JPH0317622B2 - - Google Patents
Info
- Publication number
- JPH0317622B2 JPH0317622B2 JP61205759A JP20575986A JPH0317622B2 JP H0317622 B2 JPH0317622 B2 JP H0317622B2 JP 61205759 A JP61205759 A JP 61205759A JP 20575986 A JP20575986 A JP 20575986A JP H0317622 B2 JPH0317622 B2 JP H0317622B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- polishing
- polished
- parallelism
- spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61205759A JPS6362668A (ja) | 1986-09-03 | 1986-09-03 | 研摩装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61205759A JPS6362668A (ja) | 1986-09-03 | 1986-09-03 | 研摩装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6362668A JPS6362668A (ja) | 1988-03-18 |
| JPH0317622B2 true JPH0317622B2 (enExample) | 1991-03-08 |
Family
ID=16512193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61205759A Granted JPS6362668A (ja) | 1986-09-03 | 1986-09-03 | 研摩装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6362668A (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6220606B1 (en) | 1991-11-26 | 2001-04-24 | Nippon Gasket Co., Ltd. | Metallic gasket |
| US5377451A (en) * | 1993-02-23 | 1995-01-03 | Memc Electronic Materials, Inc. | Wafer polishing apparatus and method |
| US5423558A (en) * | 1994-03-24 | 1995-06-13 | Ipec/Westech Systems, Inc. | Semiconductor wafer carrier and method |
| JP3489755B2 (ja) * | 1994-08-05 | 2004-01-26 | 日本ガスケット株式会社 | 金属製ガスケット |
| US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
| JP3230959B2 (ja) * | 1995-09-05 | 2001-11-19 | 日本ガスケット株式会社 | 金属ガスケット |
| JP3230966B2 (ja) * | 1995-10-09 | 2001-11-19 | 日本ガスケット株式会社 | 金属製ガスケット |
| US5791978A (en) * | 1996-11-14 | 1998-08-11 | Speedfam Corporation | Bearing assembly for wafer planarization carrier |
| US6110025A (en) * | 1997-05-07 | 2000-08-29 | Obsidian, Inc. | Containment ring for substrate carrier apparatus |
| US6116990A (en) * | 1997-07-25 | 2000-09-12 | Applied Materials, Inc. | Adjustable low profile gimbal system for chemical mechanical polishing |
| TWI238754B (en) * | 2002-11-07 | 2005-09-01 | Ebara Tech Inc | Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof |
| US7156946B2 (en) | 2003-04-28 | 2007-01-02 | Strasbaugh | Wafer carrier pivot mechanism |
| CN114770339B (zh) * | 2022-06-15 | 2022-09-06 | 沃中孚精密主轴昆山有限公司 | 一种用于镜面抛光的浮动动力抛光头及抛光方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS571653A (en) * | 1980-05-29 | 1982-01-06 | Shibayama Kikai Kk | Parallel stabilizer of surface lapping machine or polishing machine |
-
1986
- 1986-09-03 JP JP61205759A patent/JPS6362668A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6362668A (ja) | 1988-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |