TWD228655S - Deposition ring of a process kit for semiconductor substrate processing - Google Patents

Deposition ring of a process kit for semiconductor substrate processing Download PDF

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Publication number
TWD228655S
TWD228655S TW112300435F TW112300435F TWD228655S TW D228655 S TWD228655 S TW D228655S TW 112300435 F TW112300435 F TW 112300435F TW 112300435 F TW112300435 F TW 112300435F TW D228655 S TWD228655 S TW D228655S
Authority
TW
Taiwan
Prior art keywords
semiconductor substrate
substrate processing
process kit
deposition ring
deposition
Prior art date
Application number
TW112300435F
Other languages
Chinese (zh)
Inventor
阿比錫 喬德亨瑞
納塔拉吉 巴斯卡爾饒
愛德恩Ｃ 隋瑞茲
哈里沙 薩蒂亞納拉亞納
迪亞哥拉米羅 彭特索托瑪約
坎尼特 塔克梅爾
穆罕默德坎魯札曼 喬德亨瑞
艾倫恰克羅堤 恰克羅堤
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD228655S publication Critical patent/TWD228655S/en

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Abstract

【物品用途】;本設計所請求之處理套件的沉積環係用於半導體處理。;【設計說明】;無。[Item Usage]; The deposition loop of the processing kit requested by this design is used for semiconductor processing. ;[Design description];None.

Description

用於半導體處理的處理套件的沉積環 Deposition rings for processing suites for semiconductor processing

本設計所請求之處理套件的沉積環係用於半導體處理。 The deposition loop of the process kit requested in this design is for semiconductor processing.

TW112300435F 2022-08-04 2023-02-03 Deposition ring of a process kit for semiconductor substrate processing TWD228655S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/848,746 2022-08-04
US202229848746 2022-08-04

Publications (1)

Publication Number Publication Date
TWD228655S true TWD228655S (en) 2023-11-21

Family

ID=86900371

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112300435F TWD228655S (en) 2022-08-04 2023-02-03 Deposition ring of a process kit for semiconductor substrate processing

Country Status (2)

Country Link
JP (1) JP1747763S (en)
TW (1) TWD228655S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD211225S (en) 2019-08-22 2021-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 Exhaust duct

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD211225S (en) 2019-08-22 2021-05-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 Exhaust duct

Also Published As

Publication number Publication date
JP1747763S (en) 2023-06-30

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