CN1291448C - 用于控制基本平坦物体上的温度的温控卡盘和方法 - Google Patents

用于控制基本平坦物体上的温度的温控卡盘和方法 Download PDF

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Publication number
CN1291448C
CN1291448C CNB028109473A CN02810947A CN1291448C CN 1291448 C CN1291448 C CN 1291448C CN B028109473 A CNB028109473 A CN B028109473A CN 02810947 A CN02810947 A CN 02810947A CN 1291448 C CN1291448 C CN 1291448C
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CN
China
Prior art keywords
temperature
dorsal part
flat object
distributed
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028109473A
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English (en)
Chinese (zh)
Other versions
CN1537320A (zh
Inventor
约翰·G·马尔塔比斯
阿兰·B·查尔斯
卡尔·E·莫茨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
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Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN1537320A publication Critical patent/CN1537320A/zh
Application granted granted Critical
Publication of CN1291448C publication Critical patent/CN1291448C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Temperature (AREA)
  • Physical Vapour Deposition (AREA)
CNB028109473A 2001-05-31 2002-04-24 用于控制基本平坦物体上的温度的温控卡盘和方法 Expired - Fee Related CN1291448C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/871,854 2001-05-31
US09/871,854 US6495802B1 (en) 2001-05-31 2001-05-31 Temperature-controlled chuck and method for controlling the temperature of a substantially flat object

Publications (2)

Publication Number Publication Date
CN1537320A CN1537320A (zh) 2004-10-13
CN1291448C true CN1291448C (zh) 2006-12-20

Family

ID=25358296

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028109473A Expired - Fee Related CN1291448C (zh) 2001-05-31 2002-04-24 用于控制基本平坦物体上的温度的温控卡盘和方法

Country Status (6)

Country Link
US (1) US6495802B1 (cg-RX-API-DMAC7.html)
JP (1) JP4476622B2 (cg-RX-API-DMAC7.html)
KR (1) KR100890874B1 (cg-RX-API-DMAC7.html)
CN (1) CN1291448C (cg-RX-API-DMAC7.html)
TW (1) TWI233174B (cg-RX-API-DMAC7.html)
WO (1) WO2002099853A2 (cg-RX-API-DMAC7.html)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7161121B1 (en) * 2001-04-30 2007-01-09 Lam Research Corporation Electrostatic chuck having radial temperature control capability
TWI266378B (en) * 2003-03-06 2006-11-11 Toshiba Corp Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method
EP1623452B1 (en) * 2003-05-07 2006-11-22 Axcelis Technologies Inc. Wide temperature range chuck system
US6927835B2 (en) * 2003-09-12 2005-08-09 Asml Netherlands B.V. Adaptive thermal control of lithographic chemical processes
US20050158419A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Thermal processing system for imprint lithography
US20050156353A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Method to improve the flow rate of imprinting material
JP4765328B2 (ja) * 2004-04-16 2011-09-07 東京エレクトロン株式会社 被処理体の処理装置
EP2490073B1 (en) * 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
CN109254501A (zh) 2012-02-03 2019-01-22 Asml荷兰有限公司 衬底支架、光刻装置、器件制造方法和制造衬底保持器的方法
KR101370049B1 (ko) * 2012-12-21 2014-03-06 주식회사 나래나노텍 기판 온도 측정 장치 및 방법, 및 이를 구비한 기판 열처리 챔버 및 장치
US9224583B2 (en) * 2013-03-15 2015-12-29 Lam Research Corporation System and method for heating plasma exposed surfaces
US10736182B2 (en) * 2014-07-02 2020-08-04 Applied Materials, Inc. Apparatus, systems, and methods for temperature control of substrates using embedded fiber optics and epoxy optical diffusers
KR102423818B1 (ko) 2015-12-18 2022-07-21 삼성전자주식회사 정전척 어셈블리 및 그를 포함하는 반도체 제조장치, 그리고 정전척 온도 측정방법
WO2017144277A1 (en) 2016-02-24 2017-08-31 Asml Netherlands B.V. Substrate handling system and lithographic apparatus
US10973088B2 (en) 2016-04-18 2021-04-06 Applied Materials, Inc. Optically heated substrate support assembly with removable optical fibers
CN113432737A (zh) * 2020-03-19 2021-09-24 长鑫存储技术有限公司 晶圆卡盘温度量测及温度校准的方法和温度量测系统
CN112405333B (zh) * 2020-12-04 2022-08-16 华海清科(北京)科技有限公司 一种化学机械抛光装置和抛光方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
KR920012893A (ko) * 1990-12-28 1992-07-28 이헌조 온도측정센서
EP0633608B1 (en) * 1993-07-08 2000-10-11 Sumitomo Metal Industries, Ltd. Process for producing a pin-finned heat sink
JPH07283095A (ja) * 1994-04-08 1995-10-27 Hitachi Ltd 半導体基板の処理方法及び装置
WO1995028002A1 (fr) * 1994-04-08 1995-10-19 Hitachi, Ltd. Procede et dispositif de traitement d'une plaquette de semi-conducteur
WO1998005060A1 (en) * 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Multizone bake/chill thermal cycling module
JP3379394B2 (ja) * 1997-07-28 2003-02-24 松下電器産業株式会社 プラズマ処理方法及び装置
JP3246891B2 (ja) * 1998-02-03 2002-01-15 東京エレクトロン株式会社 熱処理装置
JP4625183B2 (ja) * 1998-11-20 2011-02-02 ステアーグ アール ティ ピー システムズ インコーポレイテッド 半導体ウェハのための急速加熱及び冷却装置

Also Published As

Publication number Publication date
KR20040007622A (ko) 2004-01-24
WO2002099853B1 (en) 2003-11-20
JP4476622B2 (ja) 2010-06-09
TWI233174B (en) 2005-05-21
US20020179585A1 (en) 2002-12-05
CN1537320A (zh) 2004-10-13
JP2004531067A (ja) 2004-10-07
WO2002099853A3 (en) 2003-02-20
US6495802B1 (en) 2002-12-17
KR100890874B1 (ko) 2009-03-31
WO2002099853A2 (en) 2002-12-12

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Owner name: FREESCALE SEMICONDUCTOR INC.

Free format text: FORMER OWNER: MOTOROLA, INC.

Effective date: 20041224

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Address after: texas

Applicant after: Fisical Semiconductor Inc.

Address before: Illinois

Applicant before: Motorola Inc.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20061220

Termination date: 20140424