TWD197110S - 複合密封材 - Google Patents

複合密封材

Info

Publication number
TWD197110S
TWD197110S TW107302678F TW107302678F TWD197110S TW D197110 S TWD197110 S TW D197110S TW 107302678 F TW107302678 F TW 107302678F TW 107302678 F TW107302678 F TW 107302678F TW D197110 S TWD197110 S TW D197110S
Authority
TW
Taiwan
Prior art keywords
view
sectional
article
cross
sealing material
Prior art date
Application number
TW107302678F
Other languages
English (en)
Chinese (zh)
Inventor
Nobuhiro Yoshida
Ippei Nakagawa
Sangho Kim
Original Assignee
日商華爾卡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商華爾卡股份有限公司 filed Critical 日商華爾卡股份有限公司
Publication of TWD197110S publication Critical patent/TWD197110S/zh

Links

TW107302678F 2017-12-01 2018-05-14 複合密封材 TWD197110S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-26882F JP1605776S (enrdf_load_html_response) 2017-12-01 2017-12-01

Publications (1)

Publication Number Publication Date
TWD197110S true TWD197110S (zh) 2019-04-21

Family

ID=62239201

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107302678F TWD197110S (zh) 2017-12-01 2018-05-14 複合密封材

Country Status (2)

Country Link
JP (1) JP1605776S (enrdf_load_html_response)
TW (1) TWD197110S (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1071887S1 (en) 2023-01-31 2025-04-22 Valqua, Ltd. Composite seal for semiconductor manufacturing device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1721756S (ja) 2021-12-23 2022-08-05 シール材

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1071887S1 (en) 2023-01-31 2025-04-22 Valqua, Ltd. Composite seal for semiconductor manufacturing device

Also Published As

Publication number Publication date
JP1605776S (enrdf_load_html_response) 2018-06-04

Similar Documents

Publication Publication Date Title
TWD196951S (zh) 複合密封材
TWD197462S (zh) 半導體製造裝置用密封材
TWD197825S (zh) 半導體製造裝置用密封材
TWD197465S (zh) 半導體製造裝置用密封材
TWD189708S (zh) 複合密封材
USD923159S1 (en) Seal member for use in semiconductor production apparatus
TWD182030S (zh) 行李箱（三）
TWD192693S (zh) 真空吸塵器（五十四）
TWD208041S (zh) 半導體製造裝置用密封材
USD922547S1 (en) Seal members for use in semiconductor production apparatuses
USD794935S1 (en) Boot
TWD192466S (zh) 真空吸塵器（十）
TWD208206S (zh) 半導體製造裝置用密封材
TWD192697S (zh) 真空吸塵器（五十八）
TWD197110S (zh) 複合密封材
TWD189097S (zh) 密封材
TWD195971S (zh) 半導體製造裝置用密封材料
TWD192696S (zh) 真空吸塵器（五十七）
USD783575S1 (en) Audio mixer front face
TWD198591S (zh) 複合密封材
TWD197508S (zh) 複合密封材
USD877089S1 (en) Conduit seal
TWD198424S (zh) 半導體製造裝置用密封材
TWD196569S (zh) 半導體製造裝置用密封材
TWD198911S (zh) 半導體製造裝置用密封材