TWD231015S - 基板處理裝置用爐 - Google Patents

基板處理裝置用爐 Download PDF

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Publication number
TWD231015S
TWD231015S TW111303581F TW111303581F TWD231015S TW D231015 S TWD231015 S TW D231015S TW 111303581 F TW111303581 F TW 111303581F TW 111303581 F TW111303581 F TW 111303581F TW D231015 S TWD231015 S TW D231015S
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TW
Taiwan
Prior art keywords
furnace
substrate processing
article
processing equipment
processing device
Prior art date
Application number
TW111303581F
Other languages
English (en)
Chinese (zh)
Inventor
立野秀人
山口天和
木本大幾
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
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Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD231015S publication Critical patent/TWD231015S/zh

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TW111303581F 2022-03-15 2022-07-20 基板處理裝置用爐 TWD231015S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-005266 2022-03-15
JP2022005266F JP1731672S (enrdf_load_stackoverflow) 2022-03-15 2022-03-15

Publications (1)

Publication Number Publication Date
TWD231015S true TWD231015S (zh) 2024-05-01

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Family Applications (1)

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TW111303581F TWD231015S (zh) 2022-03-15 2022-07-20 基板處理裝置用爐

Country Status (3)

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US (1) USD1053156S1 (enrdf_load_stackoverflow)
JP (1) JP1731672S (enrdf_load_stackoverflow)
TW (1) TWD231015S (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1731671S (enrdf_load_stackoverflow) * 2022-03-15 2022-12-08

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD213081S (zh) 2020-06-15 2021-08-01 日商東京威力科創股份有限公司 半導體製造裝置用反應管（一）

Family Cites Families (27)

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Publication number Priority date Publication date Assignee Title
USD406113S (en) * 1997-01-31 1999-02-23 Tokyo Electron Limited Processing tube for use in a semiconductor wafer heat processing apparatus
NL1005963C2 (nl) * 1997-05-02 1998-11-09 Asm Int Verticale oven voor het behandelen van halfgeleidersubstraten.
TWD127410S1 (zh) * 2007-04-20 2009-02-11 東京威力科創股份有限公司 半導體製造用製程管
TWD143034S1 (zh) * 2008-03-28 2011-10-01 東京威力科創股份有限公司 半導體製造用處理管
USD610559S1 (en) * 2008-05-30 2010-02-23 Hitachi Kokusai Electric, Inc. Reaction tube
USD725053S1 (en) * 2011-11-18 2015-03-24 Tokyo Electron Limited Outer tube for process tube for manufacturing semiconductor wafers
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
TWD167986S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
TWD167985S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
USD739832S1 (en) * 2013-06-28 2015-09-29 Hitachi Kokusai Electric Inc. Reaction tube
TWD168774S (zh) * 2013-06-28 2015-07-01 日立國際電氣股份有限公司 反應管之部分
TWD167987S (zh) * 2013-06-28 2015-05-21 日立國際電氣股份有限公司 反應管之部分
JP1535455S (enrdf_load_stackoverflow) * 2015-02-25 2015-10-19
JP1546345S (enrdf_load_stackoverflow) * 2015-09-04 2016-03-22
JP1546512S (enrdf_load_stackoverflow) * 2015-09-04 2016-03-22
JP1548462S (enrdf_load_stackoverflow) * 2015-09-04 2016-04-25
JP1568553S (enrdf_load_stackoverflow) * 2016-02-12 2017-02-06
JP1568552S (enrdf_load_stackoverflow) 2016-02-12 2017-02-06
JP1563524S (enrdf_load_stackoverflow) * 2016-03-30 2016-11-21
JP1582475S (enrdf_load_stackoverflow) * 2016-10-14 2017-07-31
JP1605461S (enrdf_load_stackoverflow) * 2017-08-10 2021-05-31
JP1605462S (enrdf_load_stackoverflow) * 2017-08-10 2021-05-31
JP1605982S (enrdf_load_stackoverflow) * 2017-12-27 2021-05-31
JP1611565S (enrdf_load_stackoverflow) * 2018-02-27 2018-08-20
JP1620676S (enrdf_load_stackoverflow) * 2018-02-27 2018-12-17
JP1644260S (enrdf_load_stackoverflow) * 2019-03-20 2019-10-28
JP7317912B2 (ja) * 2021-09-21 2023-07-31 株式会社Kokusai Electric 炉口部構造、基板処理装置、および半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD213081S (zh) 2020-06-15 2021-08-01 日商東京威力科創股份有限公司 半導體製造裝置用反應管（一）

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JP1731672S (enrdf_load_stackoverflow) 2022-12-08
USD1053156S1 (en) 2024-12-03

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