KR100890874B1 - 온도 제어 척 및 실질적으로 편평한 물체의 온도를제어하는 방법 - Google Patents

온도 제어 척 및 실질적으로 편평한 물체의 온도를제어하는 방법 Download PDF

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Publication number
KR100890874B1
KR100890874B1 KR1020037015617A KR20037015617A KR100890874B1 KR 100890874 B1 KR100890874 B1 KR 100890874B1 KR 1020037015617 A KR1020037015617 A KR 1020037015617A KR 20037015617 A KR20037015617 A KR 20037015617A KR 100890874 B1 KR100890874 B1 KR 100890874B1
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South Korea
Prior art keywords
temperature
back side
wafer
elements
delete delete
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Expired - Fee Related
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KR1020037015617A
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English (en)
Korean (ko)
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KR20040007622A (ko
Inventor
존지. 말타비스
알레인비. 찰스
칼이. 마우츠
Original Assignee
프리스케일 세미컨덕터, 인크.
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Publication of KR20040007622A publication Critical patent/KR20040007622A/ko
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Publication of KR100890874B1 publication Critical patent/KR100890874B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Temperature (AREA)
  • Physical Vapour Deposition (AREA)
KR1020037015617A 2001-05-31 2002-04-24 온도 제어 척 및 실질적으로 편평한 물체의 온도를제어하는 방법 Expired - Fee Related KR100890874B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/871,854 2001-05-31
US09/871,854 US6495802B1 (en) 2001-05-31 2001-05-31 Temperature-controlled chuck and method for controlling the temperature of a substantially flat object
PCT/US2002/013170 WO2002099853A2 (en) 2001-05-31 2002-04-24 Temperature-controlled chuck and method for controlling the temperature of a substantially flat object

Publications (2)

Publication Number Publication Date
KR20040007622A KR20040007622A (ko) 2004-01-24
KR100890874B1 true KR100890874B1 (ko) 2009-03-31

Family

ID=25358296

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037015617A Expired - Fee Related KR100890874B1 (ko) 2001-05-31 2002-04-24 온도 제어 척 및 실질적으로 편평한 물체의 온도를제어하는 방법

Country Status (6)

Country Link
US (1) US6495802B1 (cg-RX-API-DMAC7.html)
JP (1) JP4476622B2 (cg-RX-API-DMAC7.html)
KR (1) KR100890874B1 (cg-RX-API-DMAC7.html)
CN (1) CN1291448C (cg-RX-API-DMAC7.html)
TW (1) TWI233174B (cg-RX-API-DMAC7.html)
WO (1) WO2002099853A2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140113610A (ko) * 2013-03-15 2014-09-24 램 리써치 코포레이션 플라즈마 노출된 표면을 가열하기 위한 시스템 및 방법

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7161121B1 (en) * 2001-04-30 2007-01-09 Lam Research Corporation Electrostatic chuck having radial temperature control capability
TWI266378B (en) * 2003-03-06 2006-11-11 Toshiba Corp Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method
EP1623452B1 (en) * 2003-05-07 2006-11-22 Axcelis Technologies Inc. Wide temperature range chuck system
US6927835B2 (en) * 2003-09-12 2005-08-09 Asml Netherlands B.V. Adaptive thermal control of lithographic chemical processes
US20050158419A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Thermal processing system for imprint lithography
US20050156353A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Method to improve the flow rate of imprinting material
JP4765328B2 (ja) * 2004-04-16 2011-09-07 東京エレクトロン株式会社 被処理体の処理装置
EP2490073B1 (en) * 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
CN109254501A (zh) 2012-02-03 2019-01-22 Asml荷兰有限公司 衬底支架、光刻装置、器件制造方法和制造衬底保持器的方法
KR101370049B1 (ko) * 2012-12-21 2014-03-06 주식회사 나래나노텍 기판 온도 측정 장치 및 방법, 및 이를 구비한 기판 열처리 챔버 및 장치
US10736182B2 (en) * 2014-07-02 2020-08-04 Applied Materials, Inc. Apparatus, systems, and methods for temperature control of substrates using embedded fiber optics and epoxy optical diffusers
KR102423818B1 (ko) 2015-12-18 2022-07-21 삼성전자주식회사 정전척 어셈블리 및 그를 포함하는 반도체 제조장치, 그리고 정전척 온도 측정방법
WO2017144277A1 (en) 2016-02-24 2017-08-31 Asml Netherlands B.V. Substrate handling system and lithographic apparatus
US10973088B2 (en) 2016-04-18 2021-04-06 Applied Materials, Inc. Optically heated substrate support assembly with removable optical fibers
CN113432737A (zh) * 2020-03-19 2021-09-24 长鑫存储技术有限公司 晶圆卡盘温度量测及温度校准的方法和温度量测系统
CN112405333B (zh) * 2020-12-04 2022-08-16 华海清科(北京)科技有限公司 一种化学机械抛光装置和抛光方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920012893A (ko) * 1990-12-28 1992-07-28 이헌조 온도측정센서
JPH07283095A (ja) * 1994-04-08 1995-10-27 Hitachi Ltd 半導体基板の処理方法及び装置
US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
EP0633608B1 (en) * 1993-07-08 2000-10-11 Sumitomo Metal Industries, Ltd. Process for producing a pin-finned heat sink
WO1995028002A1 (fr) * 1994-04-08 1995-10-19 Hitachi, Ltd. Procede et dispositif de traitement d'une plaquette de semi-conducteur
JP3379394B2 (ja) * 1997-07-28 2003-02-24 松下電器産業株式会社 プラズマ処理方法及び装置
JP3246891B2 (ja) * 1998-02-03 2002-01-15 東京エレクトロン株式会社 熱処理装置
JP4625183B2 (ja) * 1998-11-20 2011-02-02 ステアーグ アール ティ ピー システムズ インコーポレイテッド 半導体ウェハのための急速加熱及び冷却装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920012893A (ko) * 1990-12-28 1992-07-28 이헌조 온도측정센서
JPH07283095A (ja) * 1994-04-08 1995-10-27 Hitachi Ltd 半導体基板の処理方法及び装置
US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140113610A (ko) * 2013-03-15 2014-09-24 램 리써치 코포레이션 플라즈마 노출된 표면을 가열하기 위한 시스템 및 방법
KR102219650B1 (ko) 2013-03-15 2021-02-24 램 리써치 코포레이션 플라즈마 노출된 표면을 가열하기 위한 시스템 및 방법

Also Published As

Publication number Publication date
KR20040007622A (ko) 2004-01-24
WO2002099853B1 (en) 2003-11-20
JP4476622B2 (ja) 2010-06-09
TWI233174B (en) 2005-05-21
US20020179585A1 (en) 2002-12-05
CN1537320A (zh) 2004-10-13
CN1291448C (zh) 2006-12-20
JP2004531067A (ja) 2004-10-07
WO2002099853A3 (en) 2003-02-20
US6495802B1 (en) 2002-12-17
WO2002099853A2 (en) 2002-12-12

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