TWD197110S - Composite seal member - Google Patents
Composite seal memberInfo
- Publication number
- TWD197110S TWD197110S TW107302678F TW107302678F TWD197110S TW D197110 S TWD197110 S TW D197110S TW 107302678 F TW107302678 F TW 107302678F TW 107302678 F TW107302678 F TW 107302678F TW D197110 S TWD197110 S TW D197110S
- Authority
- TW
- Taiwan
- Prior art keywords
- view
- sectional
- article
- cross
- sealing material
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title abstract 4
- 239000003566 sealing material Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 abstract 1
- 238000001312 dry etching Methods 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 abstract 1
- 239000000057 synthetic resin Substances 0.000 abstract 1
Abstract
【物品用途】;本設計物品係一種複合密封材，適合使用於例如CVD或乾蝕刻裝置等半導體製造裝置。如放大參考剖面圖所示，本設計物品之複合密封材係由橡膠製的第1構件與合成樹脂製的第2構件所構成。如本設計物品之使用狀態參考圖所示，本設計物品之複合密封材係插入於例如半導體製造裝置的溝槽使用。;【設計說明】;後視圖與前視圖相同，故省略之。左側視圖與右側視圖相同，故省略之。仰視圖與俯視圖相同，故省略之。;A-A剖面圖係俯視圖中之A-A線處的剖面圖。;B-B放大剖面圖係將A-A剖面圖中之B-B線部分予以放大顯示之圖式。[Use of article]; This designed article is a composite sealing material suitable for use in semiconductor manufacturing equipment such as CVD or dry etching equipment. As shown in the enlarged reference sectional view, the composite sealing material of this design article is composed of a first member made of rubber and a second member made of synthetic resin. As shown in the reference drawing of the use state of this design article, the composite sealing material of this design article is inserted into a trench of a semiconductor manufacturing device, for example. ;[Design Description];The rear view is the same as the front view, so it is omitted. The left view is the same as the right view, so it is omitted. The bottom view is the same as the top view, so it is omitted. ;A-A cross-sectional view is a cross-sectional view along the A-A line in the top view. ;The B-B enlarged cross-sectional view is a diagram that enlarges the B-B line in the A-A cross-sectional view.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-26882F JP1605776S (en) | 2017-12-01 | 2017-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD197110S true TWD197110S (en) | 2019-04-21 |
Family
ID=62239201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107302678F TWD197110S (en) | 2017-12-01 | 2018-05-14 | Composite seal member |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1605776S (en) |
| TW (1) | TWD197110S (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1071887S1 (en) | 2023-01-31 | 2025-04-22 | Valqua, Ltd. | Composite seal for semiconductor manufacturing device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1721756S (en) | 2021-12-23 | 2022-08-05 | sealing material |
-
2017
- 2017-12-01 JP JPD2017-26882F patent/JP1605776S/ja active Active
-
2018
- 2018-05-14 TW TW107302678F patent/TWD197110S/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1071887S1 (en) | 2023-01-31 | 2025-04-22 | Valqua, Ltd. | Composite seal for semiconductor manufacturing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1605776S (en) | 2018-06-04 |
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