JP2010172976A5 - - Google Patents
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- Publication number
- JP2010172976A5 JP2010172976A5 JP2009015384A JP2009015384A JP2010172976A5 JP 2010172976 A5 JP2010172976 A5 JP 2010172976A5 JP 2009015384 A JP2009015384 A JP 2009015384A JP 2009015384 A JP2009015384 A JP 2009015384A JP 2010172976 A5 JP2010172976 A5 JP 2010172976A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing tool
- pressing
- polished
- polishing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 54
- 238000001514 detection method Methods 0.000 claims 9
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009015384A JP5434094B2 (ja) | 2009-01-27 | 2009-01-27 | 研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009015384A JP5434094B2 (ja) | 2009-01-27 | 2009-01-27 | 研磨装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010172976A JP2010172976A (ja) | 2010-08-12 |
| JP2010172976A5 true JP2010172976A5 (enExample) | 2012-10-25 |
| JP5434094B2 JP5434094B2 (ja) | 2014-03-05 |
Family
ID=42704421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009015384A Active JP5434094B2 (ja) | 2009-01-27 | 2009-01-27 | 研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5434094B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5930871B2 (ja) * | 2012-06-27 | 2016-06-08 | コマツNtc株式会社 | 研削加工装置およびその制御方法 |
| JP6921527B2 (ja) * | 2016-02-05 | 2021-08-18 | 芝浦機械株式会社 | 研磨装置 |
| CN109571263B (zh) * | 2018-12-11 | 2021-02-19 | 湖北开明高新科技有限公司 | 一种压力可调的回转窑轮带磨削装置 |
| CN110434716B (zh) * | 2019-08-16 | 2024-04-26 | 天津大学 | 一种力/位可控面型自适应磨抛装置及方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645771A (en) * | 1987-06-30 | 1989-01-10 | Toshiba Corp | Retaining unit for processing tool |
| JPH02131851A (ja) * | 1988-11-11 | 1990-05-21 | Mitsubishi Electric Corp | 曲面研摩装置 |
| JPH03234469A (ja) * | 1990-02-07 | 1991-10-18 | Toshiba Corp | 研磨装置 |
| JPH04135155A (ja) * | 1990-09-21 | 1992-05-08 | Topcon Corp | 研磨装置 |
| JPH08141899A (ja) * | 1994-11-17 | 1996-06-04 | Nikon Corp | 研磨装置 |
| JPH09323251A (ja) * | 1996-06-07 | 1997-12-16 | Nikon Corp | 研磨ヘッド |
-
2009
- 2009-01-27 JP JP2009015384A patent/JP5434094B2/ja active Active
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