TWD217572S - Deposition ring for a semiconductor processing chamber - Google Patents

Deposition ring for a semiconductor processing chamber Download PDF

Info

Publication number
TWD217572S
TWD217572S TW110300413F TW110300413F TWD217572S TW D217572 S TWD217572 S TW D217572S TW 110300413 F TW110300413 F TW 110300413F TW 110300413 F TW110300413 F TW 110300413F TW D217572 S TWD217572 S TW D217572S
Authority
TW
Taiwan
Prior art keywords
semiconductor processing
processing chamber
deposition ring
design
deposition
Prior art date
Application number
TW110300413F
Other languages
Chinese (zh)
Inventor
基倫古莫妮拉珊卓拉 沙芬戴亞
宋佼
大衛 鞏特爾
伊蓮娜H 維索卡
智東 詹
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD217572S publication Critical patent/TWD217572S/en

Links

Images

Abstract

【物品用途】;本設計所請求係用於半導體處理腔室的沉積環。;【設計說明】;無。【Use of article】;This design is requested to be used in a deposition ring for semiconductor processing chambers. ;[Design description];None.

Description

用於半導體處理腔室的沉積環 Deposition Rings for Semiconductor Processing Chambers

本設計所請求係用於半導體處理腔室的沉積環。 The design claims are for a deposition ring for a semiconductor processing chamber.

TW110300413F 2020-07-31 2021-01-25 Deposition ring for a semiconductor processing chamber TWD217572S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/744,882 USD933726S1 (en) 2020-07-31 2020-07-31 Deposition ring for a semiconductor processing chamber
US29/744,882 2020-07-31

Publications (1)

Publication Number Publication Date
TWD217572S true TWD217572S (en) 2022-03-11

Family

ID=78069701

Family Applications (2)

Application Number Title Priority Date Filing Date
TW110304099F TWD217686S (en) 2020-07-31 2021-01-25 Deposition ring for a semiconductor processing chamber
TW110300413F TWD217572S (en) 2020-07-31 2021-01-25 Deposition ring for a semiconductor processing chamber

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW110304099F TWD217686S (en) 2020-07-31 2021-01-25 Deposition ring for a semiconductor processing chamber

Country Status (3)

Country Link
US (1) USD933726S1 (en)
JP (2) JP1704604S (en)
TW (2) TWD217686S (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1646505S (en) * 2018-12-07 2019-11-25
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD989012S1 (en) 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
CA210024S (en) * 2022-01-31 2023-07-28 Hamilton Kent Inc Gasket
JP1742710S (en) 2022-04-04 2023-04-24 Baffles for anti-rotation process kits for substrate processing chambers

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD187824S (en) 2016-04-14 2018-01-11 應用材料股份有限公司 A composite edge ring

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5803977A (en) 1992-09-30 1998-09-08 Applied Materials, Inc. Apparatus for full wafer deposition
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
USD403337S (en) * 1997-08-05 1998-12-29 Applied Materials, Inc. High conductance low wall deposition upper shield
USD403334S (en) * 1998-01-27 1998-12-29 Semiconductor Equipment Technology, Inc Shield and cover for target of sputter coating apparatus
USD401252S (en) * 1998-01-27 1998-11-17 Semiconductor Equipment Technology Shield and cover for target of sputter coating apparatus
USD403002S (en) * 1998-01-27 1998-12-22 Semiconductor Equipment Technology, Inc. Shield and cover for target of sputter coating apparatus
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US7670436B2 (en) 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US8133368B2 (en) * 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
US9181619B2 (en) * 2010-02-26 2015-11-10 Fujifilm Corporation Physical vapor deposition with heat diffuser
USD649986S1 (en) * 2010-08-17 2011-12-06 Ebara Corporation Sealing ring
WO2012024061A2 (en) 2010-08-20 2012-02-23 Applied Materials, Inc. Extended life deposition ring
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
JP1438319S (en) * 2011-09-20 2015-04-06
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD694340S1 (en) * 2012-01-31 2013-11-26 Laporte Holding Target
US20150357169A1 (en) * 2013-01-04 2015-12-10 Tosoh Smd, Inc. Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
FR3002242B1 (en) * 2013-02-21 2015-04-03 Altatech Semiconductor CHEMICAL VAPOR DEPOSITION DEVICE
USD705280S1 (en) * 2013-07-11 2014-05-20 Ebara Corporation Sealing ring
USD738451S1 (en) * 2014-11-11 2015-09-08 Mary Olson Golf ball target for chipping and putting
USD767234S1 (en) * 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD181136S (en) 2015-05-29 2017-02-01 應用材料股份有限公司 Portion of retaining ring
JP1546800S (en) * 2015-06-12 2016-03-28
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
TWD178424S (en) * 2016-01-08 2016-09-21 ASM知識產權私人控股有&#x9 Gas flow control plate for semiconductor manufacturing apparatus
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
CN110892502B (en) * 2017-06-01 2022-10-04 欧瑞康表面处理解决方案股份公司普费菲孔 Target assembly for safe and economical evaporation of brittle materials
USD851613S1 (en) * 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD187824S (en) 2016-04-14 2018-01-11 應用材料股份有限公司 A composite edge ring

Also Published As

Publication number Publication date
JP1708687S (en) 2022-03-01
TWD217686S (en) 2022-03-11
JP1704604S (en) 2022-01-13
USD933726S1 (en) 2021-10-19

Similar Documents

Publication Publication Date Title
TWD217572S (en) Deposition ring for a semiconductor processing chamber
TWD215402S (en) Deposition ring for a substrate processing chamber
TWD207532S (en) Deposition ring for pvd chamber
TWD210127S (en) A collimator for use in a physical vapor deposition (pvd) chamber
TWD224691S (en) Collimator for use in a physical vapor deposition (pvd) chamber
TWD215442S (en) Ring
TWD211020S (en) Filter
TWD213399S (en) Susceptor shaft
TWD217045S (en) Susceptor support
TWD218919S (en) Cover ring for use in semiconductor processing chamber
TWD218413S (en) Ring
TWD217835S (en) tire
TWD221621S (en) Jewelry
TWD228655S (en) Deposition ring of a process kit for semiconductor substrate processing
TWD227852S (en) Grounding ring of a process kit for semiconductor substrate processing
TWD227251S (en) Substrate support for a substrate processing chamber
TWD226236S (en) Support ring for an interlocking process kit for a substrate processing chamber
TWD223508S (en) Candle jar
TWD217590S (en) Ring
TWD229440S (en) Ring 9
TWD229439S (en) Ring 8
TWD222868S (en) Ring
TWD229179S (en) Bicycle
TWD226237S (en) Sliding ring for an interlocking process kit for a substrate processing chamber
TWD220493S (en) Ring ⅳ