200528677 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種集熱器結構與製造方法，尤指一種 適用於電腦裝置之集熱器結構與製造方法。 【先前技術】 於-般電腦裝置中，其内部之主要發熱電子元件 ^中央處理單元（CPU)，而為有效將其所產生之熱量散 出，則必須組設有一散熱裝置。 10 15 請參閱圖1係習知水冷式散熱裝置之立體圖，1主要 包括有一集熱單元91、一水箱的 ，、；“ .^ 承相92、以及一散熱單元93， 其中之集熱單元91係用以收隹μ、+、士丄上 - 用乂收木上述中央處理單元（CPU)等 餐熱電子元件所產生之埶吾，* - …亚、、里由熱管94將熱量帶至散 …、早7L 93加以散出，而水箱9? 晉㈣田 ㈣ “目92則疋用以儲存整體散熱裝 置所使用之液體介質。 請參閱圖2係習知集熱單元之立 集熱單元91係由一集埶片91 〇 ，、中』不 Ω10 1 塾片912、以及一上篆 913所組成，且於集熱片9 ;^ U °又有一液體流道910，麸 而，習知之集熱單元91之灾 ^ …、 内之㈣車父多，且液體流道910 門之液體係糟由墊片912 — 漏，但塾片912使用一段時間之德❹防止液體浅 產生彳Ρ g μ 、 仍會因為機械疲勞而 屋生知壞，亚因此造成集熱單元91 並非十分理想。 i液體洩漏之問逑， 20 200528677 【發明内容】 ”本IT:主要目的係在提供一種集熱器結構與製造 5製造成本。 並可減少零件數’降低 為達成上述目的，本發明之 下列步驟·· …裔方法主要包括 步驟A ··提供一液冷管於一 冷管係迂迴彎折於同一共平 …: 、面上，且液 H)集熱片之上表面；〃千面上’而此共平面則係平貼於 步驟B:提供焊料於集熱片上表面與液冷管上； 步驟C ··加熱液冷管、集埶 化後沪動埴龚认隹如 一…片、一知料’並使焊料熔 化後机動填基於集熱片上协 以及 一欣令&間之毛細隙縫内； 15 步驟D :冷卻液冷管與 集熱片與液冷管。 、…、’吏焊料凝固而結合 :外’本發明另_特色之集熱器結構則主要— 本…片、以及—液冷管。其中 而液冷管係桿接組設於集熱片匕括有-上表面， 彎折於同一共平面上 表面，且液冷管係迂迴 面，同時於液冷管之二端分別形成有__出口 ^及片_二表 〃由上述可知，本發明之集熱器製造 , 構係僅單純使用一隼教 …、 ° /或疋集熱器結 ^集熱片與一液冷管即可宗忐上r 效減少零件數，相 ⑦成’如此可有 降低“成本。此外，藉由液冷管 20 200528677 之設計，可使散熱用之液體流動於液冷管 傳統般必須另外設置—密封用之墊片，相對目因此無須如 防止政熱用之液體發生浅漏問題之目的。 α達成有效 【實施方式】 ，特 為能讓#審查委員能更瞭解本發明之技術内容 舉一較佳具體實施例說明如下。 請同時參閱圖3係本發明之流程圖、圖4係本發 體分解圖、及圖5係本發明之立體組合圖，其中圖推圖$ 1〇顯不有-本發明之集熱器結構，而圖3則顯示本發明集執哭 製造方法之流程，詳細說明如下。 …时 首先，係提供一液冷管i於一集熱片2之上表面幻上 (SA) ，且液冷管丨係迂迴彎折於同一共平面丨丨上，而此丑平 面11則是平貼於集熱片2之上表面21。前述之液冷管丨^事 15先以壓板或是其他等效方式使其呈扁平狀，如此可增加液 冷管1與集熱片2上表面21間之接觸面積。 之後，提供一種熔點低於液冷管丨與集熱片2之熔點之 焊料3，於本實施例中，係使用燐銅焊棒（Weld⑺d P/Cu)，且將其長度依照液冷管丨迂迴彎折之長度而做適當 20之男裁’然後將其置放於集熱片2上表面21與液冷管1上 (SB) 〇 當焊料3置放完成之後，將液冷管1、集熱片2、與焊 料3送入一烘爐（圖未示）内進行加熱作業（sc)，於本實施 例中’係使用一種名為光輝爐（Furnace brazing)之烘爐，其 200528677 可加熱液冷管1、集熱片2、與焊料3，此時，由於焊料3之 熔點係低於液冷管1與集熱片2之熔點，因此，焊料3可先熔 化後並以毛細力流動填塞於集熱片2上表面21與液冷管工間 之毛細隙縫内。 最後，冷卻液冷管丨與集熱片2，促使焊料3凝固而結 合集熱片2與液冷管1(SD)，如此即可完成一集熱器結構， 且其可置設於一中央處理單元4 (如圖4所示）之發熱電子 元件上使用。 10 15 請再同時參閱圖4、及圖5,藉由上述之製造方法所得 出之集熱器結構係包括有一集熱片2、以及一液冷管1。其 中，集熱片2並包括有一上表面21，且液冷管丨係略呈扁平 狀並以燐銅焊棒之焊料3焊接組設於集熱片2之上表面Η， 且液冷管!係迂迴彎折於同一共平面11±，而此共平面u 則係平貼於集熱片2之上表面21，@時於液冷管k二端則 分別形成有一出口 12、及一入口 13。 、、；本貫^例中，由於銅具有較佳之熱傳導特性，故上 述之集熱片2與液冷管1係分別使用銅做為其材質，即集熱 人為銅片，❿液冷官i係為一銅管，I然亦可使用銘 或其他金屬材質。 2盘—由上述〜可知，集熱裔於製造時’係僅需使用-集熱片 小*、7 g 1即可兀成—集熱器之結構，故如此可確實減 計，'件數：相對可降低製造成本。此外，藉由液冷管1之設 …可使散熱用之液體流動於液冷管丨内，因此無須如傳統 20 200528677 般必須另外設置-密封用之墊片’异目對即可達成有效防止 散熱用之液體發生洩漏問題之目的。 上述實施例僅係為了方便說明而舉例而已，本發明所 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 5 於上述實施例。 【圖式簡單說明】 圖1係習知水冷式散熱裝置之立體圖。 圖2係習知集熱單元之立體分解圖。200528677 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a heat collector structure and manufacturing method, and more particularly, to a heat collector structure and manufacturing method suitable for a computer device. [Previous technology] In a general computer device, the main heating electronic components inside it ^ a central processing unit (CPU), and in order to effectively dissipate the heat generated by it, a heat sink must be provided. 10 15 Please refer to FIG. 1 is a perspective view of a conventional water-cooled heat dissipation device. 1 mainly includes a heat collecting unit 91, a water tank, and the like; “. ^ Bearing phase 92, and a heat dissipation unit 93, among which the heat collecting unit 91 It is used to collect the μ, +, and 丄--use the 乂 to collect the above-mentioned central processing unit (CPU) and other meal thermal electronic components produced by Ligularia, *-…, the heat pipe 94 to bring heat to the …, As early as 7L 93 to disperse, and the water tank 9? Jin ㈣ Tian ㈣ "Head 92 is used to store the liquid medium used by the overall heat dissipation device. Please refer to FIG. 2 of the conventional heat collecting unit. The stand-alone heat collecting unit 91 is composed of a set of cymbals 91 〇, medium ′ not Ω10 1 cymbals 912, and a top cymbal 913, and is in the heat collector 9; ^ There is a liquid channel 910 in U °, and the disaster of the conventional heat collecting unit 91 is ^ ..., there are many car parents inside, and the liquid system of the liquid channel 910 door is leaked by the gasket 912 — but 塾The sheet 912 has been used for a period of time to prevent the shallow generation of HP g μ from the liquid, and it will still be damaged due to mechanical fatigue. Therefore, the heat collecting unit 91 is not very ideal. The problem of liquid leakage, 20 200528677 [Content of the invention] "The main purpose of this IT is to provide a heat collector structure and manufacturing cost. It can also reduce the number of parts." To achieve the above purpose, the following steps of the present invention …… The method mainly includes step A… providing a liquid-cooled pipe in a cold pipe system tortuously bend to the same co-planar… :, surface, and liquid H) the upper surface of the heat collecting sheet; And this coplanar plane is flatly attached to step B: providing solder on the upper surface of the heat-collecting sheet and the liquid-cooled tube; step C ·· heating the liquid-cooled tube, after the integration, it will move like a ... After the material is melted and the solder is melted, it is manually filled into the capillary gap between the heat collecting sheet and the wicking gap between the heat sinks and the faucets; Step D: The cooling liquid cooling pipe and the heat collecting sheet and the liquid cooling pipe. And the combination: the outer features of the present invention, the collector structure is mainly-the ... film, and-the liquid cooling tube. Among them, the liquid cooling tube tie rod set is located on the heat collecting sheet-upper surface, curved Folded on the same coplanar upper surface, and the liquid cooling pipe is a circuitous surface, The two ends are respectively formed with __outlet ^ and sheet_ 二 表 〃 As can be seen from the above, the collector of the present invention is manufactured using only a single pie ..., ° / or 疋 collector ^ collector sheet And a liquid cooling pipe can be used to reduce the number of parts, which can reduce the cost. In addition, with the design of the liquid cooling tube 20 200528677, the liquid used for heat dissipation can be flowed through the liquid cooling tube. Traditionally, a separate gasket must be provided-for the purpose of sealing, it is not necessary to prevent the leakage of the liquid used for political heating. Purpose. α is effective [Embodiment] In order to make the #examiner better understand the technical content of the present invention, a preferred embodiment is described below. Please refer to FIG. 3 for a flowchart of the present invention, FIG. 4 for an exploded view of the present body, and FIG. 5 for a three-dimensional assembled view of the present invention. 3, and FIG. 3 shows the flow of the manufacturing method of the present invention, which is described in detail below. … At first, a liquid cooling pipe i is provided on the surface of a heat collecting sheet 2 (SA), and the liquid cooling pipe 丨 is meandered on the same common plane 丨 丨, and this ugly plane 11 is Flatly adhere to the upper surface 21 of the heat collecting sheet 2. The aforementioned liquid cooling tube 15 is first made flat by a pressure plate or other equivalent method, so that the contact area between the liquid cooling tube 1 and the upper surface 21 of the heat collecting sheet 2 can be increased. Then, a solder 3 with a melting point lower than the melting point of the liquid cooling tube and the heat collecting sheet 2 is provided. In this embodiment, a 燐 copper solder rod (Weld⑺d P / Cu) is used, and the length is in accordance with the liquid cooling pipe. Detour the length of the bend to make a proper 20 'tailor, and then place it on the upper surface 21 of the heat collecting sheet 2 and the liquid cooling tube 1 (SB). After the solder 3 is placed, place the liquid cooling tube 1, The heat-collecting sheet 2 and the solder 3 are sent into an oven (not shown) for heating operation (sc). In this embodiment, a type of furnace called a “furnace brazing” is used. Heat the liquid cooling tube 1, the heat collecting sheet 2, and the solder 3. At this time, because the melting point of the solder 3 is lower than the melting point of the liquid cooling tube 1 and the heat collecting sheet 2, the solder 3 can be melted first and capillary force can be used. The flow is packed in the capillary gap between the upper surface 21 of the heat collecting sheet 2 and the liquid-cooled plumber. Finally, the cooling liquid cooling tube 丨 and the heat collecting sheet 2 promote the solidification of the solder 3 and combine the heat collecting sheet 2 and the liquid cooling tube 1 (SD), so that a heat collector structure can be completed, and it can be placed in a center The processing unit 4 (shown in FIG. 4) is used for heating electronic components. 10 15 Please refer to FIG. 4 and FIG. 5 at the same time. The structure of the heat collector obtained by the above manufacturing method includes a heat collecting sheet 2 and a liquid cooling pipe 1. Among them, the heat collecting sheet 2 also includes an upper surface 21, and the liquid cooling tube 丨 is slightly flat and is set on the upper surface of the heat collecting sheet 2 with a solder 3 soldering set of 燐 copper rods, and the liquid cooling tube! It is meandered in the same coplanar 11 ±, and this coplanar u is flatly attached to the upper surface 21 of the heat collecting sheet 2. An outlet 12 and an inlet 13 are formed at the two ends of the liquid cooling tube at @ 时, respectively. . In this example, because copper has better heat conduction characteristics, the above-mentioned heat-collecting sheet 2 and liquid-cooled tube 1 are made of copper as the material, that is, the heat-collecting artificial copper sheet, and the liquid-cooling official i It is a copper tube, but I can also use Ming or other metal materials. 2 disks—From the above, we can see that the heat collectors only need to use when the heat collector is manufactured-the heat collector sheet is small *, 7 g 1 can be formed-the structure of the heat collector, so it can be truly subtracted, so : Relatively reduce manufacturing costs. In addition, the liquid cooling pipe 1 can be used to make the liquid for heat dissipation flow in the liquid cooling pipe. Therefore, it is not necessary to install a separate gasket such as a sealing gasket for different purposes, as in the traditional 20 200528677. The purpose of leakage of liquid for heat dissipation. The above-mentioned embodiments are merely examples for convenience of explanation. The scope of the claims of the present invention shall be based on the scope of the patent application, rather than being limited to the above-mentioned embodiments. [Brief description of the drawings] FIG. 1 is a perspective view of a conventional water-cooled heat sink. FIG. 2 is an exploded perspective view of a conventional heat collection unit.
10圖3係本發明之流程圖。 圖4係本發明之立體分解圖。 圖5係本發明之立體組合圖。 【圖號說明】 1 液冷管 13 入口 3 焊料 91〇液體流道 913上蓋 94 熱管 11 共平面 2 集熱片 4 中央處理 911集熱片 92 水箱 12出口 上表面 元91集熱單元 912墊片 93散熱單元Fig. 3 is a flowchart of the present invention. FIG. 4 is an exploded perspective view of the present invention. FIG. 5 is a perspective assembled view of the present invention. [Illustration of drawing number] 1 liquid cooling pipe 13 inlet 3 solder 91 〇 liquid channel 913 upper cover 94 heat pipe 11 coplanar 2 heat collecting sheet 4 central processing 911 heat collecting sheet 92 water tank 12 outlet upper surface element 91 heat collecting unit 912 gasket 93 radiation unit
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