TWD208206S - Seal member for use in semiconductor production apparatus - Google Patents
Seal member for use in semiconductor production apparatus Download PDFInfo
- Publication number
- TWD208206S TWD208206S TW108307252F TW108307252F TWD208206S TW D208206 S TWD208206 S TW D208206S TW 108307252 F TW108307252 F TW 108307252F TW 108307252 F TW108307252 F TW 108307252F TW D208206 S TWD208206 S TW D208206S
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- cross
- semiconductor manufacturing
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Abstract
【物品用途】;本物品係一種半導體製造裝置用密封材，適合使用於例如CVD或乾蝕刻裝置等半導體裝置。如顯示本物品之使用狀態的參考圖所示，本物品之半導體製造裝置用密封材係插入設於半導體製造裝置之第1構件的溝部內，而用以將第1構件與第2構件之間密封者。;【設計說明】;後視圖與前視圖相同，故省略之。左側視圖與右側視圖相同，故省略之。;A-A剖面圖係俯視圖中之A-A線處的剖面圖。;B-B放大剖面圖係將A-A剖面圖中之B-B線部分予以放大顯示的圖。[Use of article] This article is a sealing material for semiconductor manufacturing equipment, suitable for use in semiconductor equipment such as CVD or dry etching equipment. As shown in the reference drawing showing the use state of this article, the sealing material for semiconductor manufacturing equipment of this article is inserted into the groove provided in the first member of the semiconductor manufacturing equipment to seal the gap between the first member and the second member. Sealer. ;[Design Description];The rear view is the same as the front view, so it is omitted. The left view is the same as the right view, so it is omitted. ;A-A cross-sectional view is a cross-sectional view along the A-A line in the top view. ;The B-B enlarged cross-sectional view is an enlarged view of the B-B line in the A-A cross-sectional view.
Description
本物品係一種半導體製造裝置用密封材，適合使用於例如CVD或乾蝕刻裝置等半導體裝置。如顯示本物品之使用狀態的參考圖所示，本物品之半導體製造裝置用密封材係插入設於半導體製造裝置之第1構件的溝部內，而用以將第1構件與第2構件之間密封者。 This article is a sealing material for semiconductor manufacturing equipment, suitable for use in semiconductor equipment such as CVD or dry etching equipment. As shown in the reference diagram showing the state of use of this article, the sealing material for the semiconductor manufacturing device of this article is inserted into the groove of the first member of the semiconductor manufacturing device to connect the first member and the second member. Sealer.
後視圖與前視圖相同，故省略之。左側視圖與右側視圖相同，故省略之。 The rear view is the same as the front view, so it is omitted. The left side view is the same as the right side view, so it is omitted.
A-A剖面圖係俯視圖中之A-A線處的剖面圖。 The A-A cross-sectional view is the cross-sectional view at the line A-A in the top view.
B-B放大剖面圖係將A-A剖面圖中之B-B線部分予以放大顯示的圖。 The B-B enlarged cross-sectional view is an enlarged display of the B-B line in the A-A cross-sectional view.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-22472F JP1641319S (en) | 2018-10-12 | 2018-10-12 | |
| JP2018-022472 | 2018-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD208206S true TWD208206S (en) | 2020-11-11 |
Family
ID=67902862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108307252F TWD208206S (en) | 2018-10-12 | 2019-04-02 | Seal member for use in semiconductor production apparatus |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1641319S (en) |
| TW (1) | TWD208206S (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD221187S (en) | 2021-03-01 | 2022-09-21 | 日商華爾卡股份有限公司 | Composite seal |
| TWD237623S (en) | 2024-03-26 | 2025-04-11 | 日商華爾卡股份有限公司 (日本) | Composite sealing material |
| TWD239353S (en) | 2024-05-27 | 2025-07-11 | 日商華爾卡股份有限公司 (日本) | Seal member for use in semiconductor production apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1721756S (en) | 2021-12-23 | 2022-08-05 | sealing material |
-
2018
- 2018-10-12 JP JPD2018-22472F patent/JP1641319S/ja active Active
-
2019
- 2019-04-02 TW TW108307252F patent/TWD208206S/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD221187S (en) | 2021-03-01 | 2022-09-21 | 日商華爾卡股份有限公司 | Composite seal |
| TWD237623S (en) | 2024-03-26 | 2025-04-11 | 日商華爾卡股份有限公司 (日本) | Composite sealing material |
| TWD239353S (en) | 2024-05-27 | 2025-07-11 | 日商華爾卡股份有限公司 (日本) | Seal member for use in semiconductor production apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1641319S (en) | 2019-09-17 |
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