快速導熱之散熱裝置之第二示意圖。 【主要部分代表符號】 1頂蓋 11苐一填充管 2散熱元件 21孔洞 3導熱元件 11 1237545 31主體 3 2定位部 33第二填充管 4填充物 5中央處理器The fast heat-conducting heat-dissipating device provided by the present invention, after the #fluid filling material is placed in a closed container composed of a top cover, a heat-dissipating S piece and a heat-conducting element, the filling material can improve the heat transfer system and number to enhance convective heat transfer. To increase the heat flow, the high temperature generated during the operation of the central processing unit can be used to quickly conduct thermal energy to the heat dissipation element through the heat conduction element to achieve the effect of rapid heat conduction. The percentage of foreign material listed above is specifically for the scope of the patent 10 1237545, which is a feasible embodiment of the present invention. Anything that does not depart from it should be included in the case, but this embodiment is not intended to limit the present invention. The equivalent of the spirit of craftsmanship or the scope of the patent. In summary, 'This case is not only technically innovative, but also enhances the above-mentioned multiple effects over conventional items. It should have fully met the requirements for novel and progressive statutory invention patents.' The application was submitted in accordance with the law, and your office is expected to approve this. Application for invention patents, to encourage invention, to the utmost. [Brief description of the drawings] By referring to the following detailed description of a preferred embodiment of the present invention and the accompanying drawings, the technical content of the present invention and its purpose and effect can be improved; the drawings related to this embodiment are as follows: A three-dimensional exploded view of the heat-conducting heat-dissipating device of the present invention; FIG. 1 is a first schematic diagram of the heat-conducting heat-dissipating device; and FIG. [Representative symbols of main parts] 1 Top cover 11 Filling tube 2 Heat dissipation element 21 Hole 3 Thermally conductive element 11 1237545 31 Body 3 2 Positioning part 33 Second filling tube 4 Filling 5 CPU
1212