TWD197508S - 複合密封材 - Google Patents
複合密封材Info
- Publication number
- TWD197508S TWD197508S TW107302678D01F TW107302678D01F TWD197508S TW D197508 S TWD197508 S TW D197508S TW 107302678D01 F TW107302678D01 F TW 107302678D01F TW 107302678D01 F TW107302678D01 F TW 107302678D01F TW D197508 S TWD197508 S TW D197508S
- Authority
- TW
- Taiwan
- Prior art keywords
- view
- design
- sectional
- article
- cross
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title abstract 4
- 239000003566 sealing material Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 abstract 1
- 238000001312 dry etching Methods 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 abstract 1
- 239000000057 synthetic resin Substances 0.000 abstract 1
Abstract
【物品用途】;本設計物品係一種複合密封材，適合使用於例如CVD或乾蝕刻裝置等半導體製造裝置。如放大參考剖面圖所示，本設計物品之複合密封材係由橡膠製的第1構件與合成樹脂製的第2構件所構成。如本設計物品之使用狀態參考圖所示，本設計物品之複合密封材係插入於例如半導體製造裝置的溝槽使用。;【設計說明】;本設計係關於第107302678號專利申請案之衍生設計。;後視圖與前視圖相同，故省略之。左側視圖與右側視圖相同，故省略之。仰視圖與俯視圖相同，故省略之。;A-A剖面圖係俯視圖中之A-A線處的剖面圖。;B-B放大剖面圖係將A-A剖面圖中之B-B線部分予以放大顯示之圖式。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-26887F JP1606049S (zh) | 2017-12-01 | 2017-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD197508S true TWD197508S (zh) | 2019-05-11 |
Family
ID=62239747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107302678D01F TWD197508S (zh) | 2017-12-01 | 2018-05-15 | 複合密封材 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1606049S (zh) |
| TW (1) | TWD197508S (zh) |
-
2017
- 2017-12-01 JP JPD2017-26887F patent/JP1606049S/ja active Active
-
2018
- 2018-05-15 TW TW107302678D01F patent/TWD197508S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP1606049S (zh) | 2018-06-04 |
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