JP2006524922A - ウェーハキャリアピボット機構 - Google Patents

ウェーハキャリアピボット機構 Download PDF

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Publication number
JP2006524922A
JP2006524922A JP2006513348A JP2006513348A JP2006524922A JP 2006524922 A JP2006524922 A JP 2006524922A JP 2006513348 A JP2006513348 A JP 2006513348A JP 2006513348 A JP2006513348 A JP 2006513348A JP 2006524922 A JP2006524922 A JP 2006524922A
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JP
Japan
Prior art keywords
wafer
wafer carrier
housing
pressure plate
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2006513348A
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English (en)
Japanese (ja)
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JP2006524922A5 (enExample
Inventor
トーマス・エイ・ウォルシュ
ウィリアム・ジェイ・ケイルニアン
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Strasbaugh Inc
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Strasbaugh Inc
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Filing date
Publication date
Application filed by Strasbaugh Inc filed Critical Strasbaugh Inc
Publication of JP2006524922A publication Critical patent/JP2006524922A/ja
Publication of JP2006524922A5 publication Critical patent/JP2006524922A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2006513348A 2003-04-28 2004-04-27 ウェーハキャリアピボット機構 Pending JP2006524922A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/425,896 US7156946B2 (en) 2003-04-28 2003-04-28 Wafer carrier pivot mechanism
PCT/US2004/012879 WO2004097899A2 (en) 2003-04-28 2004-04-27 Wafer carrier pivot mechanism

Publications (2)

Publication Number Publication Date
JP2006524922A true JP2006524922A (ja) 2006-11-02
JP2006524922A5 JP2006524922A5 (enExample) 2007-10-18

Family

ID=33415926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006513348A Pending JP2006524922A (ja) 2003-04-28 2004-04-27 ウェーハキャリアピボット機構

Country Status (4)

Country Link
US (2) US7156946B2 (enExample)
JP (1) JP2006524922A (enExample)
TW (1) TWI232535B (enExample)
WO (1) WO2004097899A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013507254A (ja) * 2009-10-08 2013-03-04 エス ウ テ 関節接合されたヘッドによるプレス機
KR20160094314A (ko) * 2015-01-30 2016-08-09 가부시키가이샤 에바라 세이사꾸쇼 연결 기구, 기판 연마 장치, 연결 기구의 회전 중심 위치 결정 방법, 연결 기구의 회전 중심 위치 결정 프로그램, 회전체의 최대 압박 하중 결정 방법 및 회전체의 최대 압박 하중 결정 프로그램

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7109092B2 (en) * 2003-05-19 2006-09-19 Ziptronix, Inc. Method of room temperature covalent bonding
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
US20060019088A1 (en) * 2004-07-20 2006-01-26 Xiaojia Wang Adhesive layer composition for in-mold decoration
US7602134B1 (en) * 2006-07-20 2009-10-13 L-3 Communications Sonoma Eo, Inc. Twist capsule for rotatable payload
GB2491035B (en) * 2011-05-19 2013-10-16 Roller Bearing Co Of America Swash plate assembly
DE102011053118C5 (de) 2011-08-30 2021-08-05 Kirchhoff Automotive Deutschland Gmbh Verfahren zum Herstellen eines pressgehärteten Formteils sowie Presshärtwerkzeug
CN103203683B (zh) * 2013-03-13 2015-02-18 大连理工大学 一种浮动抛光头
KR20140092273A (ko) * 2014-05-30 2014-07-23 원종수 고강도 합금을 포함하는 씨엠피 장치의 연마헤드
TWI608875B (zh) * 2016-05-11 2017-12-21 All Ring Tech Co Ltd Stage and wafer residue cleaning device using the same
CN106041722A (zh) * 2016-07-19 2016-10-26 苏州赫瑞特电子专用设备科技有限公司 一种上盘万向调心加载机构
CN109590884B (zh) * 2019-01-11 2021-03-16 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 多载盘晶圆传送设备及传送系统
WO2022094587A1 (en) 2020-10-29 2022-05-05 Invensas Bonding Technologies, Inc. Direct bonding methods and structures
CN115101459B (zh) * 2022-06-16 2025-05-13 华海清科股份有限公司 晶圆装卸装置及化学机械抛光系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125767A (ja) * 1984-07-13 1986-02-04 Nec Corp 平面研摩装置の被加工物保持機構
JPH09166135A (ja) * 1995-12-15 1997-06-24 Origin Electric Co Ltd ワンポイントベアリング及びそれを用いた電子情報装置
JP2002192459A (ja) * 2000-12-26 2002-07-10 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125768A (ja) 1984-07-13 1986-02-04 Nec Corp 平面研摩装置の被加工物保持機構
JPS6362668A (ja) 1986-09-03 1988-03-18 Shin Etsu Handotai Co Ltd 研摩装置
GB8822843D0 (en) * 1988-09-29 1988-11-02 Jaguar Cars Universal joints
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5538346A (en) 1995-06-07 1996-07-23 The Young Engineers, Inc. Novel ball transfer unit
US5738568A (en) 1996-10-04 1998-04-14 International Business Machines Corporation Flexible tilted wafer carrier
US5830806A (en) 1996-10-18 1998-11-03 Micron Technology, Inc. Wafer backing member for mechanical and chemical-mechanical planarization of substrates
US5868609A (en) 1997-04-14 1999-02-09 I C Mic-Process, Inc. Wafer carrier rotating head assembly for chemical-mechanical polishing apparatus
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6113479A (en) 1997-07-25 2000-09-05 Obsidian, Inc. Wafer carrier for chemical mechanical planarization polishing
US5916015A (en) 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US5989104A (en) 1998-01-12 1999-11-23 Speedfam-Ipec Corporation Workpiece carrier with monopiece pressure plate and low gimbal point
US6106379A (en) 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US6514121B1 (en) 1999-10-27 2003-02-04 Strasbaugh Polishing chemical delivery for small head chemical mechanical planarization
US6517419B1 (en) 1999-10-27 2003-02-11 Strasbaugh Shaping polishing pad for small head chemical mechanical planarization
US6511368B1 (en) 1999-10-27 2003-01-28 Strasbaugh Spherical drive assembly for chemical mechanical planarization
US6540592B1 (en) * 2000-06-29 2003-04-01 Speedfam-Ipec Corporation Carrier head with reduced moment wear ring
US6652357B1 (en) * 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
JP2004520705A (ja) * 2000-11-21 2004-07-08 エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニ 半導体ウエハ、研磨装置及び方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125767A (ja) * 1984-07-13 1986-02-04 Nec Corp 平面研摩装置の被加工物保持機構
JPH09166135A (ja) * 1995-12-15 1997-06-24 Origin Electric Co Ltd ワンポイントベアリング及びそれを用いた電子情報装置
JP2002192459A (ja) * 2000-12-26 2002-07-10 Nikon Corp 研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013507254A (ja) * 2009-10-08 2013-03-04 エス ウ テ 関節接合されたヘッドによるプレス機
KR20160094314A (ko) * 2015-01-30 2016-08-09 가부시키가이샤 에바라 세이사꾸쇼 연결 기구, 기판 연마 장치, 연결 기구의 회전 중심 위치 결정 방법, 연결 기구의 회전 중심 위치 결정 프로그램, 회전체의 최대 압박 하중 결정 방법 및 회전체의 최대 압박 하중 결정 프로그램
JP2016144860A (ja) * 2015-01-30 2016-08-12 株式会社荏原製作所 連結機構、基板研磨装置、連結機構の回転中心位置決定方法、連結機構の回転中心位置決定プログラム、回転体の最大押付荷重決定方法、および回転体の最大押付荷重決定プログラム
US10442054B2 (en) 2015-01-30 2019-10-15 Ebara Corporation Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body
KR102323958B1 (ko) * 2015-01-30 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연결 기구 및 기판 연마 장치
KR20220133153A (ko) * 2015-01-30 2022-10-04 가부시키가이샤 에바라 세이사꾸쇼 연결 기구의 회전 중심 위치 결정 방법, 연결 기구의 회전 중심 위치 결정 프로그램을 기록한 컴퓨터로 판독 가능한 기록 매체, 회전체의 최대 압박 하중 결정 방법 및 회전체의 최대 압박 하중 결정 프로그램을 기록한 컴퓨터로 판독 가능한 기록 매체
KR102569773B1 (ko) 2015-01-30 2023-08-23 가부시키가이샤 에바라 세이사꾸쇼 연결 기구의 회전 중심 위치 결정 방법 및 연결 기구의 회전 중심 위치 결정 프로그램을 기록한 컴퓨터로 판독 가능한 기록 매체

Also Published As

Publication number Publication date
US7156946B2 (en) 2007-01-02
US20040226656A1 (en) 2004-11-18
TWI232535B (en) 2005-05-11
TW200426970A (en) 2004-12-01
US20070105491A1 (en) 2007-05-10
WO2004097899A2 (en) 2004-11-11
WO2004097899A3 (en) 2005-08-04

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