TWI233174B - Temperature-controlled chuck and method for controlling the temperature of a substantially flat object - Google Patents

Temperature-controlled chuck and method for controlling the temperature of a substantially flat object Download PDF

Info

Publication number
TWI233174B
TWI233174B TW091109337A TW91109337A TWI233174B TW I233174 B TWI233174 B TW I233174B TW 091109337 A TW091109337 A TW 091109337A TW 91109337 A TW91109337 A TW 91109337A TW I233174 B TWI233174 B TW I233174B
Authority
TW
Taiwan
Prior art keywords
temperature
rear side
flat object
elements
wafer
Prior art date
Application number
TW091109337A
Other languages
English (en)
Chinese (zh)
Inventor
John George Maltabes
Alain Bernard Charles
Karl Emerson Mautz
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Application granted granted Critical
Publication of TWI233174B publication Critical patent/TWI233174B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Temperature (AREA)
  • Physical Vapour Deposition (AREA)
TW091109337A 2001-05-31 2002-05-06 Temperature-controlled chuck and method for controlling the temperature of a substantially flat object TWI233174B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/871,854 US6495802B1 (en) 2001-05-31 2001-05-31 Temperature-controlled chuck and method for controlling the temperature of a substantially flat object

Publications (1)

Publication Number Publication Date
TWI233174B true TWI233174B (en) 2005-05-21

Family

ID=25358296

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091109337A TWI233174B (en) 2001-05-31 2002-05-06 Temperature-controlled chuck and method for controlling the temperature of a substantially flat object

Country Status (6)

Country Link
US (1) US6495802B1 (cg-RX-API-DMAC7.html)
JP (1) JP4476622B2 (cg-RX-API-DMAC7.html)
KR (1) KR100890874B1 (cg-RX-API-DMAC7.html)
CN (1) CN1291448C (cg-RX-API-DMAC7.html)
TW (1) TWI233174B (cg-RX-API-DMAC7.html)
WO (1) WO2002099853A2 (cg-RX-API-DMAC7.html)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7161121B1 (en) * 2001-04-30 2007-01-09 Lam Research Corporation Electrostatic chuck having radial temperature control capability
TWI266378B (en) * 2003-03-06 2006-11-11 Toshiba Corp Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method
EP1623452B1 (en) * 2003-05-07 2006-11-22 Axcelis Technologies Inc. Wide temperature range chuck system
US6927835B2 (en) * 2003-09-12 2005-08-09 Asml Netherlands B.V. Adaptive thermal control of lithographic chemical processes
US20050158419A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Thermal processing system for imprint lithography
US20050156353A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Method to improve the flow rate of imprinting material
JP4765328B2 (ja) * 2004-04-16 2011-09-07 東京エレクトロン株式会社 被処理体の処理装置
EP2490073B1 (en) * 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
CN109254501A (zh) 2012-02-03 2019-01-22 Asml荷兰有限公司 衬底支架、光刻装置、器件制造方法和制造衬底保持器的方法
KR101370049B1 (ko) * 2012-12-21 2014-03-06 주식회사 나래나노텍 기판 온도 측정 장치 및 방법, 및 이를 구비한 기판 열처리 챔버 및 장치
US9224583B2 (en) * 2013-03-15 2015-12-29 Lam Research Corporation System and method for heating plasma exposed surfaces
US10736182B2 (en) * 2014-07-02 2020-08-04 Applied Materials, Inc. Apparatus, systems, and methods for temperature control of substrates using embedded fiber optics and epoxy optical diffusers
KR102423818B1 (ko) 2015-12-18 2022-07-21 삼성전자주식회사 정전척 어셈블리 및 그를 포함하는 반도체 제조장치, 그리고 정전척 온도 측정방법
WO2017144277A1 (en) 2016-02-24 2017-08-31 Asml Netherlands B.V. Substrate handling system and lithographic apparatus
US10973088B2 (en) 2016-04-18 2021-04-06 Applied Materials, Inc. Optically heated substrate support assembly with removable optical fibers
CN113432737A (zh) * 2020-03-19 2021-09-24 长鑫存储技术有限公司 晶圆卡盘温度量测及温度校准的方法和温度量测系统
CN112405333B (zh) * 2020-12-04 2022-08-16 华海清科(北京)科技有限公司 一种化学机械抛光装置和抛光方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
KR920012893A (ko) * 1990-12-28 1992-07-28 이헌조 온도측정센서
EP0633608B1 (en) * 1993-07-08 2000-10-11 Sumitomo Metal Industries, Ltd. Process for producing a pin-finned heat sink
JPH07283095A (ja) * 1994-04-08 1995-10-27 Hitachi Ltd 半導体基板の処理方法及び装置
WO1995028002A1 (fr) * 1994-04-08 1995-10-19 Hitachi, Ltd. Procede et dispositif de traitement d'une plaquette de semi-conducteur
WO1998005060A1 (en) * 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Multizone bake/chill thermal cycling module
JP3379394B2 (ja) * 1997-07-28 2003-02-24 松下電器産業株式会社 プラズマ処理方法及び装置
JP3246891B2 (ja) * 1998-02-03 2002-01-15 東京エレクトロン株式会社 熱処理装置
JP4625183B2 (ja) * 1998-11-20 2011-02-02 ステアーグ アール ティ ピー システムズ インコーポレイテッド 半導体ウェハのための急速加熱及び冷却装置

Also Published As

Publication number Publication date
KR20040007622A (ko) 2004-01-24
WO2002099853B1 (en) 2003-11-20
JP4476622B2 (ja) 2010-06-09
US20020179585A1 (en) 2002-12-05
CN1537320A (zh) 2004-10-13
CN1291448C (zh) 2006-12-20
JP2004531067A (ja) 2004-10-07
WO2002099853A3 (en) 2003-02-20
US6495802B1 (en) 2002-12-17
KR100890874B1 (ko) 2009-03-31
WO2002099853A2 (en) 2002-12-12

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