JP5434094B2 - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP5434094B2
JP5434094B2 JP2009015384A JP2009015384A JP5434094B2 JP 5434094 B2 JP5434094 B2 JP 5434094B2 JP 2009015384 A JP2009015384 A JP 2009015384A JP 2009015384 A JP2009015384 A JP 2009015384A JP 5434094 B2 JP5434094 B2 JP 5434094B2
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Japan
Prior art keywords
polishing
polishing tool
pressing
polished
pressing mechanism
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JP2009015384A
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Japanese (ja)
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JP2010172976A5 (enExample
JP2010172976A (ja
Inventor
直樹 浅田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
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Nikon Corp
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Priority to JP2009015384A priority Critical patent/JP5434094B2/ja
Publication of JP2010172976A publication Critical patent/JP2010172976A/ja
Publication of JP2010172976A5 publication Critical patent/JP2010172976A5/ja
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Publication of JP5434094B2 publication Critical patent/JP5434094B2/ja
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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2009015384A 2009-01-27 2009-01-27 研磨装置 Active JP5434094B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009015384A JP5434094B2 (ja) 2009-01-27 2009-01-27 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009015384A JP5434094B2 (ja) 2009-01-27 2009-01-27 研磨装置

Publications (3)

Publication Number Publication Date
JP2010172976A JP2010172976A (ja) 2010-08-12
JP2010172976A5 JP2010172976A5 (enExample) 2012-10-25
JP5434094B2 true JP5434094B2 (ja) 2014-03-05

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ID=42704421

Family Applications (1)

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JP2009015384A Active JP5434094B2 (ja) 2009-01-27 2009-01-27 研磨装置

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JP (1) JP5434094B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109571263A (zh) * 2018-12-11 2019-04-05 湖北开明高新科技有限公司 一种压力可调的回转窑轮带磨削装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5930871B2 (ja) * 2012-06-27 2016-06-08 コマツＮｔｃ株式会社 研削加工装置およびその制御方法
JP6921527B2 (ja) * 2016-02-05 2021-08-18 芝浦機械株式会社 研磨装置
CN110434716B (zh) * 2019-08-16 2024-04-26 天津大学 一种力/位可控面型自适应磨抛装置及方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS645771A (en) * 1987-06-30 1989-01-10 Toshiba Corp Retaining unit for processing tool
JPH02131851A (ja) * 1988-11-11 1990-05-21 Mitsubishi Electric Corp 曲面研摩装置
JPH03234469A (ja) * 1990-02-07 1991-10-18 Toshiba Corp 研磨装置
JPH04135155A (ja) * 1990-09-21 1992-05-08 Topcon Corp 研磨装置
JPH08141899A (ja) * 1994-11-17 1996-06-04 Nikon Corp 研磨装置
JPH09323251A (ja) * 1996-06-07 1997-12-16 Nikon Corp 研磨ヘッド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109571263A (zh) * 2018-12-11 2019-04-05 湖北开明高新科技有限公司 一种压力可调的回转窑轮带磨削装置
CN109571263B (zh) * 2018-12-11 2021-02-19 湖北开明高新科技有限公司 一种压力可调的回转窑轮带磨削装置

Also Published As

Publication number Publication date
JP2010172976A (ja) 2010-08-12

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