JP2006524922A5 - - Google Patents
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- Publication number
- JP2006524922A5 JP2006524922A5 JP2006513348A JP2006513348A JP2006524922A5 JP 2006524922 A5 JP2006524922 A5 JP 2006524922A5 JP 2006513348 A JP2006513348 A JP 2006513348A JP 2006513348 A JP2006513348 A JP 2006513348A JP 2006524922 A5 JP2006524922 A5 JP 2006524922A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer carrier
- wafer
- housing
- pressure plate
- bearing surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 241000239290 Araneae Species 0.000 claims 11
- 238000005498 polishing Methods 0.000 claims 11
- 238000000034 method Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 102220089470 rs879255591 Human genes 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/425,896 US7156946B2 (en) | 2003-04-28 | 2003-04-28 | Wafer carrier pivot mechanism |
| PCT/US2004/012879 WO2004097899A2 (en) | 2003-04-28 | 2004-04-27 | Wafer carrier pivot mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006524922A JP2006524922A (ja) | 2006-11-02 |
| JP2006524922A5 true JP2006524922A5 (enExample) | 2007-10-18 |
Family
ID=33415926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006513348A Pending JP2006524922A (ja) | 2003-04-28 | 2004-04-27 | ウェーハキャリアピボット機構 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7156946B2 (enExample) |
| JP (1) | JP2006524922A (enExample) |
| TW (1) | TWI232535B (enExample) |
| WO (1) | WO2004097899A2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7109092B2 (en) * | 2003-05-19 | 2006-09-19 | Ziptronix, Inc. | Method of room temperature covalent bonding |
| US7055875B2 (en) * | 2003-07-11 | 2006-06-06 | Asyst Technologies, Inc. | Ultra low contact area end effector |
| US20060019088A1 (en) * | 2004-07-20 | 2006-01-26 | Xiaojia Wang | Adhesive layer composition for in-mold decoration |
| US7602134B1 (en) * | 2006-07-20 | 2009-10-13 | L-3 Communications Sonoma Eo, Inc. | Twist capsule for rotatable payload |
| FR2951106B1 (fr) * | 2009-10-08 | 2012-01-06 | S E T | Presse a tete articulee |
| GB2491035B (en) * | 2011-05-19 | 2013-10-16 | Roller Bearing Co Of America | Swash plate assembly |
| DE102011053118C5 (de) | 2011-08-30 | 2021-08-05 | Kirchhoff Automotive Deutschland Gmbh | Verfahren zum Herstellen eines pressgehärteten Formteils sowie Presshärtwerkzeug |
| CN103203683B (zh) * | 2013-03-13 | 2015-02-18 | 大连理工大学 | 一种浮动抛光头 |
| KR20140092273A (ko) * | 2014-05-30 | 2014-07-23 | 원종수 | 고강도 합금을 포함하는 씨엠피 장치의 연마헤드 |
| JP6592355B2 (ja) | 2015-01-30 | 2019-10-16 | 株式会社荏原製作所 | 連結機構および基板研磨装置 |
| TWI608875B (zh) * | 2016-05-11 | 2017-12-21 | All Ring Tech Co Ltd | Stage and wafer residue cleaning device using the same |
| CN106041722A (zh) * | 2016-07-19 | 2016-10-26 | 苏州赫瑞特电子专用设备科技有限公司 | 一种上盘万向调心加载机构 |
| CN109590884B (zh) * | 2019-01-11 | 2021-03-16 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | 多载盘晶圆传送设备及传送系统 |
| US12424584B2 (en) | 2020-10-29 | 2025-09-23 | Adeia Semiconductor Bonding Technologies Inc. | Direct bonding methods and structures |
| CN115101459B (zh) * | 2022-06-16 | 2025-05-13 | 华海清科股份有限公司 | 晶圆装卸装置及化学机械抛光系统 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6125767A (ja) | 1984-07-13 | 1986-02-04 | Nec Corp | 平面研摩装置の被加工物保持機構 |
| JPS6125768A (ja) | 1984-07-13 | 1986-02-04 | Nec Corp | 平面研摩装置の被加工物保持機構 |
| JPS6362668A (ja) | 1986-09-03 | 1988-03-18 | Shin Etsu Handotai Co Ltd | 研摩装置 |
| GB8822843D0 (en) * | 1988-09-29 | 1988-11-02 | Jaguar Cars | Universal joints |
| US5377451A (en) * | 1993-02-23 | 1995-01-03 | Memc Electronic Materials, Inc. | Wafer polishing apparatus and method |
| US5538346A (en) | 1995-06-07 | 1996-07-23 | The Young Engineers, Inc. | Novel ball transfer unit |
| JP3549133B2 (ja) * | 1995-12-15 | 2004-08-04 | オリジン電気株式会社 | ワンポイントベアリング及びそれを用いた電子情報装置 |
| US5738568A (en) | 1996-10-04 | 1998-04-14 | International Business Machines Corporation | Flexible tilted wafer carrier |
| US5830806A (en) | 1996-10-18 | 1998-11-03 | Micron Technology, Inc. | Wafer backing member for mechanical and chemical-mechanical planarization of substrates |
| US5868609A (en) | 1997-04-14 | 1999-02-09 | I C Mic-Process, Inc. | Wafer carrier rotating head assembly for chemical-mechanical polishing apparatus |
| US5964653A (en) | 1997-07-11 | 1999-10-12 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
| US6113479A (en) | 1997-07-25 | 2000-09-05 | Obsidian, Inc. | Wafer carrier for chemical mechanical planarization polishing |
| US5916015A (en) | 1997-07-25 | 1999-06-29 | Speedfam Corporation | Wafer carrier for semiconductor wafer polishing machine |
| US5989104A (en) | 1998-01-12 | 1999-11-23 | Speedfam-Ipec Corporation | Workpiece carrier with monopiece pressure plate and low gimbal point |
| US6106379A (en) | 1998-05-12 | 2000-08-22 | Speedfam-Ipec Corporation | Semiconductor wafer carrier with automatic ring extension |
| US6511368B1 (en) | 1999-10-27 | 2003-01-28 | Strasbaugh | Spherical drive assembly for chemical mechanical planarization |
| US6514121B1 (en) | 1999-10-27 | 2003-02-04 | Strasbaugh | Polishing chemical delivery for small head chemical mechanical planarization |
| US6517419B1 (en) | 1999-10-27 | 2003-02-11 | Strasbaugh | Shaping polishing pad for small head chemical mechanical planarization |
| US6540592B1 (en) * | 2000-06-29 | 2003-04-01 | Speedfam-Ipec Corporation | Carrier head with reduced moment wear ring |
| US6652357B1 (en) * | 2000-09-22 | 2003-11-25 | Lam Research Corporation | Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing |
| CN1461251A (zh) * | 2000-11-21 | 2003-12-10 | Memc电子材料有限公司 | 半导体晶片,抛光装置和方法 |
| JP2002192459A (ja) * | 2000-12-26 | 2002-07-10 | Nikon Corp | 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス |
-
2003
- 2003-04-28 US US10/425,896 patent/US7156946B2/en not_active Expired - Lifetime
-
2004
- 2004-04-27 JP JP2006513348A patent/JP2006524922A/ja active Pending
- 2004-04-27 WO PCT/US2004/012879 patent/WO2004097899A2/en not_active Ceased
- 2004-04-28 TW TW093111880A patent/TWI232535B/zh not_active IP Right Cessation
-
2007
- 2007-01-02 US US11/619,088 patent/US20070105491A1/en not_active Abandoned
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