TWD204223S - 電漿處理裝置用接地電極 - Google Patents

電漿處理裝置用接地電極 Download PDF

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Publication number
TWD204223S
TWD204223S TW108305647F TW108305647F TWD204223S TW D204223 S TWD204223 S TW D204223S TW 108305647 F TW108305647 F TW 108305647F TW 108305647 F TW108305647 F TW 108305647F TW D204223 S TWD204223 S TW D204223S
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TW
Taiwan
Prior art keywords
ground electrode
plasma processing
article
processing device
semiconductor wafer
Prior art date
Application number
TW108305647F
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English (en)
Chinese (zh)
Inventor
渡部拓
Original Assignee
日商日立全球先端科技股份有限公司
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Publication of TWD204223S publication Critical patent/TWD204223S/zh

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TW108305647F 2019-03-19 2019-09-18 電漿處理裝置用接地電極 TWD204223S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019005889F JP1646366S (cs) 2019-03-19 2019-03-19
JP2019-005889 2019-03-19

Publications (1)

Publication Number Publication Date
TWD204223S true TWD204223S (zh) 2020-04-21

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ID=68610633

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108305647F TWD204223S (zh) 2019-03-19 2019-09-18 電漿處理裝置用接地電極

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US (1) USD916038S1 (cs)
JP (1) JP1646366S (cs)
TW (1) TWD204223S (cs)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD941371S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD934315S1 (en) 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941372S1 (en) 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265094B1 (en) * 1998-11-12 2001-07-24 Aer Energy Resources, Inc. Anode can for a metal-air cell
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
JP1546800S (cs) * 2015-06-12 2016-03-28
USD830434S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
JP1564934S (cs) * 2016-02-26 2016-12-05
JP1598998S (cs) * 2017-08-31 2018-03-05
JP1598997S (cs) * 2017-08-31 2018-03-05
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber

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Publication number Publication date
USD916038S1 (en) 2021-04-13
JP1646366S (cs) 2019-11-25

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