TWI226652B - Manufacturing method for TAB tape and layered film for the same - Google Patents

Manufacturing method for TAB tape and layered film for the same Download PDF

Info

Publication number
TWI226652B
TWI226652B TW091116220A TW91116220A TWI226652B TW I226652 B TWI226652 B TW I226652B TW 091116220 A TW091116220 A TW 091116220A TW 91116220 A TW91116220 A TW 91116220A TW I226652 B TWI226652 B TW I226652B
Authority
TW
Taiwan
Prior art keywords
film
tab tape
bonding agent
manufacturing
metal foil
Prior art date
Application number
TW091116220A
Other languages
English (en)
Chinese (zh)
Inventor
Hideaki Okumura
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Application granted granted Critical
Publication of TWI226652B publication Critical patent/TWI226652B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
TW091116220A 2001-07-23 2002-07-22 Manufacturing method for TAB tape and layered film for the same TWI226652B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001221868A JP3854479B2 (ja) 2001-07-23 2001-07-23 Ｔａｂテープの製造方法およびｔａｂテープ用積層フィルム

Publications (1)

Publication Number Publication Date
TWI226652B true TWI226652B (en) 2005-01-11

Family

ID=19055465

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091116220A TWI226652B (en) 2001-07-23 2002-07-22 Manufacturing method for TAB tape and layered film for the same

Country Status (3)

Country Link
JP (1) JP3854479B2 (ja)
KR (1) KR100485270B1 (ja)
TW (1) TWI226652B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110690124A (zh) * 2019-11-14 2020-01-14 江苏上达电子有限公司 一种改善卷边残铜的封装基板制造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4138824B2 (ja) * 2006-07-06 2008-08-27 河村産業株式会社 プラスチックフィルム−導体金属箔積層体の製造方法
KR100797675B1 (ko) * 2007-01-02 2008-01-23 삼성전기주식회사 박형 기판용 이송 지그 부착 테이프
KR100815274B1 (ko) 2007-07-12 2008-03-20 김영준 박막을 이용한 컬러금속스티커 및 이의 제조방법과 이를이용한 휴대용 전자기기
KR100967053B1 (ko) * 2007-12-27 2010-06-29 주식회사 포스코 레이저 가공장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69232894T2 (de) * 1991-03-12 2003-11-20 Sumitomo Bakelite Co Herstellungsverfahren fuer zweischichtenband vom tab-typ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110690124A (zh) * 2019-11-14 2020-01-14 江苏上达电子有限公司 一种改善卷边残铜的封装基板制造方法

Also Published As

Publication number Publication date
KR100485270B1 (ko) 2005-04-25
JP2003037136A (ja) 2003-02-07
JP3854479B2 (ja) 2006-12-06
KR20030011562A (ko) 2003-02-11

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MM4A Annulment or lapse of patent due to non-payment of fees