TWI229914B - User interface for quantifying wafer non-uniformities and graphically explore significance - Google Patents

Abstract

A wafer viewer system is provided for graphical presentation and analysis of a wafer and a wafer series. More specifically, the wafer viewer system includes a graphical user interface for displaying a wafer, graphically selecting regions of the wafer for analysis, performing analysis on the selected regions of the wafer, and displaying results of the analysis.

Description

V. Description of the invention d) 1. [Technical field to which the invention belongs] The present invention relates generally to the evaluation of processed wafers. More specifically, the present invention relates to a system capable of graphically presenting and controlling a wafer evaluation process after processing. 2. [Previous Technology] Semiconductor wafers undergo many processes during the semiconductor manufacturing process. Among them, θ = entry, drawing, last name engraving, removal, and withdrawal. Usually after each treatment = check the sun to determine whether the previous treatment has an acceptable degree of post-treatment error or non-compliance: = completed. Many operational variables (such as fiber, time, gas pressure, concentration, temperature, etc.) of each process implemented on the wafer are recorded so that any changes in any 2M can be quickly identified and potentially correlated when inspecting the wafer1 Now = any processing error or non-uniformity. u Expression :: ί: The prior art methods of unevenness include subjective, textual uniformity as "σ% shape unevenness as" central deep "or azimuth uneven area lower than 3". The central sink is a middleware typically described on a wafer. However, I = the uniformity of the processed wafer strip after removing more material from the surrounding area. ί / 木 / 儿 does not provide a clear, objective, and quantifiable description. The domain is lower than on the wafer = I, and the left side of the wafer is generally described as the left side area on the wafer is as deep as the center. "= t area removes less material Wafer conditions after processing. And quantification ★ Erming = 1, the slow down description on the left cannot provide a clear, objective, U 4 «month non-uniformity. Perform crystal Ξ ί ί ΐ: Description of the nature to provide feedback to correct errors and 'Consistency. 1229914 after treatment non-uniformity can also be used. V. Description of the invention (2) Stated to measure runners, AA & The influence in the process and the non-uniformity after the return examination process: yield, performance parameters, etc.). Becomes less right Therefore, "quote can be successfully implemented, which is not enough to explain the uneven treatment after processing. Step-by-step improvements are based on previous wafer processing operations. In light of the foregoing, there is a need — 3 wafer conditions after processing. ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, and In order to display and analyze the wafer system, including ## . To be clearer and clearer, wafer viewing = as a knife, analysis is performed on selected wafer areas, and analysis results are displayed. N # = @ In one embodiment, a graphical user interface is disclosed to control the analysis of the crystalline stomach. The user interface provides chart selection control to select a region of crystal area = base image for statistical analysis. The user interface is used to perform statistical analysis on selected dipsin statistics. Then present the statistical data to S # 2 2. The display statistics are reproduced when a change in the selected area is read. Using I = In another embodiment, a graphical user interface is revealed to analyze " raw wafer location map data. Wafer Location Map Confirms Etched

Page 7 1229914 V. Description of the invention (3) 2 2 T uniformity profile. The user interface includes a spatial distribution selection to select secondary parent data for the non-uniformity contour. The interface makes it possible to graphically select spatial distribution options, and to graphically identify a region. This area: ,, used for human maternity data. The user interface displays the area's metric, and updates the metric automatically when <, 'then changes to the area's chart confirmation. In one embodiment, a chart user is provided to measure the circle measurement data. This washing m 1 person 1 W Μ 刀 刀 日 日 The measurement surface provides control to select the first group of crystals ^ Control to ϊίί :: θ】 ί; data. The graphical user interface also provides mathematical operations in between. Mathematics 21, and the user interface of the Japanese and Japanese yen measurement data is more inclusive; the circle data-the group results. The chart is in another real result group. And evaluate the collection of wafer measurement data :, map;] =: user interface to manage Select the collection of wafer measurement data. The list allows :: the public to provide control to evaluate the aggregate of wafer measurement data: | the face to provide control to the user interface to display this group evaluation; ty group evaluation results. Chart Dry Steam: m; :: 丄 Reveals a chart user interface for round-robin analysis. The graphical user interface includes controls for adjusting the electron microscope image. Electricity = microscope image. Provide chart measurement control. Temple, chart user interface to mention together the advantages of the following detailed description and accompanying drawings together, by the Bayi I wish the invention will be more clear 1229914

The interface is used to display the crystal κ, Figure L; the selection system includes chart users, such as Japanese yen and Japanese yen, for analysis on the selected Japanese Q field, and displays the analysis results. And revealing a wafer viewing system for chart display in several months. Calling the following # 明 中 ’many specific details are provided in order to provide a thorough understanding of the present invention. However, it is obvious that the present invention can be implemented by a person skilled in the art without some or all m: languages. In addition, it is not described in detail. Processing operations so as not to unnecessarily obscure the present invention. ",,

The preparation diagram is a τ diagram showing a graphical user interface (GUI, graphicai user 10) according to an embodiment of the present invention. The GUI (graphicai user 10). The GUI 10 includes a function menu row 101 and has many users: The activated image can be activated for many tasks. Provide clear wafer / XSEM image 103 to allow the user to clear the wafer or XSEM / TEM image currently loaded. xsem image 1 0 3 provides the processing staff, link 0 port, σ Q +

/ rp Bragg was selected early to present the Clear Wafer and Clear XSEM / TEM options.

Said. Load data / XSEM image 105 is provided to enable the user to load data on wafer a, Yen 2, or XSEM / TEM images. Load data / XSEM image 105 provides a pull-down menu to present wafer a, wafer B / or fSEM / TEM image options for loading data. In one embodiment, the wafer viewer can read the output file from the measurement tool without intermediate processing. In this embodiment, the 'wafer viewer' identifies the file format by the associated file extension. For example, ′ can be identified by a wafer viewer from measurement tools such as Hitachi CD SEM, KLA — Tencor CD SEM,

1229914 V. Description of the invention (5)

Output files of Optiprobe Ellipsometer, Rudolph Ellipsometer, F5x Cree Company (Ellipsometer and Scatterometer Type), and Nova Scatterer. Same wafer viewer can load user-defined files. In addition to loading data for individual wafers and XSEM / TEM images, the wafer viewer also supports loading files that contain data for individual or multiple wafers or measurements for specific wafers. Provide the stored file image 107 so that the user's stored data corresponds to the wafer presented by the project. In one embodiment, the stored file image 〇07 provides a pull-down menu to present options for storing wafer data, diameter data, or optical profile data. Provide print image 109 to enable users to print wafer reports. In one embodiment, the wafer report includes a header (including wafer name, date, number of positions, etc.), a set of wafer statistics (average, three standard deviations, full distance, maximum, minimum), current A wafer location map displayed by the wafer viewer, a set of cross sections ^ (mean, three standard deviations, full distance, maximum, minimum), and a cross section chart currently displayed by the wafer viewer. K For copying to the clipboard image 1〗 1 to enable the user to copy data to the virtual clipboard for transfer to other applications. In one embodiment, the copy to clipboard image 111 provides a pull-down menu to present that it can be copied to Virtual Clip, many data options. For example, in one embodiment, the pull-down menu can include location map, scale, and statistics options, wafer location map options, color scale options, diameter options, radial chart options, azimuth Graph options, and XSEM / optical contour graphics options. Provides restoration of deleted wafer position images 丨 3 to enable users to restore the previous

Page 10 1229914 V. Description of the invention (6) The position of the deleted wafer. In one embodiment, the undocked wafer position image 1 1 3 is provided with a pull-down menu to present the last click option and all click options. Selecting the Last Point option will restore the last wafer position deleted. Selecting all options will restore all previously deleted wafer locations. A wafer set management image 115 is provided to enable a user to create and manage a wafer set. A wafer set represents a collection of multiple data sets for many wafers with a common data measurement location pattern. In addition to the data set, the wafer set also includes associated wafer IDs, dates, and notes. In one embodiment, the number of wafers in the wafer set may have different position patterns. However, in this embodiment, the first wafer in the wafer set will determine the main position pattern for the entire wafer set. Therefore, the remaining wafers in the wafer set have their data inserted to conform to the primary position pattern. For example, if a wafer with a deleted position is added to the wafer set, the data value is inserted into the deleted position. In addition, this embodiment avoids the problem of analyzing a set of wafers including wafers having different excluded areas of edges and / or measurement data from different measurement tools (ie, having different measurement position patterns). In one embodiment, the wafer set management image 1 1 5 provides a pull-down menu to present many wafer set management options. Options include adding wafers to the collection, deleting a wafer from the collection, creating a collection from a batch of wafers, creating a collection from all wafer batch properties, inserting a wafer into the collection, and storing changes to the wafer collection . The option to create a collection from a batch of wafers allows the user to create a wafer collection from a file containing common types of data for multiple wafers. The option to create a collection from all wafer batch properties allows users to simultaneously create multiple wafer sets from files containing many types of data for multiple wafers

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Together. Separate wafer sets can be created for the number of each data type. The wafer set of each sub-section will contain the corresponding data for each of the multiple wafers. A help image 1 2 9 is provided so that the user can get assisted operation CU 11 〇. In one embodiment, the help image 129 provides a pull-down menu to present 'options' for general help or assistance in file input format. Provide an email technical support image 1 3 1 to enable the user to send an email to the designated GUI 10 technical support email address. Startup electronic support image 1 3 1 Automatically expands a new email preparation object resident in the host computer system. _ ^ // 作 电子 巧 110. In one embodiment, the help image 129 provides a pull-down menu to present options for general help or a file input format to help provide the image 1 3 3 to enable the user to obtain information about the wafer viewer system. News. In one embodiment, About Image 1 33 provides a pull-down menu to present options for information about the wafer viewer system or visit the website of the wafer viewer system. Select the website to visit the wafer viewer system :: option to automatically display the web browser resident in the host computer system, the system, and navigate to the pre-designated wafer viewer system web page. _ Provide a registration image 135 to enable the user to register the wafer viewer system. : In one embodiment, the registration of the wafer viewer system is used as security to control the distribution A to install the wafer viewer system on the host computer system. Enclosed, car, startable image, function menu line 101 "knife analysis image 117, straight / bar graph image 119, azimuth / radial distribution image 121, XSEM / contour 3 ^

Page 12 1229914 V. Description of the invention (8) ~ " 125- and wafer unfolding page image 127 ^ These other user-startable images will correspond to the corresponding wafer viewer system Features are discussed below. GUI 10 also includes the first wafer identification and selection area a? And the second wafer identification and selection area 39. Each of the first and second wafer identification and selection fields (137 and 139) shows a name corresponding to the wafer data set currently loaded for wafer A and wafer B, respectively. In addition, for each of the first and second, the circle identification and selection fields (137 and 139) provide pull function ^ menus to select the available wafer data sets 0 loaded on wafer A and wafer B, respectively. GUI 10 further includes a display control field 141 to enable a user to select wafer data to be displayed and analyzed by the wafer viewer system. In one embodiment, the display control field 141 provides a pull-down menu to present different wafer data set options for display and analysis to be selected. For example, the pull-down function menu can include wafer A, wafer B, (wafer a-wafer b), (wafer A + wafer B), (wafer AX wafer B), (wafer A / crystal Circle B), and [(1 / wafer A) — (1 / wafer B)] and other options. The option selected will determine the wafer data currently being displayed and analyzed by the wafer viewer system. In addition, by using the operator field 143 and the operation field 145, further mathematical operations can be performed on the wafer data selected in the display control field 141. The operator field 143 provides a pull-down menu to display multiplication (X), addition (+), subtraction (one), division (/), power (^), and the wafer to be selected in the display control field 141. Rotate operation on data. The operation field 145 provides a pull-down menu to allow the user to select the number, average, or minimum operation field option. Select the number of shipments

Page 13 1229914 V. Description of the invention (9) Λ allows the user to enter a number in the operation field 145 to be used as the operation field. The remote selection of the average operation field option causes the average value of the wafer data selected in the display control field 141 to be used as the operation field. Selecting the minimum operation field option will cause the minimum value of the selected wafer data in the display control field 141 to be used as the operation field. In operation, indicate the mathematical operation (ie, X, +,-, /, or M will benefit = the operation field entered in the operation domain 145 is performed on the two circle data in the display control field 141. * The result of the mathematical operation Will be used by the wafer viewer system j for display analysis. In the case where the rotation option is selected in the operator field 143, the operation field used in the operation field 145 will be rotated to show the currently selected crystal. G ^ UI 1 〇 also includes the unit field 丨 4 7 to enable the user to select the unit of measurement of the wafer data displayed and analyzed by the current wafer viewer system. In one embodiment, the available measurement units Including Angstrom, Nanometer, Thousand Angstrom, Micro = Two Celsius, Angstrom <minute, Nano / minute, Thousand Angstrom / minute, Micron / knife buckle, and None. Unit field 1 4 7 provides a pull-down menu to present selectable options Many measurement unit options. The seventh describes the loading data for the measurement of wafers or wafers. For such cases, GUI 10 includes internal wafer math selection 149. When selecting within 4 wafer math selection 149 Causes a mathematical operation to be performed on the selected layer or For the measurement data set of special β wafers. The first internal mathematical operation field \ Provides a pull-down menu to allow the user to select the data set to be used as the first operation field in the calculation The second internal number operation field 155 provides a pull-down menu to allow the user to choose

1229914 V. Description of the invention (10) The data set used as the second operation domain in the internal wafer mathematical calculation. The internal math operator field 1 5 3 provides a pull-down menu to allow the user to select the internal math operation (ie, subtraction (~), addition ^ (+), multiplication (X), or division (/)). The selected internal mathematical operation is performed between the corresponding data values of the selected first and second internal mathematical operation domains. The results formed by the selected internal mathematical operations will be used by the wafer-viewing system to display inferior analysis. The GUI 10 further includes a wafer description area 57. In one embodiment, the wafer description area 157 includes a location area 159, an edge area 161, and a size area 163. Location field 丨 59 provides information on the number of data measurement locations in the wafer currently displayed and analyzed. Edge area 丨 6 1 Provides the size of the edge exclusion zone of the wafer currently displayed and analyzed. The size field 丨 63 provides direct control of wafers that are less visible than analysis: size. The GUI 10 further includes a wafer information area 65. In one embodiment, the wafer information area 165 includes a wafer identification symbol field 67, a date field 169, a method field 171, and a comment field 173. Wafer ID field 1 6 7 shows the ID of the wafer currently displayed and analyzed. The date field 1 6 9 shows the date on which the wafer data was loaded or if it was loaded. The Date field 169 also provides a drop-down control which when activated causes a manipulable calendar to appear. Method field 171 shows information about the wafer processing method for currently loaded wafer data. The annotation field 173 shows annotations for the currently loaded wafer data. Annotation area 1 7 3 has vertical scroll control. Expanded images 1 and 5 also accompany the annotation field 173. When activated, the expanded image 175 causes the annotation field 1 7 3 to be presented in a larger pop-up window. Large pop-up window provides close image

Page 15 1229914 V. Description of the invention (11) The image can be activated to close the pop-up window. The GUI 10 further includes a wafer display area 201 and a space statistics area 301. In one embodiment, the remainder of the GUI is used to display features related to the currently selected analysis method. For example, in Figure 1, the currently selected analysis method is an expanded page. Therefore, the remaining part of the GUI is used to display the wafer data area 401 regarding the spread page analysis method. The selection of wafer data area 401 and other available analysis methods and related features will be described in detail below. 8. FIG. 2 is a schematic view showing a separate view of a wafer display area 201 according to an embodiment of the present invention. The wafer display area 201 includes a wafer display window 215 and a Cartesian coordinate system is defined in the wafer display window 2 15. Place the origin of the Cartesian coordinate system in the center of the wafer display window 215. ^ A wafer image 2 1 7 is displayed in the wafer display window 2 1 5. The wafer shirt image 2 1 7 is centered at the origin of the Cartesian coordinate system defined in the wafer display window 2 丨 5. The wafer image 217 includes the position 219 where the actual data is measured and the related measurement data values. The wafer image 217 also includes a colored or monochrome position map delineated by numerical differences between data measurements. When the user moves and slides on the wafer image 217, the vertical guide 2 23, the horizontal guide 221, and the: body box 225 are displayed at the mouse position. The f box 225 displays a set of Cartesian coordinates and data values corresponding to the mouse. Vertical guide 22 3 and horizontal finger 2 2 1. It can be used with the ruler μ 7 as provided for the lower edge of the wafer display window 2 丨 5 to accurately place the mouse in the ideal position. Said :, the display area-domain 001 also includes color scales 229 corresponding to different colors or shades used to display color or monochrome position maps spread across the two-shirt image 21 7. According to the color scale 229, the change of $ color or shadow is equivalent to the data ^

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5. Description of the invention (12) Changes in size. Provide wafer viewing selection area 231 Yu Yue The circle viewing selection area 231 provides the pull T area. Crystal option. In one embodiment, the second step is to display the color gradient, single color, and one-furnace deviation of the wafer as early as possible. The options include color contour, ^ ^, ^ 229 ^ ^ # ^ ^ Qing Kaibu ::: etc. ^ Use remote selection ^ ^ to determine the difference, the wafer area of similar values. Color Gradient Options Reported by Saul Lokko "Degree 2 9. Color Gradient Options are used to provide more detail than color line options. Monochrome options define color scales ^ ^ I m μ #I is available in wafer images 217 More suitable: black and white: table = format. A standard deviation option shows that the first color is the data value less than j standard deviation, the second color is the data value is within a standard deviation of positive or negative, and the second color is the data The value is greater than one standard deviation. The one standard deviation option is used to display data values that are far from the average. The position value option only shows the actual data measurement position 2 1 9 and related measurement data values. Provides the point density display selection field 233 on the wafer display Within the area 001. Dot density display selection area 2 3 3 Provides a pull-down menu to present the dot density option for defining the insertion grid. In one embodiment, the dot density option includes low (50 points by 50 points). Insert grid), Normal (丨 00 points by 丨 〇00 points to insert the grid), and South (200 points by 200 points to insert the grid). For example, selecting the low option will cause the grid to be inserted by 5 0 uniform width rows and 50 Uniform height column on the wafer is defined within the display window 215. Option to select normal cell lines caused inserted evenly width of 100 rows and 100 columns in the height of the wafer evenly display

Page 17 1229914 V. Description of the Invention (13) —- Window 215 is defined. Selecting the high option will cause the insertion grid to be 200 average sentences wide and 200 uniform heights to be listed in the wafer view window 2 and 5. There will be three numbers and value pairs defined in the insertion grid. Each point is inserted. Therefore, selecting the South option provides the highest insertion resolution, and selecting the Low option provides the lowest insertion resolution. Provide insert selection area 235 in the wafer display area zoie. The Insertion Selection field 235 provides a pull-down menu to present the insertion options for calculating the inserted data values for display according to the selected insertion grid. In one implementation, the m: ί term includes tenderness, normal, and rough. The insertion is based on the distance: minus, producing a weighting function that is proportional to (1 / Γη), where 犷 is the most f: the distance between the 2 and 2M and the position to be inserted, and n is the distance between i'i. Adjustable parameter 1 is at the position where less data is measured; = Conversely, for positions where more data is measured, the soft option sets the value of η equal to 2. Roughness option setting η: Specialize in 4. The positive application item calculates the value of η according to the number of measurement positions of the displayed data. 0-Provides a display position selection of 2 39 in the wafer_display area 201. It can trigger Si 2 9 set selection 239 to display and move the wafer image 217 data measurement location. Provide display value selection 241 in wafer_display area 201. Can trigger display value selection 241 to display and move the wafer image 217 (2). &amp; provide display ruler selection 2 6 3 in crystal display ruler selection 2 6 3 for display and movement

P.18 Within the circled black staff area 201. Can be triggered Wafer display window 2 1 5 Side ruler

1229914 V. Description of Invention (14) Regulate the day. The warning limit area 243 is within the wafer display area 201. The warning limit area 2 4 3 includes a warning limit activation selection 245, an upper warning limit area 247, and a lower warning limit area 249. When the warning limit is activated and the selection 245 is started, the position 219 of each data measurement location having the relevant data value greater than the upper warning limit area 247 value or lower than the lower warning limit area value 249 is emphasized in the wafer image 2 1 7.

A scale limit area 251 is provided in the wafer display area 201. The scale limit area 251 includes a scale limit start selection 253 and a pull-down function menu 259, providing options to establish upper and lower scale limits. The pull-down function menu 259 includes user-supplied options, average percentage options, and three standard deviation options. Selecting the user-supplied option allows the input upscale to be limited to the upper scale limit field 255 and the input downscale to be limited to the lower scale limit field 257. Selecting the Percent of Average option allows the percentage value to be entered in the numeric field 2 6 1. Calculate the upper and lower scale limits as a percentage of the corresponding average. Select the three standard deviation option to establish upper and lower scale limits at three times the standard deviation of the mean. A die layout area 265 is provided in the wafer display area 201. Grain cloth local area 265 includes display grain layout selection 2 67, horizontal grain size area

26 9a, a vertical grain size area 269b, a horizontal grain offset area 271a, and a vertical grain offset area 271b. The horizontal grain size field 269a and the vertical grain size field 269b allow the user to provide a single grain size. The horizontal grain offset area 271a and the vertical grain offset area 271b allow the user to provide the offset of the grain grid lines from the center of the wafer. The wafer display area 201 also includes the wafer statistics area 203. Wafer Statistics

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V. Description of the invention (15) Area 203 displays the average value of 205, the three standard deviation value of 20γ (that is, three times the standard deviation of the average number), and the full range value of 209 (that is, the maximum and minimum values). Difference), the dare value 2 11 and the minimum value 2 1 3 correspond to a set of wafer data that is currently not visible.

The wafer display area 201 also includes an analysis selection area 237. Analysis Selection Field 2 3 7 provides a pull-down menu to present analysis options. In one embodiment, the analysis method options include a cross-section analysis option, a distribution analysis option, an XSEM / profile analysis option, and an expanded page analysis option. Choosing an analysis option causes a set of corresponding features and controls to be displayed in the GUI 100. The characteristics and control of each analysis method option are described below with reference to FIGS. 3 to 3. In FIG. 2, the analysis selection field 237 indicates that the expanded page analysis option is selected. Referring back to FIG. 1, the wafer data area 401 is displayed when the expanded page analysis option is selected. In addition to using the analysis selection field 237, the wafer development page image in the selection 101 in the startup function 27 can also be selected as the analysis page expansion option. , FIG. 3 is a diagram showing a separate view of a wafer data field 401 according to an embodiment of the present invention. Wafer data area 4 〇 1 package '^

The opening page display includes the position operation to input and display the page number L position. There will be X line 409 and Y line 411 to input and display X and γ Cartesian coordinates of the data measurement position in the phase, respectively. Contains the z-line 413 to rotate in and] or display the wafer thickness at the corresponding data measurement position. Enter and / or display data / measurement positions on separate columns. The user can select the header of row 407, row 409, row 411, or row 413 to borrow the data in each row to sort the expanded page display. Continuously select the sort between ascending and descending order of a particular table. Provides vertical roll =

Page 20 1229914 V. Description of the invention (16) Search and expand the page display. At the same time, a 405 is provided which allows the addition of new location options. Enabling the addition of a new location selection 405 allows the user to manually rotate the data of the new data measurement location in the expanded page display. If ^ is allowed to be added, the setting selection 4 0 5 is not activated, and the user cannot rotate or change the data in the expanded page display. Therefore, the expanded page analysis option allows the user to edit data for an existing crystal or enter data for a new wafer. The wafer data area 401 also includes the wafer size selection area 403, which provides a pull-down menu to present wafer size options. In one embodiment, wafer size options include 75mm, 100mm, 25mm, 150mm, 200mm, 300mm, and 450mm diameter wafers. Select a specific wafer size option to adjust the ruler 227 provided at the lower edge of the wafer display window 215. Fig. 4 is a diagram showing when the cross section is selected according to an embodiment of the present invention. For analysis selection area 237, diameter, bar eight, top image 125 can be selected for cross-section analysis options. In the k-selection break analysis option, G U I 1 η 游 -μ # bar area 6〇1. The unambiguous analysis area 501 and the long list: ^ is η. Figure r-type break display "does not cross the area 5 (η 々 early single view according to an embodiment of the present invention. The check area 5 501-523 shows according to a set of cross control ^ also, break display 523. Cross display shows horizontal The cross-section display 523 includes a horizontal cross-section through the center of the wafer. The cross-section display 523 also includes a degree representing the radius from the center of the wafer. The cross-section display 523 shows the wafer production. All functions. &Amp; The changing image provides the cross control group for the distance from the wafer center to allow the user to choose the precise cross section to be displayed. Page 21 1229914 V. Description of the invention (17)

In the switch display 5 2 3. Traverse control group includes angle selection chart control 515, angle value field 517, color selection 51 9 and scale limit synchronization selection 521 ° angle selection chart control 515 and angle value field 5 17 can be used by the user to select the accuracy of the analysis to be performed Cross-section. The user can select and drag a check control line 5 2 5 to obtain the ideal cross section for analysis. The traverse control line 525 is defined as a rotation centered on the center of the angle selection chart control 515. Alternatively, the user can directly input the angle in the angle value field 517 to obtain the ideal cross section for analysis. If you use the angle selection chart control 5 丨 5, the corresponding angle is displayed in the angle value field 5-17. If the angle value is directly input into the angle value field 517, the angle selection chart control 515 is adjusted in response to the input angle value. Use color selection 519 to switch between color cross-line display 5 23 and line graph ^ k-line display 5 2 3. When starting the color selection 5 丨 9, the color scale displayed in the wafer display area 2 01 is also used for the color transversal display 5 2 3. The scale limit synchronization selection 521 is used to synchronize the vertical scale of the transverse display 523 with the scale limit input in the scale limit area 251.

The cross-sectional area 501 also includes the cross-sectional statistical area 503. Crossing the statistical area 50 3 displays the average value of 5 05, the three standard deviation value of 507 (that is, three times the standard deviation of the mean), and the full range value of 5 0 9 (the difference between the maximum and minimum values) The maximum value 5 1 1 and the minimum value 5 1 3 correspond to a set of cross-sections currently selected and displayed by the cross-cut control group. FIG. 6 is a diagrammatically separate view showing a bar graph area 601 according to an embodiment of the present invention. The bar graph area 601 includes a bar graph display 605 and a bar graph data source selection 60 3. The bar graph display 605 can be used to evaluate the Gaussian nature of the wafer data values currently selected and displayed. Bar graph showing 605 packets

Page 22 1229914 V. Description of the invention (18) ί ί = 刖 Bar graph data source Select the bar graph of the data value of 603. : Figure, one-fourth of the standard deviation of the mean of the two bars. Length 1 = 605 also shows the ideal Gaussian distribution of the flat M q «and the private standard deviation 6 0 7 based on the current bar chart data source selection 6 03. Bar chart data source selection A pull-down menu is provided to allow the user to select the data source that generates the bar chart display. In one embodiment, the bar graph data source option includes a data value corresponding to the data measurement position or a data value corresponding to the insertion, where the insertion is defined by the point density selection field 3 3 and the insertion selection field 2 35. FIG. 7 is a diagram showing a GUI 10 when a distribution analysis option is selected according to an embodiment of the present invention. Select the analysis area 237 or azimuth / radiation distribution image 1 2 1 to select the distribution analysis option. When the distribution analysis option is selected, the GUI 10 displays a radiation / angle distribution area 7 (Π. FIG. 8 is a diagram showing a separate view of the radiation / angle distribution area 701 according to an embodiment of the present invention. The radiation / angle distribution area 704 1 Including radiation distribution display 739, angular distribution display hi, a set of radiation and angular distribution display control, radiation distribution statistical area 7 〇3, and angular distribution statistical area 715 〇 Radiation distribution display 7 3 9 shows from the distribution center to the edge of the wafer Wafer thickness chart. The vertical scale of the radiation distribution display 7 3 9 is equivalent to the wafer thickness value. The horizontal scale of the radiation distribution display 7 3 9 is equivalent to the distance from the center of the distribution to the edge of the wafer. The display is controlled by radiation and angular distribution The distribution selection area of the group is 7 2 7. The user can choose to set the distribution center to the geometric center of the wafer or the center of mass of the wafer. The control group is displayed through radiation and angular distribution.

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In the graph distribution control 733, the user can select and drag a radiation distribution control line 7 4 5 to obtain the ideal radiation distribution for analysis: f cloth. The radiation distribution control line 745 is defined as the rotation center 2 with the distribution center selected in the distribution selection area 727 as the main axis. Alternatively, the user can directly input the angle in the angle value field 731 to obtain the ideal radiation distribution for analysis. If the radiation distribution control line 745 is used, the corresponding angle is displayed in the angle value field 73m. If the angle value is directly input into the angle value field 731, the radiation distribution control line 745 is adjusted in response to the input angle value.

The angular distribution display 7 4 1 shows the wafer thickness map around the annular area of the wafer. The angular distribution shows that the vertical scale of 7 4 1 corresponds to the wafer thickness value. The horizontal scale of the angular distribution display 741 is equivalent to the angular distance (that is, 0 degrees to 360 degrees) about the starting point of the center of the distribution. Select field 72γ via distribution,

The user can choose to set the distribution center to the geometric center of the wafer or the mass = center of the wafer. Via the graph distribution control 733, the user can select and drag the first or the% -shaped distribution control line 74 3 to obtain the ideal circular distribution radius for analysis. The circular distribution control line 743 is defined as a radial adjustment of the distribution center selected in the distribution selection area 727. Alternatively, the user can directly enter a radius in the radius value field 729 to obtain the ideal circular distribution for analysis. If a loop is used as the cloth control line 743, the corresponding radius is displayed in the radius value field 729. Enter the radius value directly into the radius value field 729, and the circular distribution control line 7 4 3 adjusts in response to the entered radius value. First, use color selection 735 to switch the radiation distribution display 739 and angle distribution display 741 between the color form and line graph form. When the color selection is activated, the color scale displayed in the wafer display area 201 is also used for radiation analysis.

1229914

V. Description of the invention (20) Color form of cloth display 739 and angle distribution display 741. Similarly, the scale limit synchronization selection 737 is used to synchronize the vertical scale of both the radiation distribution display 739 and the angular distribution display 741 with the scale limit input in the scale limit area 251.统计 The radiation distribution statistics area 703 displays the average value of 705, the three standard deviation value of 707 (three times the standard deviation of the mean), the full range value of 709 (the difference between the maximum and minimum values), and the maximum value. The value 711 and the minimum value 713 correspond to a group of radiation distributions currently selected and displayed by the radiation and angular distribution display control group. Similarly, the angle distribution statistics area 715 shows the mean value 717, two standard deviation values 719 (three times the standard about the mean), full distance values 721 (the difference between the maximum and minimum values), and the maximum value 723. , And the minimum value 725, corresponding to the angle distribution currently selected and displayed by a group of radiation and horn sounds, not controlled. Radiation points ‘$ show a ^ ^ ^ ^ 7 ° 3 ^ ^ ^ ® ^ ^ t 〇 ^ The non-uniformity at a fixed angle across the wafer at 0 ° centered across the wafer. And t; &quot; M715 ^ ^ ^ A. Sincerely, the nonuniformity at a fixed distance from the center of the circular s. FIG. 9 is a diagram showing a GUI 10 when an implementation / contour analysis option according to the present invention is used, and XSEM is a Yokota mirror image. To analyze the selection area 23 7 * XSEM Tian% 'micro XSEM / profile analysis options. #Select listen / round ^ Eight image selection GUi 10 displays XSEM / contour area 801. When analyzing k items,

FIG. 10 is a diagrammatic view showing a separate view of each of the Q regions 801 according to the present invention.也 也 例 乂 别 1 / Contour is very popular in the display area 803 in XSEM

Page 25 1229914

/ Within the contour area 801. You can use it ^ Λ ^ ^ / VCPU User can download data from the function menu column 101 / XSEM image 1Q5 type * person + ISI Μ ΑγπΜ ^ or XSEM / contour area 801 to open the file image 823 Turn on XSEM or give Shi Gang. Tan a_ mVc ^, 屝 Figure 楗 for the file name field 825 to show the visually inconspicuous in XS Ε Μ / the round porch is dry p | Yu ^ ^ ^ ^ 'digging' shoulders in the picture in domain 803 File name%. Known case name field 825 # Media approved one-T- · J. 土 _ ,, &amp; also available for pull function menu, allowed to use

/ u Shi Yi Zi Another picture in ° body is displayed in the XSEM / round display area 803.

A zoom lens selection field 817 is provided to allow the user to select the size of the picture currently displayed in the XSEM / outline display area 803. In one example, the zoom lens selection area 8 丨 7 can be used to magnify the displayed picture up to 2 times its original size. A rotation selection field 819 is provided to allow the user to rotate the picture currently displayed in the XSEM / outline display area 803. The rotary selection field 8 1 9 is used to correct angular errors that occur during the picture currently displayed. An offset selection field 8 21 is provided to allow the user to correct distortions that occur during the shooting of the currently displayed picture. For example, the offset selection field 82 1 is used to correct distortion caused by the movement of the stage during the electron beam scanning when the currently displayed picture is taken. Provide horizontal mover 805 and vertical mover 807 to allow users to move the currently displayed picture to the left, right,

Up, down. The horizontal mover 805 and the vertical mover 807 are used to center the target feature when the zoom lens is magnifying the size of the currently displayed picture. A reset XESM setting button 827 is provided to allow the user to reset the horizontal mover 805, vertical mover 807, zoom lens selection area 817, rotation selection area 819, and offset selection area 821 to system implicit values. A remove XSEM button 829 is provided to allow the user to remove the currently displayed picture from the memory. Provide one

Page 1212 914

Display ^ Yunhui user removes Muli stored in memory; XSEM / outline display area 803 removes all buttons 831 to branch _ μ mouth, outline selection 833 to allow Yundou Yutian to have pictures Display ^ mm U and the user quickly also. Remove the current selection = 二 目 ίϊ Display XSEM selection 83 5 to allow the user to quickly display the selected XSEM picture. Provide the display spindle selection 837. Ϊ · = 4 from the display area 8 ° 3 of the corridor display and remove the horizontal section to move the 8G9 and the second correction mover 811 for correction; measure the distance within the contour display area 8 0 3 Of the scale. A separation selection field 813 is provided to allow the user to specify a value to the first correction: the distance between the motion benefit 809 and the second correction mover 811. After the correction, the user can place the mouse cursor in the 乂 / outline display area 8_ to get: the second flute 9 car seat, equivalent to the position of the mouse cursor relative to the 榼 axis and Vertical axis. The Cartesian coordinate set is presented in the label area 806 next to the mouse cursor titanium position. The user can click the mouse cursor to select the starting position for distance measurement. By keeping the mouse cursor pressed, the user can move the mouse to the end of the distance measurement. The label area 8 06 displayed at the position of the mouse cursor will display the horizontal distance value, vertical distance value, linear distance value, and the linear distance direction and the angle value between the horizontal and vertical axis. The calculated distance in the presentation label area 806 is equivalent to the correction established using the first correction mover, 809 first branch positive mover 811, and correction distance selection field 813. In addition, the user can double-click the mouse cursor at the desired position to drop a group of marked lines at the desired position in the XSEM / outline display area 803. In one embodiment, the XSEM / profile analysis option allows the user to override

1229914

V. Description of the invention (23) Cover the profile 808 created by the result of the profile parameters on the XSEM picture displayed in the XSEM / wheel_display area 803. As mentioned above, using the display wheel temple selection 8 3 3 can turn the contour 8 0 8 display on and off. FIG. 11 is a diagram showing a GUI 10 when a continuous analysis option is selected according to an embodiment of the present invention. The continuous analysis image 117 may select a continuous analysis option. When the continuous analysis option is selected, the GUI 10 displays a continuous drawing area 901. Figure 12 is a graphical display + 4 4

Separate view of domain 001. For example, according to the invention / invention continuous drawing area of one embodiment, the wafer set represents the multiple sets of data sets of the wafer on the wafer set management image, and many common measurement modes of the data can represent the process. The database, and the two are determined by the wafer processing process. The wafer set process control) sequence ^ process control (SPC, statistical data library, multiple data-level V-person or tool comparison sequence, etc.) In the sequence, multiple sets of numbers represent the results in different processing conditions. The set of social data obtained by the same process in the tool represents the set of the same work group in different temples. It represents the set of non-aligned sequences. In the wafer assembly; the result of the same process.

At the same time, the data components of multiple data are displayed and analyzed. In one embodiment, spatially resolved statistics can be calculated based on the combination. In group. The average number of wafers can be calculated; = The average wafer data is calculated based on the set of groups. Wafer data set, full distance: page display and analysis. Similarly, the 'three standard deviation small value data set is based on multiple: data set, maximum data set, and analysis. Sets of £ data sets are calculated and can be displayed and divided

1229914

V. Description of the invention (24) The U drawing area 901 displays the continuous drawing display area 903 regarding the currently loaded f-continuous drawing area 901 included in the wafer set. Root, a lot of 囫, number 9G9, data source selection 911, and :: skin selection 907, continuous drawing display 90 3 depiction. Continuous drawing; 1 choose 913 will choose the number of two rounds. : Amount == =: month bk early U allows the user to select the average value, the standard deviation of the second pull force with respect to the average value, the full range value (that is,? (That is, three times the dip blue, η I, whichever is the larger value and the smallest value) The maximum value, or minimum value. The sequence order selection 9U provides the following =; single to allow the user to choose the number of wafers or the date of the wafer in order to arrange the crystal solid second continuous drawing display 903. The chart style selection 907 provides the following Pull work = I to allow the user to select the line + circle format, line format, circle format, or bar format for continuous drawing display 903. In addition, for data, select 91 1 provides a pull function menu to allow the user Select a data point group for calculating the number of different selections 9 0 9. In one embodiment, the 'data point group may be all wafer data points, a spatial black area in the spatial statistical area 3, or a spatial statistical area The spatial white area in 30.1. The spatial black and white areas in the spatial statistical area 3 01 are described below. The spatial control area 3 0 1 is provided. The display control limit selection 9 3 1 is provided to allow the user to display the control limit at even The continuation graph is shown on 903. The control limit selection 915 provides the user with a pull-down menu to select the control limit. In one embodiment, the control limit options include 1.5, 2.5, 3, 3.5, and 4 standard deviations ( Ie the standard deviation of the mean). A moving average option of 929 is also provided to allow use

Page 29 1229914 V. Description of the invention (25) The average of the moving average and the control limit on the selection of the average is shown on the continuous plot display 903. -In one embodiment, the user can select a wafer by continuous mapping display 903 and display the corresponding wafer data in the wafer display window 2 j 5. In another embodiment, the user can activate the movie button 9 3 3 in the continuous drawing area 901 to automatically and continuously display each wafer data set in the wafer set in the wafer display window 2 15. The continuous graphing area 901 also includes the continuous statistical area 9 丨 7. The continuous statistical area 917 shows the average value of 919, three standard deviation values of 921 (three times the standard deviation of the mean), full range value of 923 (the difference between the maximum value and the maximum value), maximum value of 925, and minimum value 927, corresponding to the currently loaded wafer set and data source selection 9 1 1. FIG. 13 is a diagrammatically separate view showing a spatial statistical area 301 according to an embodiment of the present invention. The spatial statistics area 301 includes a space control to graphically select a wafer area to be statistically analyzed. Spatial distribution selection 305 provides users to pull down the function menu to select the type of spatial distribution to be used in the space control 303. In one embodiment, a user-to-edge spatial distribution is provided. Selecting the center-to-edge spatial distribution allows the user to select and drag a control line 3 3 5 to get the ideal center-to-edge area for analysis. The center-to-edge area is defined as extending from the wafer center to the control line 335. The center-to-edge area is called a black area for statistical analysis purposes. The rest of the circle area center to the other side of the edge area is for statistical analysis purpose = it is called white area. The center-to-edge embodiment further includes a radius display area 307 to display a half-rear distance from the center of the wafer to the control line 3 35. '1229914 V. Description of the invention (26) Generally speaking, a set of data measurement points Zi at the position (&amp;,%) are provided across the wafer defined by x2 + y2 <two R2, where R is the radius of the wafer. The entire wafer statistics are based on the inclusion of all points Zi. Alternatively, the space control 303 allows the user to obtain statistics on the sub-areas (ie, black and white areas) of the wafer. The statistics of each sub-region are calculated based on the data points &amp; included only in each sub-region.

The spatial statistical area 3 0 1 further includes the black statistical area 3 9. The black area statistics area 309 shows an average value of 3n, a three standard deviation value of 313 (that is, twice the standard deviation of the mean), a full range value of 315 (the difference between the maximum and minimum values), the maximum value of 3, 7, And the minimum value 3 丨 9 corresponds to the black area about the currently selected center to edge area. In addition, the black area statistics area 3 0 9 includes a position display 3 2 1 to present many data measurement positions contained in the selected black area. When the user adjusts the control line 3 3 5 that defines the selected center to the edge area, the statistics presented in the black area statistics area 3 0 9 are automatically recalculated.

The spatial statistical area 301 further includes a white area statistical area 323. White area statistics area 32 3 shows the average value 3 25, three standard deviation values 32 7 (that is, three times the standard deviation of the mean), full range value 329 (the difference between the maximum and minimum values), and the maximum value 331 , And the minimum value 333 correspond to the white area from the center to the edge area selected with respect to the target W. In addition, the white area statistics area 323 includes a position display 335 to present a number of data measurement positions contained in the selected white area. When the user adjusts the control line 3 35 that defines the selected center to the edge area, the statistics presented in the white area statistics area 323 are automatically recalculated.

Page 31 1229914 Jade and invention description (27) The spatial statistical area 301 further includes a mass center area 343. Mass center area 3 4 3 shows a set of polar coordinates corresponding to the mass center of the wafer. The polar coordinate set includes a radius display 345 and an angle display 347 to confirm the center of mass position of the wafer. The mass center indicator 3 4 1 is also displayed in the space control 3 0 3. Fig. 14 is a separate view diagrammatically showing a spatial statistical region 301 with edge-to-edge spatial distribution selection according to an embodiment of the present invention. In the embodiment of [4], the edge-to-edge spatial distribution is selected in the spatial distribution selection 30 5. Select the edge-to-edge spatial distribution to change the spatial control from 303 to the edge-to-edge control. The edge-to-edge control allows the user to select and drag a control line 337 to obtain the desired analysis area. The edge-to-edge area is defined to cover half of the wafer with a boundary 1_ extending through the center of the wafer. By adjusting the control line 3 3 7, the user can rotate the edge-to-edge area around the center of the wafer. The value presented in the black area statistics area 309 corresponds to the selected edge-to-edge area. Values presented in the white area statistics area. The values in field 3 23 correspond to the remaining area of the selected edge-to-edge area. The edge-to-edge embodiment further includes an angle display area 331 to display the angle of the control line 33? Position with respect to the center of the wafer. Also in the edge-to-edge embodiment, the mass center area 3 4 3 shows that the polar coordinate group corresponds to the center of mass of the wafer. FIG. 15 is a separate view schematically showing a spatial statistical area 3 0 1 having a circular space and a distribution selection according to an embodiment of the present invention. In the example of Fig. 15 in the spring, "annular space distribution is selected in the space distribution selection 30 5". The selection of the spatial distribution changes the spatial control from 303 to the circular control. The loop control allows the user to select and drag a control line 339 to obtain the desired loop area for analysis. The ring region is defined as a ring about the center of the wafer. By adjusting the fJ line 3 3 9 ′, the user can move the ring region toward or away from the wafer center.

1229914 V. Description of the invention (28) The value shown in the black area statistical area 30 9 is equivalent to the circular area of the search. The value shown in the white area statistical area 323 corresponds to the remaining area of the ring area of the piano. The ring-shaped embodiment further includes Toyota ;, select,. . Ding yj \ collar 333 to show the half-way distance a from the center of the wafer to the control line 3 39 a: In the circular embodiment, the mass center area 343 shows a polar pattern. a Same center of mass for the wafer. Although the above embodiments are in mind, it should be understood that the operation of the present invention that can use the "Xi" brain application includes data stored in a computer system. This requires more physical users of physical quantities. Usually, though not necessarily, it can be used as a form of signal that can be saved, transferred, merged, compared, and other applications. Furthermore, the implementation is often referred to as magnetic recognition, decision, or comparison with * '. Produces, indeed forms, any of the operations described in this document that form part of the present invention. The present invention also relates to a device for carrying out such operations. The device is specially constructed for this necessary purpose, or it may be two ‘::’, optionally activated by a computer program stored in a computer or installed. Special, "", two, multi-purpose machines can be used according to the teachings of this article = ^ = ^, or it can be more convenient to build a more specialized operation. Also, the door is designed to carry out the implementation. The present invention can be embodied on a computer-readable medium, which can be read by any data storage device that can store data. 22 Lt computer systems. Examples of computer-readable media include hard disks? = Linked Storage disk, network attached stQrage hard disk, disk, disk memory, random access memory, CD-R0Ms, CD-Rs, ⑶-1229914

Page 34 1229914 Brief description of the drawings V. [Simple description of the drawings] By referring to the following detailed description and accompanying drawings, the present invention and other advantages can be best understood. FIG. 1 is a diagram showing a diagram user interface (6111, 2 [3 port] 11〇 & 111361 'interface) of a wafer viewing system according to an embodiment of the present invention; FIG. 2 is a diagram showing a diagram according to the present invention A separate view of a wafer display area according to an embodiment; FIG. 3 is a separate view showing a wafer data area according to an embodiment of the present invention; FIG. 4 is a diagram showing a cross-sectional analysis when selecting according to an embodiment of the present invention GUI when selecting options; Figure 5 is a schematic view showing a cross-sectional area according to an embodiment of the present invention-separate view; Figure 6 is a schematic view showing a bar graph area according to an embodiment of the present invention; 7 is a diagram showing a GUI when a distribution analysis option is selected according to an embodiment of the present invention; FIG. 8 is a separate view showing a radiation / angle 0 distribution area according to an embodiment of the present invention; FIG. 9 is a diagram A GUI showing an XSEM / profile analysis option according to an embodiment of the present invention is shown in FIG. 10; FIG. 10 is a separate view showing a XSEM / profile area according to an embodiment of the present invention;

Page 35 1229914 Brief description of the diagram FIG. 11 is a diagram showing a GUI when a continuous analysis option is selected according to an embodiment of the present invention; FIG. 12 is a diagram showing a separate area of the continuous analysis diagram according to an embodiment of the present invention Views; FIG. 13 is a separate view showing a spatial statistical area according to an embodiment of the present invention; FIG. 14 is a separate view showing a spatial statistical area having an edge-to-edge spatial distribution selection according to an embodiment of the present invention Views; and FIG. 15 is a separate view schematically showing a spatial statistical area with a circular space distribution selection according to an embodiment of the present invention. Component symbol description: 10 ~ User interface 101 ~ Function menu row 103 ~ Clear wafer / XSEM image 105 ~ Load data / XSEM image 107 ~ Save file image 109 ~ Print image 111 ~ Copy to clipboard Image 113 to restore and delete wafer position image 115 to wafer collection management image 117 to continuous analysis image 119 to diameter / bar graph image 121 to azimuth / radial distribution

P.36 1229914 Brief description of drawings 123 ~ XSEM / outline image 125 ~ bar graph image 1 2 7 ~ wafer spread page image. 1 2 9 ~ help image 1 3 1 ~ email technical support image 1 3 3 ~ about image 1 3 5 ~ registered image 1 3 7 ~ first wafer identification and selection area 1 3 9 ~ second 1 wafer identification and selection area 1 4 1 ~ display control area 143 ~ operator area 145 ~ operation area 1 4 7 ~ unit area 149 ~ internal wafer math selection 151 ~ first internal math operation area 153 ~ internal math operation 155 ~ second internal math operation domain 1 5 7 ~ wafer description area 1 5 9 ~ position area 1 6 1 ~ edge area 1 6 3 ~ size area 1 6 5 ~ wafer information area 1 6 7 ~ crystal Circle identification field 1 6 9 ~ date field

1229914 on page 37 Simple illustration 1 71 ~ Method area 1 7 3 ~ Annotation area 175 ~ Expanded image 201 ~ Wafer display area 2 0 3 ~ Wafer statistics area 2 0 5 ~ Average value 2 0 7 ~ 3 Standard deviation value 2 0 9 to full range value 211 to maximum value 2 1 3 to minimum value 2 1 5 to wafer display window 2 1 7 to wafer image 2 1 9 to actual data measurement position. 221 ~ horizontal guide 223 ~ vertical guide ~ 2 2 5 ~ information box-2 2 7 ~ ruler 229 ~ color scale 231 ~ wafer viewing selection area 2 3 3 ~ dot density display selection area 235 ~ insertion selection area 2 3 7 ~ Analysis selection area 239 ~ Display position selection 241 ~ Display value selection

1229914 on page 38 Brief description of drawings 243 ~ Warning limit area 245 ~ Warning limit activation selection 247 ~ Upper warning limit area 249 ~ Lower warning limit area 2 5 1 ~ Scale limit area 253 ~ Scale limit startup selection 2 5 5 ~ Upscale Limit area 2 5 7 ~ Lower scale limit area 2 5 9 ~ Pull down function menu 2 6 1 ~ Percent value numerical area 263 ~ Display ruler selection 265 ~ Grain layout area 2 6 7 ~ Display grain layout selection 2 6 9 a ~ Horizontal grain size area 2 6 9 b ~ Vertical grain size area 2 71 a ~ Horizontal grain offset area 2 71 b ~ Vertical grain offset area 3 0 1 ~ Spatial statistics area 3 0 3 ~ Spatial control 3 0 5 to spatial distribution selection 3 0 7 to radius display area 3 0 9 to black area statistical area 3 1 1 to average value 3 1 3 to three standard deviation values

1229914 on page 39 Simple illustration of the figure 3 1 5 to full distance value 3 1 7 to the maximum. Large value 3 1 9 to minimum value 3 2 1 to position display 323 to white area statistical area 325 to average value 327 to three standard deviations Value 3 2 9 ~ Total value 331 ~ Max_ 3 3 3 ~ Minimum 3 3 5 ~ Control line 3 3 7 ~ Control line 3 3 9 ~ Control line-341 ~ Mass center indicator 343 ~ Mass center area 345 ~ Radius display-347 ~ Angle display 4 0 1 ~ Wafer data area 4 0 3 ~ Wafer size selection area 4 4 0 5 ~ Allows adding new position selection 4 0 7 ~ Position line 409 ~ X line 411 ~ Y line 4 1 3 ~ Z rows

1229914 on page 40 Brief description of the diagram 501 to traverse analysis area 5 0 3 to traverse statistical area 5 0 5 to average value 5 0 7 to three standard deviation values 5 0 9 to full distance value 5 11 to maximum value 5 1 3 ~ Minimum 515 ~ Angle selection chart control 517 ~ Angle value field 519 ~ Color selection 05 2 1 ~ Scale limit synchronization selection 5 2 3 ~ Transverse display 5 2 5 ~ Transverse control line-6 0 1 ~ Long Bar chart area 6 0 3 ~ Bar chart data source selection 6 0 5 ~ Bar chart display-6 0 7 ~ Ideal Gaussian distribution 701 ~ Radiation / angle distribution area 7 0 3 ~ Radiation distribution statistical area ¥ 7 0 5 ~ Average Value 70 7 ~ Three standard deviation value 7 0 9 ~ Total distance value 7 11 ~ Maximum value 7 1 3 ~ Minimum value

1229914 on page 41 Brief description of the diagram 71 5 ~ Angular distribution statistical area 717 ~ Average value 7 1 9 ~ Three standard deviation value 7 2 1 ~ Total distance value 7 2 3 ~ Max value 7 2 5 ~ Minimum value 727 ~ Distribution selection Field 729 ~ Radius value field 731 ~ Angle value field

733 ~ Graph distribution control P 735 ~ Color selection 737 ~ Scale limit synchronization selection 739 ~ Radiation distribution display-7 41 ~ Angle distribution display 7 4 3 ~ Circular distribution control line '7 4 5 ~ Radiation distribution control line-801 ~ XSEM / contour area 8 0 2 to horizontal axis 803 to XSEM / contour display area β 8 0 4 to vertical axis 805 to horizontal mover 8 0 6 to label area 807 to vertical mover 8 0 8 to outline

1229914 on page 42 Brief description of drawings 809 ~ 1st correction mover 811 ~ 2nd correction mover 8 1 3 ~ correction distance selection area 8 1 7 ~ zoom lens selection area 819 ~ rotation selection area 821 ~ offset selection area 8 2 3 ~ Open file image 825 ~ File name field 827 ~ Reset XESM setting button 829 ~ Remove XSEM button · 831 ~ Remove all buttons 833 ~ Show contour selection 835 ~ Show XSEM selection_ 837 ~ Show spindle selection 9 0 1 ~ Continuous drawing area 9 0 3 ~ Continuous drawing display-9 0 β ~ Data value 907 ~ Graph style selection 9 0 9 ~ Number selection 9 11 ~ Data source selection 9 1 3 ~ Sequence order selection 9 1 5 ~ Control Limit selection 9 1 7 ~ continuous statistical area 9 1 9 ~ average value

1229914 on page 43 Brief description of the diagram 921 ~ Three standard deviation value 9 2 3 ~ Total distance value 9 2 5 ~ Maximum value 9 2 7 ~ Minimum value 929 ~ Display moving average selection 9 3 1 ~ Display control limit selection 9 3 3 ~ Video button Φ

Page 44

Claims (1)

1229914 6. Scope of patent application 1 · A chart user interface for controlling wafer position map analysis, including: Provide chart selection control to select the area of the wafer position map for statistical analysis; generate statistical data for the selected area To complete the statistical analysis; display the statistical data of the selected area; and regenerate the statistical data for display when a change in the selected area is detected. 2. For example, the user interface of the chart for controlling the analysis of the wafer position map in the first scope of the patent application, including: Provide a cross-section to analyze the wafer position map. Changes in the area; and statistics when new cross-section positions are detected. 3. If the user interface of the chart used to control the analysis of the wafer position map in item 1 of the patent application scope, further includes: providing chart control to select the radius and angle values of the statistical distribution; and enabling the chart to adjust the radius and The angle value, radius value and angle value define the selected area. 4 · If the user interface of the chart used to control the analysis of the wafer position map in item 1 of the scope of patent application, it further includes: A graphical representation of the center of mass provided for the surface unevenness confirmed in the wafer position map. 5. If the user interface of the map used to control the analysis of the wafer position map is described in item 1 of the scope of patent application, the selected area defines the sub-matrix analysis, which is completed. Page 45 1229914 VI. Scope of patent application The whole body analysis system is the entire wafer. 6 · A graphical user interface for analyzing the data used to generate wafer position_. The wafer position chart is used to confirm the uneven contour of the etched surface. The user interface bread contains: Provides spatial distribution options to select Regarding the sub-maternal data of the uneven surface profile, the sub-maternal data is the eyepiece area of the wafer that is less than the entire wafer surface; the data enabling a specific space to be performed; and the metrics showing this area, The metric is automatically updated at time. 7. The graphical user interface of the data in item 6 of the scope of the patent application, defining secondary data for overlap analysis to confirm changes in the area. 8 • The graphic user interface of the data in item 6 of the patent application scope defines a semicircle, and the semicircle can be changed. 9. The graphical user interface of the data in item 6 of the scope of patent application, which defines a circle, and the circle can be dragged and changed. ~ Public clothing transport partner, table confirmation 'This area is the number of secondary populations. Changes in the chart confirmation area are used to analyze the ring shape of one of the spatial distribution options used to generate the wafer position map, and the ring shape can be changed. One of the spatial distribution options in the analysis used to generate the wafer location map was repositioned to cause one of the spatial distribution options in the confirmation area to be used to generate the wafer location map to be different. The size is to cause the confirmation area m Page 46 1229914 VI. Patent application scope ι — A graphical user interface for analyzing wafer measurement data, including ... Provide a control to select the first set of wafer measurement data; provide A control to select the second set of wafer measurement data; providing a control to perform a mathematical operation between the first set of wafer measurement data and the second set of wafer measurement data, and the mathematical operation to establish a set of results for the wafer data; and Display the result combination of wafer data. 1 1. According to the user interface of the chart for analyzing wafer measurement data in item 10 of the patent application scope, wherein the first group of wafer measurement data and the second group of wafer measurement data represent a common sub-item of wafer measurement data A common subset of wafer measurement data is related to a portion of the wafer. 12. As shown in Figure 11 of the scope of patent application for analyzing wafer measurement data-the table user interface further includes: Providing a subset selection control to select a common subset of wafer measurement data. _13. For example, the user interface of the chart for analyzing wafer measurement data according to item 12 of the scope of patent application, wherein the subset selection control is used to measure the first set of wafer measurement data, the second set of wafer measurement data, and The first and second sets of wafer measurement data are removed from both the specific wafer measurement data. 14. According to the user interface of the chart for analyzing wafer measurement data of item 10 in the scope of patent application, the combination of the results of displaying the wafer data includes displaying the wafer position map, and the wafer location map shows the results of the wafer data. Combined as a function of position on the wafer surface, combining the results of wafer data with different sizes and benefits Page 47 1229914. The scope of patent application uses a 15. — user interface to lift a set of display. 16. According to the collection of the circle to measure 17. 17. According to the collection of the collection 0 color carved for use, including for one Control supply_control evaluation and finalize the appraisal application chart for control data application. Applicable chart for one control 'wafer level or order management and there are: system to select system to advance the results; M increases the set. The profit range table uses a self-measured color scale icon. The graph for evaluating the collection of wafer measurement data uses the selection of the collection of wafer measurement data; the evaluation of the collection of wafer measurement data is used to evaluate the building portfolio. The interface for managing and evaluating wafer measurements in item 15 further includes: or removing the combination of wafer measurement data to or from the interface for managing and evaluating wafer measurements in item 15; It also includes: a group of wafer measurement data to generate wafer measurement data. The group includes multiple wafers of the same type of measurement number 18. If applying for a patent 簕 圚 M c = According to the chart of the collection ;; :: The control package for managing and evaluating the collection of wafer measurements to evaluate the number of wafer measurements-the group option includes an average of 3 to control the amount to be evaluated, and the amount is selected between the small values Full distance, _ standard deviation of the mean, maximum value, and 19. * Minimum of patent application range. According to the chart of the collection, use the items to manage and evaluate the measurement of the wafer. The control of the collection includes =, U, where the number of wafer measurements to be evaluated, and the subset of wafer measurement data to be evaluated. 1229914 VI. Application for Patent Scope Control. The subset of wafer measurement data is a part of the wafer. 2 〇. For example, the user interface of the chart for managing and evaluating the collection of wafer measurement data in item 19 of the scope of the patent application, wherein the control of selecting a subset of wafer measurement data is included in any half of the wafer, from the wafer The option to select wafer measurement data in one of any area where the center can extend outwards, and an optional ring area at any distance from the center of the wafer. 21. A chart user interface for contour analysis, comprising: displaying an electron microscope image; providing control to adjust the electron microscope image; and providing chart measurement control. 22. If the user interface of the chart used for contour analysis is No. 21 in the scope of patent application, it also includes: Provide control to correct the chart measurement control. 2 3 · If the user interface of the chart used for contour analysis in item 21 of the patent application scope includes: Displaying a contour on an electron microscope image. Page 49