TWI232535B - Wafer carrier pivot mechanism - Google Patents
Wafer carrier pivot mechanism Download PDFInfo
- Publication number
- TWI232535B TWI232535B TW093111880A TW93111880A TWI232535B TW I232535 B TWI232535 B TW I232535B TW 093111880 A TW093111880 A TW 093111880A TW 93111880 A TW93111880 A TW 93111880A TW I232535 B TWI232535 B TW I232535B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- wafer carrier
- ball
- ring
- item
- Prior art date
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 33
- 238000005498 polishing Methods 0.000 claims description 40
- 238000003860 storage Methods 0.000 claims description 17
- 238000000227 grinding Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 10
- 230000004308 accommodation Effects 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 102220089470 rs879255591 Human genes 0.000 claims description 4
- 239000011324 bead Substances 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 239000013013 elastic material Substances 0.000 claims 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 238000007517 polishing process Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 110
- 239000011799 hole material Substances 0.000 description 19
- 239000002002 slurry Substances 0.000 description 9
- 239000013078 crystal Substances 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000009933 burial Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000009331 sowing Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/425,896 US7156946B2 (en) | 2003-04-28 | 2003-04-28 | Wafer carrier pivot mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200426970A TW200426970A (en) | 2004-12-01 |
| TWI232535B true TWI232535B (en) | 2005-05-11 |
Family
ID=33415926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093111880A TWI232535B (en) | 2003-04-28 | 2004-04-28 | Wafer carrier pivot mechanism |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7156946B2 (enExample) |
| JP (1) | JP2006524922A (enExample) |
| TW (1) | TWI232535B (enExample) |
| WO (1) | WO2004097899A2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7109092B2 (en) * | 2003-05-19 | 2006-09-19 | Ziptronix, Inc. | Method of room temperature covalent bonding |
| US7055875B2 (en) * | 2003-07-11 | 2006-06-06 | Asyst Technologies, Inc. | Ultra low contact area end effector |
| US20060019088A1 (en) * | 2004-07-20 | 2006-01-26 | Xiaojia Wang | Adhesive layer composition for in-mold decoration |
| US7602134B1 (en) * | 2006-07-20 | 2009-10-13 | L-3 Communications Sonoma Eo, Inc. | Twist capsule for rotatable payload |
| FR2951106B1 (fr) * | 2009-10-08 | 2012-01-06 | S E T | Presse a tete articulee |
| GB2491035B (en) * | 2011-05-19 | 2013-10-16 | Roller Bearing Co Of America | Swash plate assembly |
| DE102011053118C5 (de) | 2011-08-30 | 2021-08-05 | Kirchhoff Automotive Deutschland Gmbh | Verfahren zum Herstellen eines pressgehärteten Formteils sowie Presshärtwerkzeug |
| CN103203683B (zh) * | 2013-03-13 | 2015-02-18 | 大连理工大学 | 一种浮动抛光头 |
| KR20140092273A (ko) * | 2014-05-30 | 2014-07-23 | 원종수 | 고강도 합금을 포함하는 씨엠피 장치의 연마헤드 |
| JP6592355B2 (ja) * | 2015-01-30 | 2019-10-16 | 株式会社荏原製作所 | 連結機構および基板研磨装置 |
| TWI608875B (zh) * | 2016-05-11 | 2017-12-21 | All Ring Tech Co Ltd | Stage and wafer residue cleaning device using the same |
| CN106041722A (zh) * | 2016-07-19 | 2016-10-26 | 苏州赫瑞特电子专用设备科技有限公司 | 一种上盘万向调心加载机构 |
| CN109590884B (zh) * | 2019-01-11 | 2021-03-16 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | 多载盘晶圆传送设备及传送系统 |
| WO2022094587A1 (en) | 2020-10-29 | 2022-05-05 | Invensas Bonding Technologies, Inc. | Direct bonding methods and structures |
| CN115101459B (zh) * | 2022-06-16 | 2025-05-13 | 华海清科股份有限公司 | 晶圆装卸装置及化学机械抛光系统 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6125768A (ja) | 1984-07-13 | 1986-02-04 | Nec Corp | 平面研摩装置の被加工物保持機構 |
| JPS6125767A (ja) | 1984-07-13 | 1986-02-04 | Nec Corp | 平面研摩装置の被加工物保持機構 |
| JPS6362668A (ja) | 1986-09-03 | 1988-03-18 | Shin Etsu Handotai Co Ltd | 研摩装置 |
| GB8822843D0 (en) * | 1988-09-29 | 1988-11-02 | Jaguar Cars | Universal joints |
| US5377451A (en) * | 1993-02-23 | 1995-01-03 | Memc Electronic Materials, Inc. | Wafer polishing apparatus and method |
| US5538346A (en) | 1995-06-07 | 1996-07-23 | The Young Engineers, Inc. | Novel ball transfer unit |
| JP3549133B2 (ja) * | 1995-12-15 | 2004-08-04 | オリジン電気株式会社 | ワンポイントベアリング及びそれを用いた電子情報装置 |
| US5738568A (en) | 1996-10-04 | 1998-04-14 | International Business Machines Corporation | Flexible tilted wafer carrier |
| US5830806A (en) | 1996-10-18 | 1998-11-03 | Micron Technology, Inc. | Wafer backing member for mechanical and chemical-mechanical planarization of substrates |
| US5868609A (en) | 1997-04-14 | 1999-02-09 | I C Mic-Process, Inc. | Wafer carrier rotating head assembly for chemical-mechanical polishing apparatus |
| US5964653A (en) | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
| US6113479A (en) | 1997-07-25 | 2000-09-05 | Obsidian, Inc. | Wafer carrier for chemical mechanical planarization polishing |
| US5916015A (en) | 1997-07-25 | 1999-06-29 | Speedfam Corporation | Wafer carrier for semiconductor wafer polishing machine |
| US5989104A (en) | 1998-01-12 | 1999-11-23 | Speedfam-Ipec Corporation | Workpiece carrier with monopiece pressure plate and low gimbal point |
| US6106379A (en) | 1998-05-12 | 2000-08-22 | Speedfam-Ipec Corporation | Semiconductor wafer carrier with automatic ring extension |
| US6514121B1 (en) | 1999-10-27 | 2003-02-04 | Strasbaugh | Polishing chemical delivery for small head chemical mechanical planarization |
| US6517419B1 (en) | 1999-10-27 | 2003-02-11 | Strasbaugh | Shaping polishing pad for small head chemical mechanical planarization |
| US6511368B1 (en) | 1999-10-27 | 2003-01-28 | Strasbaugh | Spherical drive assembly for chemical mechanical planarization |
| US6540592B1 (en) * | 2000-06-29 | 2003-04-01 | Speedfam-Ipec Corporation | Carrier head with reduced moment wear ring |
| US6652357B1 (en) * | 2000-09-22 | 2003-11-25 | Lam Research Corporation | Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing |
| JP2004520705A (ja) * | 2000-11-21 | 2004-07-08 | エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニ | 半導体ウエハ、研磨装置及び方法 |
| JP2002192459A (ja) * | 2000-12-26 | 2002-07-10 | Nikon Corp | 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス |
-
2003
- 2003-04-28 US US10/425,896 patent/US7156946B2/en not_active Expired - Lifetime
-
2004
- 2004-04-27 JP JP2006513348A patent/JP2006524922A/ja active Pending
- 2004-04-27 WO PCT/US2004/012879 patent/WO2004097899A2/en not_active Ceased
- 2004-04-28 TW TW093111880A patent/TWI232535B/zh not_active IP Right Cessation
-
2007
- 2007-01-02 US US11/619,088 patent/US20070105491A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US7156946B2 (en) | 2007-01-02 |
| US20040226656A1 (en) | 2004-11-18 |
| JP2006524922A (ja) | 2006-11-02 |
| TW200426970A (en) | 2004-12-01 |
| US20070105491A1 (en) | 2007-05-10 |
| WO2004097899A2 (en) | 2004-11-11 |
| WO2004097899A3 (en) | 2005-08-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |