TWD227251S - Substrate support for a substrate processing chamber - Google Patents

Substrate support for a substrate processing chamber Download PDF

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Publication number
TWD227251S
TWD227251S TW111303298F TW111303298F TWD227251S TW D227251 S TWD227251 S TW D227251S TW 111303298 F TW111303298 F TW 111303298F TW 111303298 F TW111303298 F TW 111303298F TW D227251 S TWD227251 S TW D227251S
Authority
TW
Taiwan
Prior art keywords
substrate
processing chamber
support
substrate processing
design
Prior art date
Application number
TW111303298F
Other languages
Chinese (zh)
Inventor
梁志修
麥可史特林 傑克森
疆 呂
振雄 蔡
松下智治
黃祖濱
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD227251S publication Critical patent/TWD227251S/en

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Abstract

【物品用途】;本設計所請求之基板處理腔室用的基板支撐件係用於在基板處理腔室中支撐基板。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。[Use of article]; The substrate support for the substrate processing chamber requested by this design is used to support the substrate in the substrate processing chamber. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

基板處理腔室用的基板支撐件 Substrate supports for substrate processing chambers

本設計所請求之基板處理腔室用的基板支撐件係用於在基板處理腔室中支撐基板。 The substrate support member for the substrate processing chamber requested in this design is used to support the substrate in the substrate processing chamber.

圖式所揭露之虛線部分，為本案不主張設計之部分。 The dotted line parts revealed in the diagram are the parts that are not designed in this case.

TW111303298F 2022-01-20 2022-07-05 Substrate support for a substrate processing chamber TWD227251S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202229823917 2022-01-20
US29/823,917 2022-01-20

Publications (1)

Publication Number Publication Date
TWD227251S true TWD227251S (en) 2023-09-01

Family

ID=84601223

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111303298F TWD227251S (en) 2022-01-20 2022-07-05 Substrate support for a substrate processing chamber
TW111303301F TWD227252S (en) 2022-01-20 2022-07-05 Substrate support for a substrate processing chamber

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111303301F TWD227252S (en) 2022-01-20 2022-07-05 Substrate support for a substrate processing chamber

Country Status (2)

Country Link
JP (2) JP1733479S (en)
TW (2) TWD227251S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD214316S (en) 2019-08-28 2021-10-01 美商應用材料股份有限公司 Inner shield for a substrate processing chamber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD214316S (en) 2019-08-28 2021-10-01 美商應用材料股份有限公司 Inner shield for a substrate processing chamber

Also Published As

Publication number Publication date
JP1733480S (en) 2022-12-28
JP1733479S (en) 2022-12-28
TWD227252S (en) 2023-09-01

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