TWI229914B - User interface for quantifying wafer non-uniformities and graphically explore significance - Google Patents
User interface for quantifying wafer non-uniformities and graphically explore significance Download PDFInfo
- Publication number
- TWI229914B TWI229914B TW092126645A TW92126645A TWI229914B TW I229914 B TWI229914 B TW I229914B TW 092126645 A TW092126645 A TW 092126645A TW 92126645 A TW92126645 A TW 92126645A TW I229914 B TWI229914 B TW I229914B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- area
- data
- measurement data
- chart
- Prior art date
Links
- 238000004458 analytical method Methods 0.000 claims abstract description 83
- 235000012431 wafers Nutrition 0.000 claims description 335
- 238000009826 distribution Methods 0.000 claims description 88
- 238000005259 measurement Methods 0.000 claims description 76
- 238000007619 statistical method Methods 0.000 claims description 6
- 230000008901 benefit Effects 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 5
- 238000012790 confirmation Methods 0.000 claims description 5
- 238000011156 evaluation Methods 0.000 claims description 5
- 238000001000 micrograph Methods 0.000 claims description 5
- 235000008429 bread Nutrition 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 31
- 238000010586 diagram Methods 0.000 description 22
- 230000000875 corresponding effect Effects 0.000 description 18
- 230000006870 function Effects 0.000 description 15
- 238000003780 insertion Methods 0.000 description 13
- 230000037431 insertion Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000012937 correction Methods 0.000 description 11
- 239000013078 crystal Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 8
- 238000003917 TEM image Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000007726 management method Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 240000006829 Ficus sundaica Species 0.000 description 1
- 235000000434 Melocanna baccifera Nutrition 0.000 description 1
- 241001497770 Melocanna baccifera Species 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012854 evaluation process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- XUFQPHANEAPEMJ-UHFFFAOYSA-N famotidine Chemical compound NC(N)=NC1=NC(CSCCC(N)=NS(N)(=O)=O)=CS1 XUFQPHANEAPEMJ-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41402102P | 2002-09-26 | 2002-09-26 | |
| US10/331,194 US7239737B2 (en) | 2002-09-26 | 2002-12-24 | User interface for quantifying wafer non-uniformities and graphically explore significance |
| US10/452,248 US7738693B2 (en) | 2002-12-24 | 2003-05-30 | User interface for wafer data analysis and visualization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200414395A TW200414395A (en) | 2004-08-01 |
| TWI229914B true TWI229914B (en) | 2005-03-21 |
Family
ID=32045857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092126645A TWI229914B (en) | 2002-09-26 | 2003-09-26 | User interface for quantifying wafer non-uniformities and graphically explore significance |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1543550A2 (fr) |
| JP (1) | JP2006515468A (fr) |
| KR (1) | KR101127779B1 (fr) |
| AU (1) | AU2003299056A1 (fr) |
| TW (1) | TWI229914B (fr) |
| WO (1) | WO2004030083A2 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4290204B2 (ja) * | 2007-02-13 | 2009-07-01 | 東京エレクトロン株式会社 | 基板処理装置の設定操作支援装置，設定操作支援方法，プログラムを記憶する記憶媒体 |
| JP5597056B2 (ja) * | 2010-08-02 | 2014-10-01 | 株式会社キーエンス | 画像測定装置、画像測定方法及び画像測定装置用のプログラム |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5127726A (en) * | 1989-05-19 | 1992-07-07 | Eastman Kodak Company | Method and apparatus for low angle, high resolution surface inspection |
| US6185324B1 (en) * | 1989-07-12 | 2001-02-06 | Hitachi, Ltd. | Semiconductor failure analysis system |
| JP2941308B2 (ja) * | 1989-07-12 | 1999-08-25 | 株式会社日立製作所 | 検査システムおよび電子デバイスの製造方法 |
| US5448399A (en) * | 1992-03-13 | 1995-09-05 | Park Scientific Instruments | Optical system for scanning microscope |
| US5761064A (en) * | 1995-10-06 | 1998-06-02 | Advanced Micro Devices, Inc. | Defect management system for productivity and yield improvement |
| JPH1145919A (ja) * | 1997-07-24 | 1999-02-16 | Hitachi Ltd | 半導体基板の製造方法 |
| JP4006119B2 (ja) * | 1998-11-30 | 2007-11-14 | 株式会社日立製作所 | 回路パターン検査装置、および回路パターン検査方法 |
| JP4206192B2 (ja) * | 2000-11-09 | 2009-01-07 | 株式会社日立製作所 | パターン検査方法及び装置 |
| JP4041630B2 (ja) * | 1998-11-30 | 2008-01-30 | 株式会社日立製作所 | 回路パターンの検査装置および検査方法 |
| US6477685B1 (en) * | 1999-09-22 | 2002-11-05 | Texas Instruments Incorporated | Method and apparatus for yield and failure analysis in the manufacturing of semiconductors |
| JP3996728B2 (ja) * | 2000-03-08 | 2007-10-24 | 株式会社日立製作所 | 表面検査装置およびその方法 |
| JP4526661B2 (ja) * | 2000-06-28 | 2010-08-18 | 株式会社日立製作所 | 検査装置および検査方法 |
| US6586263B2 (en) * | 2000-09-18 | 2003-07-01 | Neuristics Physics Laboratory, Inc. | Correction of overlay offset between inspection layers in integrated circuits |
| US6975754B2 (en) * | 2000-10-26 | 2005-12-13 | Hitachi, Ltd. | Circuit pattern inspection method and apparatus |
-
2003
- 2003-09-24 AU AU2003299056A patent/AU2003299056A1/en not_active Abandoned
- 2003-09-24 KR KR1020057005323A patent/KR101127779B1/ko active IP Right Grant
- 2003-09-24 WO PCT/US2003/030456 patent/WO2004030083A2/fr active Application Filing
- 2003-09-24 JP JP2005501992A patent/JP2006515468A/ja active Pending
- 2003-09-24 EP EP03756878A patent/EP1543550A2/fr not_active Withdrawn
- 2003-09-26 TW TW092126645A patent/TWI229914B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004030083A3 (fr) | 2004-07-15 |
| JP2006515468A (ja) | 2006-05-25 |
| KR101127779B1 (ko) | 2012-03-27 |
| WO2004030083A2 (fr) | 2004-04-08 |
| KR20050084603A (ko) | 2005-08-26 |
| AU2003299056A1 (en) | 2004-04-19 |
| TW200414395A (en) | 2004-08-01 |
| EP1543550A2 (fr) | 2005-06-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |